SRAM Module, 1MX8, 55ns, MOS
参数名称 | 属性值 |
厂商名称 | ACCUTEK |
包装说明 | , |
Reach Compliance Code | compliant |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 55 ns |
JESD-30 代码 | R-XSMA-T64 |
内存密度 | 8388608 bit |
内存集成电路类型 | SRAM MODULE |
内存宽度 | 8 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 64 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX8 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | MOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子位置 | SINGLE |
Base Number Matches | 1 |
AK681024G-55LL | AK681024G-55L | AK681024G-10L | AK681024G-10LL | AK681024G-70L | AK681024G-85LL | AK681024G-85L | |
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描述 | SRAM Module, 1MX8, 55ns, MOS | SRAM Module, 1MX8, 55ns, MOS | SRAM Module, 1MX8, 10ns, CMOS | SRAM Module, 1MX8, 10ns, CMOS | SRAM Module, 1MX8, 70ns, MOS | SRAM Module, 1MX8, 85ns, MOS | SRAM Module, 1MX8, 85ns, MOS |
厂商名称 | ACCUTEK | ACCUTEK | ACCUTEK | ACCUTEK | ACCUTEK | ACCUTEK | ACCUTEK |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 55 ns | 55 ns | 10 ns | 10 ns | 70 ns | 85 ns | 85 ns |
JESD-30 代码 | R-XSMA-T64 | R-XSMA-T64 | R-XSMA-T64 | R-XSMA-T64 | R-XSMA-T64 | R-XSMA-T64 | R-XSMA-T64 |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | MOS | MOS | CMOS | CMOS | MOS | MOS | MOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | - | - | 1 | 1 | 1 |
输出特性 | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | - | - | YES | YES | YES |
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