Single Channel, High Speed Logic Interface Optocoupler
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The HCPL-2503 optocoupler is specified for use in LSTTL-
to-LSTTL and TTL-to-LSTTL logic interfaces. A nominal
8 mA sink current through the input LED will provide
enough output current for proper operation of 1 LSTTL
gate under worst-case conditions when used in the rec-
ommended circuits. The CTR of the HCPL-2503 is 15%
minimum at I
F
= 8 mA.
The HCPL-2503 contains a light emitting diode and an in-
tegrated photon detector with a 3000 Vdc withstand test
between input and output. Separate connection for the
photodiode bias and output transistor collector reduce
the base-collector capacitance, giving improved speed
compared with conventional phototransistor couplers.
Features
• Data rates to 250 kb/s NRZ
• LSTTL compatible
• High common mode transient immunity:
> 1000 V/µs
• 3750 Vdc withstand test voltage
• Open collector output
• Guaranteed performance from temperature: 0°C to
70°C
• Safety approval
- UL Recognized - 3750Vrms for 1min (5000Vrms for
1 min Option 020 devices) per UL1577.
- IEC/EN/DIN EN 60747-5-2 Approved
- VIORM = 630 Vpeak for option 060
I
CC
8
V
CC
Schematic
Applications
• High speed logic ground isolation
– LSTTL-to-LSTTL and TTL-to-LSTTL
• High voltage isolation
ANODE
2
+
V
F
I
F
CATHODE
-
3
SHIELD
I
B
7 *
V
B
I
O
6
V
O
• Analog signal ground isolation
5
GND
- A 0.1uF bypass capacitor must be connected between 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Outline Drawing
8-Pin DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
OPTION CODE*
DATE CODE
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
5¡ TYP.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
8-Pin DIP Package with Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
4
10.9 (0.430)
1.27 (0.050)
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
2.0 (0.080)
1.19
(0.047)
MAX.
3.56 ± 0.13
(0.140 ± 0.005)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12¡ NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
2
Ordering Information
HCPL-2503 is UL Recognized with 3750 Vrms and 5000 Vrms (option 020) for 1 minute per UL1577. All devices above
listed are approved under CSA Component Acceptance Notice #5, File CA 88324.
Option
Part
number
RoHS
Compliant
-000E
-300E
-500E
-020E
HCPL-2503
-320E
-520E
-060E
-360E
-560E
Non RoHS
Compliant
No option
-300
-500
-020
-320
-520
-060
-360
-560
X
X
X
X
X
300mil
DIP-8
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Package
Surface
Mount
Gull
Wing
Tape
& Reel
UL 5000
Vrms/1
IEC/EN/DIN EN
Minute rating
60747-5-2
Quantity
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-2503-000E to order product of 300mil DIP package with RoHS compliant.
HCPL-2503 to order product of 300mil DIP package in tube packaging and non RoHS compliant.
Example 2:
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and
RoHS compliant option will use ‘-XXXE‘.
Absolute Maximum Ratings
Storage Temperature ...........................................................................................................................................................–55°C to +125°C
Operating Temperature .....................................................................................................................................................–55°C to +100°C
Lead Solder Temperature (1.6 mm below seating plane) ............................................................................................260°C for 10 s
Average Input Current – I
F
................................................................................................................................................................ 25 mA
[1]
Peak Input Current – I
F
(50% duty cycle, 1 ms pulse width) ................................................................................................ 50 mA
[2]
Peak Transient Input Current – I
F
(≤1 µs pulse width, 300 pps) ....................................................................................................1.0 A
Reverse Input Voltage – V
R
(Pin 3-2) .......................................................................................................................................................... 5 V
Input Power Dissipation .................................................................................................................................................................... 45 mW
[3]
.
Average Output Current – I
O
(Pin 6) ......................................................................................................................................................8 mA
Peak Output Current – I
O
....................................................................................................................................................................... 16 mA
Emitter-Base Reverse Voltage (Pin 5-7) ..................................................................................................................................................... 5 V
Supply and Output Voltage – V
CC
(Pin 8-5), V
O
(Pin 6-5) .................................................................................................. –0.5 V to 7 V
Base Current – I
B
(Pin 7) ..............................................................................................................................................................................5 mA
Output Power Dissipation ..............................................................................................................................................................100 mW
[4]
Notes:
1. Derate linearly above +70˚C free-air temperature at a rate of 0.8 mA/˚C.
2. Derate linearly above +70˚C free-air temperature at a rate of 1.6 mA/˚C.
3. Derate linearly above +70˚C free-air temperature at a rate of 0.9 mW/˚C.
4. Derate linearly above +70˚C free-air temperature at a rate of 2.0 mW/˚C.
3
Solder Reflow Temperature Profile
300
PREHEATING RATE 3
°
C + 1
°
C/- 0.5
°
C/SEC.
REFLOW HEATING RATE 2.5
°
C ± 0.5
°
C/SEC.
PEAK
TEMP.
245
°
C
PEAK
TEMP.
240
°
C
TEMPERATURE (
°
C)
200
160
°
C
150
°
C
140
°
C
2.5
°
C ± 0.5
°
C/SEC.
30
SEC.
3
°
C + 1
°
C/- 0.5
°
C
30
SEC.
PEAK
TEMP.
230
°
C
SOLDERING
TIME
200
°
C
100
PREHEATING TIME
150
°
C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
t
p
T
p
260 +0/-5
°
C
RAMP-UP
3
°
C/SEC. MAX.
150 - 200
°
C
217
°
C
TIME WITHIN 5
°
C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
TEMPERATURE
T
L
T
smax
T
smin
RAMP-DOWN
6
°
C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t
L
60 to 150 SEC.
t 25
°
C to PEAK
TIME
NOTES:
THE TIME FROM 25
°
C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200
°
C, T
smin
= 150
°
C
Note: Non-halide flux should be used.
4
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(HCNW and Option 060 only)
Insulation and Safety Related Specifications
Parameter
Minimum External
Air Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Minimum Internal
Tracking (Internal
Creepage)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
Symbol
L(101)
L(102)
CTI
8-Pin DIP
(300 Mil)
Value
7.1
7.4
0.08
NA
200
SO-8
Value
4.9
4.8
0.08
NA
200
Widebody
(400 Mil)
Value
9.6
10.0
1.0
4.0
200
Units
mm
mm
mm
mm
Volts
Conditions
Measured from input terminals
to output terminals, shortest
distance through air.
Measured from input terminals
to output terminals, shortest
distance path along body.
Through insulation distance,
conductor to conductor, usually
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Measured from input terminals
to output terminals, along
internal cavity.
DIN IEC 112/VDE 0303 Part 1
IIIa
IIIa
IIIa
Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
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