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4-1926733-6

产品描述41 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, PRESS FIT AND SOLDER, RECEPTACLE
产品类别连接器    连接器   
文件大小214KB,共3页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
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4-1926733-6概述

41 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, PRESS FIT AND SOLDER, RECEPTACLE

4-1926733-6规格参数

参数名称属性值
Objectid1846652467
Reach Compliance Codeunknown
YTEOL0
主体/外壳类型RECEPTACLE
连接器类型BOARD CONNECTOR
联系完成配合GOLD (30) OVER NICKEL (50)/GOLD (3) OVER PALLADIUM NICKEL (30)
联系完成终止TIN LEAD (20) OVER NICKEL (50)
触点性别FEMALE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e0
MIL 符合性NO
混合触点YES
安装方式RIGHT ANGLE
安装类型BOARD
连接器数ONE
装载的行数5
选件GENERAL PURPOSE
端子节距2 mm
端接类型PRESS FIT/SOLDER
触点总数41
UL 易燃性代码94V-0

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MINIPAK HDL Connectors
DESCRIPTION
Tyco Electronics’ new MINIPAK HDL
connector combines a high density
power interface into a blind-mateable
board-to-board connector, which stands
only 8mm off the edge of the printed
circuit board.
The MINIPAK HDL product consists of a
right angle plug and a right angle receptacle,
which utilizes an eye of the needle tail
that can be used in both solder and
press-fit applications. The contact offers
a current rating of 16 amps, low contact
resistance, and mating forces less than
0.3 pounds per contact.
The connector is designed and manufac-
tured to be mass-customizable, allowing
the customer to select a wide array of
configurations and layouts. MINIPAK HDL
connectors also contain three levels of
mating sequences.
This product is designed specifically for
modular hot-swappable power distribution
systems. The MINIPAK HDL connector
offers 20% more current density in a
smaller package than other products
currently offered in the market.
TECHNICAL DOCUMENTS
Product Specification: 108-2325
Application Specification: 114-13215
FOR MORE INFORMATION
Technical Support
Internet:
http://www.tycoelectronics.com
USA: 1-800-522-6752
Canada: 1-905-470-4425
UK: 44-1908-574289
Japan: 81-44-844-8013
APPLICATIONS
1U servers
High End Servers
Telecommunications Switches requiring
low profile
Hot Pluggable Power Supplies
KEY FEATURES
High Density, low profile, power/signal,
blind-mate connector
Developed to meet next generation 1u
application by reducing airflow impedance
Design is customizable
Serves both solder reflow and press fit
applications with the same contact

 
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