H
Intelligent Power Module
and Gate Drive Interface
Optocouplers
Technical Data
HCPL-5300
HCPL-5301
5962-96852
Features
• Performance Specified Over
Full Military Temperature
Range: -55
°
C to 125
°
C
• Fast Maximum Propagation
Delays
t
PHL
= 450 ns,
t
PLH
= 650 ns
• Minimized Pulse Width
Distortion (PWD = 450 ns)
• High Common Mode
Rejection (CMR): 10 kV/
µ
s at
V
CM
= 1000 V
• CTR > 30% at I
F
= 10 mA
• 1500 Vdc Withstand Test
Voltage
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• Hermetically Sealed
Packages
• Dual Marked with Device
Part Number and DESC
Drawing Number
• QML-38534, Class H and K
• HCPL-4506 Function
Compatibility
Applications
• Military and Space
• High Reliability Systems
• Harsh Industrial
Environments
• Transportation, Medical, and
Life Critical Systems
• IPM Isolation
• Isolated IGBT/MOSFET Gate
Drive
• AC and Brushless DC Motor
Drives
• Industrial Inverters
Description
The HCPL-5300/5301 devices
consist of a GaAsP LED optically
coupled to an integrated high
gain photo detector in a
hermetically sealed package. The
Schematic Diagram
1
20 kΩ
2
8
products are capable of operation
and storage over the full military
temperature range and can be
purchased as either standard
product or with full MIL-PRF-
38534 Class Level H or K testing
or from the DESC Drawing 5962-
96852. All devices are
manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DESC
Qualified Manufacturers List
QML-38534 for Hybrid Micro-
circuits. Minimized propagation
delay difference between devices
make these optocouplers excellent
solutions for improving inverter
efficiency through reduced
switching dead time. An on chip
20 kΩ output pull-up resistor can
be enabled by shorting output
pins 6 and 7, thus eliminating the
need for an external pull-up
resistor in common IPM applica-
tions. Specifications and
performance plots are given for
typical IPM applications.
7
Truth Table
3
6
LED
ON
OFF
V
O
L
H
4
SHIELD
5
The connection of a 0.1
µ
F bypass capacitor between pins 5 and 8 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
1-498
5964-9648E
Selection Guide-Package Styles and Lead
Configuration Options
HP Part # and Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
Butt Cut/Gold Plate
Gull Wing/Soldered
SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
5962-
9685201HPX
9685201HPC
9685201HPA
9685201HYC
9685201HYA
9685201HXA
HCPL-5300
HCPL-5301
HCPL-530K
Gold Plate
Option #200
Option #100
Option #300
Outline Drawing
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
1-499
Device Marking
HP LOGO
HP P/N
DESC SMD*
DESC SMD*
PIN ONE/
ESD IDENT
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
HP FSCN*
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead
finish.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly.
This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below
for details). This option has solder dipped leads.
300
5.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
5.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1-500
Absolute Maximum Ratings
Storage Temperature (T
S
) ............................................................................................................. -65 to 150°C
Operating Temperature (T
A
) ......................................................................................................... -55 to 125°C
Junction Temperature (T
J
) ...................................................................................................................... 175°C
Average Input Current (I
F(AVG)
) ............................................................................................................... 25 mA
Peak Input Current (50% duty cycle,
≤
1 ms pulse width) (I
F(PEAK)
) ........................................................ 50 mA
Peak Transient Input Current (<1
µs
pulse width, 300 pps) (I
F(TRAN)
) ..................................................... 1.0 A
Reverse Input Voltage (Pin 3-2) (V
R
) ............................................................................................................ 5 V
Average Output Current (Pin 6) (I
O(AVG)
) ................................................................................................ 15 mA
Resistor Voltage (Pin 7) (V
7
) ......................................................................................................... -0.5 V to V
CC
Output Voltage (Pin 6-5) (V
O
) ........................................................................................................ -0.5 to 30 V
Supply Voltage (Pin 8-5) (V
CC
) ....................................................................................................... -0.5 to 30 V
Output Power Dissipation (P
O
)............................................................................................................. 100 mW
Total Power Dissipation (P
T
) ................................................................................................................ 145 mW
Lead Solder Temperature (soldering, 10 seconds) .................................................................................. 260°C
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-5300/5301 ......................(∆),Class 1
Recommended Operating Conditions
Parameter
Power Supply Voltage
Output Voltage
Input Current (ON)
Input Voltage (OFF)
Symbol
V
CC
V
O
I
F(ON)
V
F(OFF)
Min.
4.5
0
10
-5
Max.
30
30
20
0.8
Units
Volts
Volts
mA
V
1-501
Electrical Specifications
Over recommended operating conditions (T
A
= -55°C to +125°C, V
CC
= +4.5 V to 30 V,
I
F(ON)
= 10 mA to 20 mA, V
F(OFF)
= -5 V to 0.8 V) unless otherwise specified.
Group A
Sub-
Symbol groups
[12]
Min. Typ.* Max. Units
CTR
I
OL
V
OL
I
TH
I
OH
I
CCH
I
CCL
V
F
∆V
F
/
∆T
A
BV
R
C
IN
I
I-O
1
1, 2, 3
5
90
1.0
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1.0
30
3.0
90
9.0
0.3
1.5
5
0.6
0.6
1.5
-1.6
0.6
5.0
75
1.5
1.5
1.8
%
mA
V
mA
µA
mA
mA
V
Parameter
Current Transfer
Ratio
Low Level Output
Current
Low Level Output
Voltage
Input Threshold
Current
High Level
Output Current
High Level Supply
Current
Low Level Supply
Current
Input Forward
Voltage
Temperature
Coefficient of
Forward Voltage
Input Reverse
Breakdown Voltage
Input Capacitance
Input-Output
Insulation Leakage
Current
Resistance
(Input-Output)
Capacitance
(Input-Output)
Internal Pull-up
Resistor
Internal Pull-up
Resistor
Temperature
Coefficient
Test Conditions
I
F
= 10 mA, V
O
= 0.6 V
I
F
= 10 mA, V
O
= 0.6 V
I
O
= 2.4 mA
V
O
= 0.8 V,
I
O
= 0.75 mA
V
F
= 0.8 V
V
F
= 0.8 V, V
O
= Open
I
F
= 10 mA, V
O
= Open
I
F
= 10 mA
Fig. Note
1
1, 2
1
3
7
7
7
4
mV/°C I
F
= 10 mA
V
pF
µA
I
R
= 100
µA
f = 1 MHz, V
F
= 0 V
RH = 45%, t = 5 sec,
V
I-O
= 1500 Vdc,
T
A
= 25°C
V
I-O
= 500 Vdc
f = 1 MHz
T
A
= 25°C
2
R
I-O
C
I-O
R
L
∆R
L
/
∆T
A
1
14
10
12
2.4
20
0.014
28
Ω
pF
kΩ
kΩ/°C
2
2
4, 5,
6
*All typical values at 25°C, V
CC
= 15 V.
1-502
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