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70261L25PFI

产品描述Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
产品类别存储    存储   
文件大小690KB,共20页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

70261L25PFI概述

Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

70261L25PFI规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
针数100
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间25 ns
其他特性INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE
I/O 类型COMMON
JESD-30 代码S-PQFP-G100
JESD-609代码e0
长度14 mm
内存密度262144 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度16
湿度敏感等级3
功能数量1
端口数量2
端子数量100
字数16384 words
字数代码16000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织16KX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP100,.63SQ,20
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源5 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.01 A
最小待机电流4.5 V
最大压摆率0.305 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

文档预览

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HIGH-SPEED
IDT70261S/L
16K x 16 DUAL-PORT
STATIC RAM WITH INTERRUPT
Features
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed access
– Commercial: 15/20/25/35/55ns (max.)
– Industrial 20/25ns (max.)
Low-power operation
– IDT70261S
Active: 750mW (typ.)
Standby: 5mW (typ.)
– IDT70261L
Active: 750mW (typ.)
Standby: 1mW (typ.)
Separate upper-byte and lower-byte control for multiplexed
bus compatibility
IDT70261 easily expands data bus width to 32 bits or more
using the Master/Slave select when cascading more than
one device
M/S = H for
BUSY
output flag on Master,
M/S = L for
BUSY
input on Slave
Busy and Interrupt Flags
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
TTL-compatible, single 5V (±10%) power supply
Available in 100-pin Thin Quad Flatpack
Industrial temperature range (-40
O
C to +85
O
C) is available
for selected speeds
Green parts available. See ordering information
Functional Block Diagram
R/
W
L
UB
L
R/
W
R
UB
R
LB
L
CE
L
OE
L
LB
R
CE
R
OE
R
I/O
8L
-I/O
15L
I/O
0L
-I/O
7L
BUSY
L
(1,2)
I/O
Control
I/O
Control
I/O
8R
-I/O
15R
I/O
0R
-I/O
7R
BUSY
R
(1,2)
A
13L
A
0L
Address
Decoder
14
MEMORY
ARRAY
14
Address
Decoder
A
13R
A
0R
CE
L
OE
L
R/W
L
SEM
L
(2)
INT
L
NOTES:
1. (MASTER):
BUSY
is output; (SLAVE):
BUSY
is input.
2.
BUSY
and
INT
outputs are non-tri-stated push-pull.
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
R
OE
R
R/W
R
SEM
R
INT
R(2)
3039 drw 01
M/S
JUNE 2015
1
©2015 Integrated Device Technology, Inc.
DSC 3039/11

70261L25PFI相似产品对比

70261L25PFI 70261L25PFI8 70261S55PFI 70261L35PFI 70261S35PFI 70261L55PFI
描述 Dual-Port SRAM, 16KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM Dual-Port SRAM, 16KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Multi-Port SRAM, 16KX16, 35ns, CMOS, PQFP100 Dual-Port SRAM, 16KX16, 35ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 16KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code not_compliant compliant not_compliant not_compliant not_compliant not_compliant
最长访问时间 25 ns 25 ns 55 ns 35 ns 35 ns 55 ns
JESD-30 代码 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
内存密度 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM MULTI-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 16 16 16 16 16 16
端子数量 100 100 100 100 100 100
字数 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
字数代码 16000 16000 16000 16000 16000 16000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 16KX16 16KX16 16KX16 16KX16 16KX16 16KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP QFP QFP QFP QFP QFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD
是否无铅 含铅 - 含铅 - 含铅 含铅
是否Rohs认证 不符合 - 不符合 不符合 不符合 不符合
包装说明 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 QFP, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 - 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
ECCN代码 EAR99 - EAR99 EAR99 EAR99 EAR99
I/O 类型 COMMON - COMMON COMMON COMMON COMMON
JESD-609代码 e0 - e0 e0 e0 e0
湿度敏感等级 3 - 3 3 3 3
功能数量 1 1 1 - 1 1
端口数量 2 - 2 2 2 2
输出特性 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE
封装等效代码 QFP100,.63SQ,20 - QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20
峰值回流温度(摄氏度) 240 - 240 - 240 240
电源 5 V - 5 V 5 V 5 V 5 V
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
最大待机电流 0.01 A - 0.03 A 0.01 A 0.03 A 0.01 A
最小待机电流 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V
最大压摆率 0.305 mA - 0.31 mA 0.295 mA 0.335 mA 0.27 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V - 4.5 V 4.5 V
端子面层 Tin/Lead (Sn85Pb15) - Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子节距 0.5 mm - 0.5 mm 0.5 mm 0.5 mm 0.5 mm
处于峰值回流温度下的最长时间 20 - 20 - 20 20

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