Flash, 2MX16, 160ns, PBGA80, 8 X 18 MM, PLASTIC, CSP, FBGA-80
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | 8 X 18 MM, PLASTIC, CSP, FBGA-80 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 160 ns |
| 其他特性 | ACCESS TIME 140 NS AT VCC 3.3+/-0.3V |
| 备用内存宽度 | 8 |
| JESD-30 代码 | R-PBGA-B80 |
| JESD-609代码 | e0 |
| 长度 | 18 mm |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 80 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 编程电压 | 2.7 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 类型 | NOR TYPE |
| 宽度 | 8 mm |
| Base Number Matches | 1 |
| LH28F320S3B-L14 | LH28F320S3HB-L14 | LH28F320S3B-L11 | LH28F320S3HB-L11 | LH28F320S3HNS-L14 | LH28F320S3NS-L14 | |
|---|---|---|---|---|---|---|
| 描述 | Flash, 2MX16, 160ns, PBGA80, 8 X 18 MM, PLASTIC, CSP, FBGA-80 | Flash, 2MX16, 160ns, PBGA80, 8 X 18 MM, PLASTIC, CSP, FBGA-80 | Flash, 2MX16, 140ns, PBGA80, 8 X 18 MM, PLASTIC, CSP, FBGA-80 | Flash, 2MX16, 140ns, PBGA80, 8 X 18 MM, PLASTIC, CSP, FBGA-80 | Flash, 2MX16, 160ns, PDSO56, 0.600 INCH, PLASTIC, SSOP-56 | Flash, 2MX16, 160ns, PDSO56, 0.600 INCH, PLASTIC, SSOP-56 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | 8 X 18 MM, PLASTIC, CSP, FBGA-80 | 8 X 18 MM, PLASTIC, CSP, FBGA-80 | 8 X 18 MM, PLASTIC, CSP, FBGA-80 | 8 X 18 MM, PLASTIC, CSP, FBGA-80 | 0.600 INCH, PLASTIC, SSOP-56 | 0.600 INCH, PLASTIC, SSOP-56 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
| 最长访问时间 | 160 ns | 160 ns | 140 ns | 140 ns | 160 ns | 160 ns |
| 其他特性 | ACCESS TIME 140 NS AT VCC 3.3+/-0.3V | ACCESS TIME 140 NS AT VCC 3.3+/-0.3V | ACCESS TIME 110 NS AT VCC 3.3+/-0.3V | ACCESS TIME 110 NS AT VCC 3.3+/-0.3V | ACCESS TIME 140 NS AT VCC 3.3+/-0.3V | ACCESS TIME 140 NS AT VCC 3.3+/-0.3V |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PBGA-B80 | R-PBGA-B80 | R-PBGA-B80 | R-PBGA-B80 | R-PDSO-G56 | R-PDSO-G56 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18 mm | 18 mm | 18 mm | 18 mm | 23.7 mm | 23.7 mm |
| 内存密度 | 33554432 bit | 33554432 bi | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 80 | 80 | 80 | 80 | 56 | 56 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA | TFBGA | TFBGA | SSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 编程电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.85 mm | 1.85 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 13.3 mm | 13.3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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