AND Gate, HCT Series, 2-Func, 4-Input, CMOS, CDIP14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Harris |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| 其他特性 | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY |
| 系列 | HCT |
| JESD-30 代码 | R-CDIP-T14 |
| JESD-609代码 | e0 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | AND GATE |
| 最大I(ol) | 0.00005 A |
| 功能数量 | 2 |
| 输入次数 | 4 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 22 ns |
| 传播延迟(tpd) | 20 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | 38535V;38534K;883S |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 总剂量 | 200k Rad(Si) V |
| Base Number Matches | 1 |
| HCTS21DMSR | 7020787000.1 | HCTS21D/SAMPLE | HCTS21HMSR | HCTS21K/SAMPLE | |
|---|---|---|---|---|---|
| 描述 | AND Gate, HCT Series, 2-Func, 4-Input, CMOS, CDIP14 | Fixed Resistor, Wire Wound, 0.5W, 78700ohm, 300V, 0.1% +/-Tol, -10,10ppm/Cel, | AND Gate, HCT Series, 2-Func, 4-Input, CMOS, CDIP14 | AND Gate, HCT Series, 2-Func, 4-Input, CMOS | AND Gate, HCT Series, 2-Func, 4-Input, CMOS, CDFP14 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown |
| 系列 | HCT | 7000(AXIAL) | HCT | HCT | HCT |
| 端子数量 | 14 | 2 | 14 | 12 | 14 |
| 封装形状 | RECTANGULAR | TUBULAR PACKAGE | RECTANGULAR | UNSPECIFIED | RECTANGULAR |
| 封装形式 | IN-LINE | Axial | IN-LINE | UNCASED CHIP | FLATPACK |
| 技术 | CMOS | WIRE WOUND | CMOS | CMOS | CMOS |
| 厂商名称 | Harris | - | Harris | Harris | Harris |
| JESD-30 代码 | R-CDIP-T14 | - | R-CDIP-T14 | X-XUUC-N12 | R-CDFP-F14 |
| 负载电容(CL) | 50 pF | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | AND GATE | - | AND GATE | AND GATE | AND GATE |
| 功能数量 | 2 | - | 2 | 2 | 2 |
| 输入次数 | 4 | - | 4 | 4 | 4 |
| 最高工作温度 | 125 °C | 145 °C | - | 125 °C | - |
| 最低工作温度 | -55 °C | -65 °C | - | -55 °C | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 传播延迟(tpd) | 20 ns | - | 18 ns | 18 ns | 18 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | NO | YES | YES |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | NO LEAD | FLAT |
| 端子位置 | DUAL | - | DUAL | UPPER | DUAL |
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