ProASIC3 Handbook
Table of Contents
Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i
Section I – ProASIC3 Datasheet
ProASIC3 Flash Family FPGAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
ProASIC3 Device Family Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
ProASIC3 DC and Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1
Package Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
Section II – Core Architecture
Low-Power Flash Technology and Flash*Freeze Mode
Core Architecture of IGLOO and ProASIC3 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
Low-Power Modes in Actel ProASIC3/E FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1
Global Resources and Clock Conditioning
Global Resources in Actel Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
Clock Conditioning Circuits in IGLOO and ProASIC3 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
Embedded Memories
FlashROM in Actel’s Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
SRAM and FIFO Memories in Actel's Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1
I/O Descriptions and Usage
I/O Structures in IGLOO and ProASIC3 Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1
I/O Software Control in Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
DDR for Actel’s Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-1
Packaging and Pin Descriptions
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11-1
Design Migration
Migrating Designs in ProASIC3 Devices from Higher-Density to Mid-Density Devices . . . . . . . . . . .12-1
Migrating Designs from A3P250 to Lower-Logic-Density Devices . . . . . . . . . . . . . . . . . . . . . . . . . . .13-1
Table of Contents
Programming and Security
Programming Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-1
Security in Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15-1
In-System Programming (ISP) of Actel’s Low-Power Flash Devices Using FlashPro3 . . . . . . . . . . . . .16-1
Microprocessor Programming of Actel’s Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . .17-1
Boundary Scan and UJTAG
Boundary Scan in Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18-1
UJTAG Applications in Actel’s Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19-1
Board-Level Requirements
Power-Up/-Down Behavior of ProASIC3/E Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20-1
ProASIC3/E SSO and Pin Placement Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21-1
Metastability Characterization Report for Actel Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22-1
Low-Power Flash Device Handbooks Introduction
Low-Power Flash Device Handbooks Introduction
Device Handbooks contain all the information available to help designers understand and use
Actel's devices. Handbook chapters are grouped into sections on the website to simplify
navigation. Each chapter of the handbook can be viewed as an individual PDF file.
At the top of the handbook web page, you will see a zip file for each product family. This file
contains the complete device handbook. Please register for product updates to be notified when a
section of the handbook changes.
Versions
Device handbook chapters may have different version numbers. Actel’s goal is to provide customers
with the latest information in a timely matter. As a result, the handbook chapters will be updated
independently of the handbook.
Categories
In order to provide the latest information to designers, some datasheets are published before data
has been fully characterized. Datasheets are designated as “Product Brief,” “Advanced,” and
“Production”. The definition of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advanced or production) and contains
general product information. This document gives an overview of specific device and family
information.
Advanced
This version contains initial estimated information based on simulation, other products, devices, or
speed grades. This information can be used as estimates, but not for production. This label only
applies to the DC and Switching Characteristics chapter of the datasheet and will only be used
when the data has not been fully characterized.
Unmarked (production)
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations
(EAR). They could require an approved export license prior to export from the United States. An
export includes release of product or disclosure of technology to a foreign national inside or
outside the United States.
Part Number and Revision Date
Part Number 51700094-001-0
Revised January 2008
v1.0
i
Microchip MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
