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AM29LV800BT-80FD

产品描述Flash, 512KX16, 80ns, PDSO48, REVERSE, MO-142DD, TSOP-48
产品类别存储    存储   
文件大小744KB,共44页
制造商SPANSION
官网地址http://www.spansion.com/
标准
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AM29LV800BT-80FD概述

Flash, 512KX16, 80ns, PDSO48, REVERSE, MO-142DD, TSOP-48

AM29LV800BT-80FD规格参数

参数名称属性值
是否Rohs认证符合
厂商名称SPANSION
零件包装代码TSOP1
包装说明REVERSE, MO-142DD, TSOP-48
针数48
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间80 ns
备用内存宽度8
启动块TOP
JESD-30 代码R-PDSO-G48
JESD-609代码e3
长度18.4 mm
内存密度8388608 bit
内存集成电路类型FLASH
内存宽度16
湿度敏感等级3
功能数量1
端子数量48
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP1-R
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)250
编程电压3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
类型NOR TYPE
宽度12 mm
Base Number Matches1

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Am29LV800B
8 Megabit (1 M x 8-Bit/512 K x 16-Bit)
CMOS 3.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
Single power supply operation
— 2.7 to 3.6 volt read and write operations for
battery-powered applications
s
Manufactured on 0.32 µm process technology
— Compatible with 0.5 µm Am29LV800 device
s
High performance
— Access times as fast as 70 ns
s
Ultra low power consumption (typical values at
5 MHz)
— 200 nA Automatic Sleep mode current
— 200 nA standby mode current
— 7 mA read current
— 15 mA program/erase current
s
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
fifteen 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
fifteen 32 Kword sectors (word mode)
— Supports full chip erase
— Sector Protection features:
A hardware method of locking a sector to prevent
any program or erase operations within that sector
Sectors can be locked in-system or via
programming equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
s
Unlock Bypass Program Command
— Reduces overall programming time when issuing
multiple program command sequences
s
Top or bottom boot block configurations
available
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
s
Minimum 1 million write cycle guarantee
per sector
s
20-year data retention at 125°C
— Reliable operation for the life of the system
s
Package option
— 48-ball FBGA
— 48-pin TSOP
— 44-pin SO
— Known Good Die (KGD)
(see publication number 21536)
s
Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting program
or erase operation completion
s
Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
s
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
Publication#
21490
Rev:
G
Amendment/+1
Issue Date:
July 7, 2000
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