CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The Input Control Voltage, V
IN
shall not be greater than (V
CC
- 0.5V) and shall not exceed +7V when V
CC
is greater than 7.5V.
2.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
3. The worst case thermal resistance,
θ
JC
for the SIP TS-001AA 5 lead package is 4
o
C/W. The calculation for dissipation and junction
temperature rise due to dissipation is:
P
D
= (V
CC
-V
OUT
)(I
OUT
) + (V
CC
)(I
CCMAX
- I
OUT
) or (V
CC
)(ICCMAX) - (V
OUT
)(I
OUT
)
T
J
= T
AMBIENT
+ (P
D
) (θ
JC
) for an infinite Heat Sink.
Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Derating from 150
o
C is based on the reciprocal of thermal
resistance,
θ
JC
+
θ
HS
. For example: Where
θ
JC
= 4
o
C/W and given
θ
HS
= 6
o
C/W as the thermal resistance of an external Heat Sink,
the junction-to-air thermal resistance,
θ
JA
= 10
o
C/W. Therefore, for the maximum allowed dissipation, derate 0.1W/
o
C for each degree
from T
AMB
to the maximum rated junction temperature of 150
o
C. If T
AMB
= 100
o
C, the maximum P
D
is (150 - 100) x 0.1W/
o
C = 5W.
Electrical Specifications
PARAMETER
Operating Voltage Range
Over-Voltage Shutdown
Over-Temperature Limiting
Negative Pulse
Output Clamp Voltage
Short Circuit Current Limiting
Input Control ON
Input Control OFF
Input Current High
Input Current Low
Supply Current, Full Load
Input Control ON
Supply Current, No Load
Input Control OFF
Input-Output Forward Voltage
Drop (V
CC
- V
OUT
)
Output Leakage
Turn ON Time
Turn OFF Time
NOTES:
T
A
= -40
o
C to 125
o
C, V
IN
= 2V, V
CC
= +12V, Unless Otherwise Specified
SYMBOL
V
CC
V
OVSD
T
SD
V
CL
I
SC
V
IH
V
IL
I
IH
I
IL
I
CCMAX
I
CCMIN
V
SAT
I
OUT_LK
t
ON
t
OFF
V
IN
= 5.5V, V
CC
= 6V to 24V
V
IN
= 0.8V, V
CC
= 6V to 24V
V
IN
= 2V; I
OUT
= 1.0A;
V
IN
= 0V; I
OUT
= 0A;
I
OUT
= 1A; V
CC
= 4.5V to 25V
V
IN
= 0.8V; V
CC
= 6V to 24V
R
L
= 80Ω; (Note 5)
R
L
= 80Ω; (Note 5)
I
CL
= -100mA; V
CC
= 4.5V to 25V
(Note 4)
R
L
= 1KΩ; V
IN
= 2V
TEST CONDITIONS
MIN
4.5
26
-
TYP
-
33
150
MAX
25
38
-
(V
CC
- 28)
2.5
-
0.8
40
30
1.1
UNITS
V
V
o
C
(V
CC
- 35) (V
CC
- 30.5)
1.1
2.0
-
6
6
-
1.6
-
-
-
-
1.05
V
A
V
V
µA
µA
A
µA
V
µA
µs
µs
-
55
100
-
0.6
1
-
-
-
4
5
25
50
20
65
4. Short circuit current will be reduced when thermal shutdown occurs. Testing of short circuit current may require a short duration pulse.
See Figure 7.
5. Refer to Figures 3A and 3B for typical switching speeds with a 20Ω Load.
2
HIP1030
Typical Applications
0.47
µ
F
HIP1030 HIGH SIDE DRIVER
V
BATT
POWER
SUPPLY
1
V
CC
OVER-
VOLTAGE
SHUTDOWN
CURRENT
LIMIT
THERMAL
LIMIT
CONTROL
CIRCUIT
NEG.
CLAMP
ZENER
TYPICAL
LOAD
LOADS:
RELAYS
SOLENOIDS
LAMPS
MOTORS
R
S
V
OUT
2
V
CC
V
IN
5
CMOS/TTL
INPUT
LOGIC SWITCH
TO V
IN
3
HIP1030
TAB
GND
4
GND
V
CLAMP
V
CL
GND
V
OUT
V
SAT
Typical Performance Curves
16
WITH EXT.
0
o
C/W H.S.
(INFINITE
HEAT SINK)
WITH EXT.
6
o
C/W H. S.
8
VOLTAGE DROP (V)
1.5
R
L
= 10Ω, V
CC
= V
SAT
+ I
L
R
L
; V
SAT
= (V
CC
- V
OUT
)
INPUT: V
IN
= 5V
DATA TAKEN USING 110CM x 110CM
FLAT ALUM. HEAT SINK
1.0
I
L
= 1.25A
DISSIPATION WATTS (W)
12
0.5
I
L
= 1.0 A
4
I
L
= 0.5A
0
-50
0
-50
0
50
100
150
0
50
100
150
AMBIENT TEMPERATURE (
o
C)
AMBIENT TEMPERATURE (
o
C)
FIGURE 1. DISSIPATION DERATING CURVES
FIGURE 2. TYPICAL FORWARD VOLTAGE DROP, V
SAT
CHARACTERISTICS vs AMBIENT OPERATING
TEMPERATURE
15
15
OUTPUT PULSE VOLTAGE (V)
t
ON
10
OUTPUT PULSE VOLTAGE (V)
V
CC
= 12V, LOAD = 20Ω IN PARALLEL
WITH 2200pF; T
A
= 25
o
C
INPUT: V
IN
= 0V to 2V STEP, 1ms PERIOD, 500µs PULSE
V
CC
= 12V, LOAD = 20Ω IN PARALLEL
WITH 2200pF; T
A
= 25
o
C
INPUT: V
IN
= 2V to 0V STEP, 1ms PERIOD, 500µs PULSE
10
5
5
t
OFF
0
0
1
2
0
0
10
20
FIGURE 3A. OUTPUT TURN-ON TIME (µs
)
FIGURE 3B. OUTPUT TURN-OFF TIME (µs)
FIGURE 3. TYPICAL RISE TIME AND FALL TIME CHARACTERISTICS OF THE HIP1030 WITH A RESISTIVE AND CAPACITIVE
LOAD. THE TURN-ON TIME OF APPROXIMATELY 1.1µs IS PRIMARILY DETERMINED BY THE V
CC
SUPPLY. THE OUT-
PUT FALL TIME IS LIMITED BY RC TIME CONSTANT OF THE LOAD.
3
HIP1030
Typical Performance Curves
15
V
CC
= 12V, LOAD = 16Ω; T
A
= 25
o
C
INPUT: V
IN
= 0V to 2V STEP, 50% DUTY CYCLE PULSE
OUTPUT PULSE VOLTAGE (V)
15
10
5
0
-5
-10
-15
0
1
2
3
4
INDUCTIVE PULSE SWITCHING TIME (ms)
5
NEGATIVE INDUCTIVE
SWITCHING PULSE
(Continued)
V
CC
= 15V, LOAD = 70mH + 22.3Ω IN SERIES; T
A
= 25
o
C
INPUT: V
IN
= 0V to 2V STEP, 50% DUTY CYCLE PULSE
OUTPUT PULSE VOLTAGE (V)
10
5
0
0
0.4
0.8
1.2
SWITCHING TIME (ms)
1.6
2.0
FIGURE 4. TYPICAL SWITCHING CHARACTERISTIC OF THE
HIP1030 WITH AN OUTPUT RESISTIVE LOAD
FIGURE 5. TYPICAL OUTPUT INDUCTIVE LOAD SWITCHING
PULSE. THE NEGATIVE CLAMP VOLTAGE
(V
CC
-31V) FOR THE INDUCTIVE KICK PULSE IS
REFERENCED TO THE V
CC
SUPPLY INPUT
6
OUTPUT PULSE VOLTAGE (V)
INPUT: V
IN
= 0V to 2V STEP, 1ms PERIOD, 500µs PULSE
t
ON
4
OUTPUT PULSE VOLTAGE (V)
V
CC
= 4.5V, LOAD = 8Ω, T
A
= 25
o
C
6
V
CC
= 4.5V, LOAD = 8Ω, T
A
= 25
o
C
INPUT: V
IN
= 0V to 2V STEP, 1ms PERIOD, 500µs PULSE
4
2
2
t
OFF
0
0
4
8
12
16
20
0
0
1
2
3
4
5
FIGURE 6A. TURN-ON TIME (µ
s
)
FIGURE 6B. TURN-OFF TIME (µs)
FIGURE 6. TYPICAL LOW SUPPLY VOLTAGE SWITCHING CHARACTERISTICS OF THE HIP1030. THE TURN-ON AND TURN-OFF
CHARACTERISTICS ARE SHOWN FOR V
CC
= 4.5V.
3
OUTPUT PULSE VOLTAGE (V)
V
CC
= 24V, LOAD = 1Ω; T
A
= 25
o
C
INPUT: V
IN
= 2V, 1ms PERIOD, 100µs PULSE
SUPPLY CURRENT (mA)
V
CC
VARIED FROM 4V TO 36V, NO LOAD
INPUT: V
IN
= 2V (DC); T
A
= 25
o
C
25
20
15
10
5
0
OVER-VOLTAGE
SHUTDOWN
2
CURRENT
LIMITING
1
0
0
40
80
120
OUTPUT PULSE TIME (µs)
160
200
0
5
10
15
20
25
30
35
40
45
50
SUPPLY VOLTAGE (V)
FIGURE 7. TYPICAL OUTPUT CURRENT PULSE WHEN
SWITCHING INTO A LOW IMPEDANCE (1Ω), OR
SHORTED LOAD. FOR THE CONDITIONS SHOWN,
OUTPUT CURRENT LIMITING IS ~1.7A
FIGURE 8. TYPICAL IDLE CURRENT vs SUPPLY VOLTAGE
WITH NO LOAD
4
HIP1030
Single-In-Line Plastic Packages (SIP)
Ø
P
E
A
A
1
Q
H
1
Z5.067C
(ALTERNATE VERSION)
5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE
INCHES
SYMBOL
A
MIN
0.170
0.048
0.030
0.031
0.018
0.590
0.395
MAX
0.180
0.052
0.034
0.041
0.022
0.610
0.405
MILLIMETERS
MIN
4.32
1.22
0.77
0.79
0.46
14.99
10.04
MAX
4.57
1.32
0.86
1.04
0.55
15.49
10.28
NOTES
-
3, 4
3, 4
3, 4
3, 4
-
-
5
5
-
6
-
2
-
-
Rev. 1 4/96
NOTES:
1. These dimensions are within allowable dimensions of Rev. A of
JEDEC TS-001AA outline dated 8-89.
2. Solder finish uncontrolled in this area.
3. Lead dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. Position of lead to be measured 0.250 inches (6.35mm) from
bottom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from
bottom of dimension D.
7. Controlling dimension: Inch.
D
A
1
b
b
1
c
L
1
b
1
c
D
E
e
e
1
L
0.067 TYP
0.268 BSC
0.235
0.095
0.530
0.110
0.149
0.105
0.255
0.105
0.550
0.130
0.153
0.115
1.70 TYP
6.80 BSC
5.97
2.42
13.47
2.80
3.79
2.66
6.47
2.66
13.97
3.30
3.88
2.92
60
o
1 2 3 4 5
H
1
e
e
1
J
1
J
1
L
L
1
ØP
Q
b
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
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