HBS SERIES - 100 WATT
DESCRIPTION
HBS DC/DC converters provide up to 100 Watts of output
power in an industry standard half-brick package and
footprint. These units feature excellent efficiency, Class A
conducted noise specs, and fixed switching frequency. The
HBS series feature open-frame packaging, along with
planar magnetics to provide maximum useable power with
minimal thermal constraints. The HBS series is well suited
for telecom, networking, and industrial applications, and is
fully compatible with production board washing processes.
FEATURES
• Industry Standard Half-
Brick
• Open-Frame Packaging
• 100°C Baseplate Operation
•
•
•
•
Water Washable
“True-Trim” Option
1500V Isolation
Positive Or Negative
Logic
Efficiency vs. Load (24V Input)
90
88
86
EFFICIENCY %
84
82
80
78
76
74
72
10
20
30
40
50
60
70
80
90
100
LOAD %
HBS100YJ-A
EFF. (18V)
EFF. (24V)
EFF. (36V)
TECHNICAL SPECIFICATIONS
Input
Voltage range
24 VDC nominal
48 VDC nominal
Reflected ripple
Input Reverse Voltage Protection
18 - 36 VDC
34 - 75 VDC
25 mA
Shunt Diode
Efficiency vs. Load (48V Input)
90
Output
Setpoint Accuracy
Line Regulation Vin Min. - Vin Max., Iout Rated
Load Regulation Iout Min. - Iout Max., Vin Nom.
Remote Sense Headroom
Minimum Output Current
Dynamic Regulation, Loadstep
Pk Deviation
Settling Time
Voltage Trim Range
Short Circuit / Overcurrent Protection
Current Limit Threshold Range, % of Iout Rated
OVP Trip Range
OVP
±1%
±0.2% Vout
±0.2% Vout
0.5 VDC
10%, Iout Rated
25% Iout
4% Vout
500 ms
±10%
Hiccup
110 - 140%
115 - 140% Vout Nom.
Hiccup
85
80
75
70
HBS100ZG-A
65
60
10
20
30
40
50
60
70
80
90
100
LOAD %
General
Turn-On Time
Remote Shutdown
Remote Shutdown Reference
Switching Frequency
Isolation
Input - Output
Input - Case
Output - Case
Temperature Coefficient
Case Temperature
Operating Range
Storage Range
Thermal Shutdown Range
Vibration, 3 Axes, 5 Min Each
MTBF† (Bellcore TR-NWT-000332)
Safety
Weight (approx.)
10 ms
Positive or Negative Logic
Vin Negative
500 kHz
1500 VDC
1050 VDC
500 VDC
0.2%/°C
-40 to +100°C
-40 to +125°C
105 to 115°C
5 g, 10 - 55 Hz
2.1 x 106 hrs
UL, cUL, VDE
2.5 oz
Notes
†
MTBF predictions may vary slightly from model to model.
Specifications typically at 25°C, normal line, and full load,
unless otherwise stated.
Soldering Conditions: I/O pins, 260°C, ten seconds; fully
compatible with commercial wave-soldering equipment.
Units are water-washable and fully compatible with commercial
spray or immersion post wave-solder washing equipment.
REV. 12/01
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OPTIONS
When ordering equipment options, use the following suffix information. Select the option(s) that you prefer
and add them to the model number. Example ordering options are located below the options table.
OPTION
Negative Logic
Lucent-Compatible
Terminal Strip
Trim
Enable
Trim and Enable
Current Share
Headerless
SUFFIX
N
T
TS
1
2
3
4
Y
APPLICABLE SERIES
HAS, HBD, HBS, HES, HLS, HLD, LES,
QBS, QES, QLS, TES, TQD
HAS, HBD, HBS, HES, HLS, QBS, QES,
QLS
XWS, XWD, XWT
IAS, LES
IAD, IAS, LES, SMS
IAS, LES
SMS
Encapsulated EWS, IWS, OWS
REMARKS
TTL "Low" Turns Module ON
TTL "High" Turns Module OFF
Pin Length and Heatsink Options
0.110" (2.8mm) Pin Length
0.150" (3.8mm) Pin Length
0.24" (6.1mm) Horizontal Heatsink
0.24" (6.1mm) Vertical Heatsink
0.45" (11.4mm) Horizontal Heatsink
0.45" (11.4mm) Vertical Heatsink
0.95" (24.1mm) Horizontal Heatsink
0.95" (24.1mm) Vertical Heatsink
8
9
1H
1V
2H
2V
3H
3V
All Units (Except SMS)
All Units (Except SMS)
All Units (All Units Except DIP, HLS, HLD, QLS,
SIP, SM, TLD, and TKD Packages)
All Units (All Units Except DIP, HLS, HLD, QLS,
SIP, SM, TLD, and TKD Packages)
All Units (All Units Except DIP, HLS, HLD, QLS,
SIP, SM, TLD, and TKD Packages)
All Units (All Units Except DIP, HLS, HLD, QLS,
SIP, SM, TLD, and TKD Packages)
All Units (All Units Except DIP, HLS, HLD, QLS,
SIP, SM, TLD, and TKD Packages)
All Units (All Units Except DIP, HLS, HLD, QLS,
SIP, SM, TLD, and TKD Packages)
Standard Pin Length is 0.180" (4.6mm)
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Example Options:
HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent-compatible trim, and 0.95” vertical heatsink.
LES015YJ-3N = LES015YJ with optional trim and enable, negative logic.
QBS066ZG-AT8 = QBS066ZG-A with Lucent-compatible trim and 0.110” pin length.
NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not authorized for use as critical components in life support systems,
equipment used in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the
date manufactured. Specifications are subject to change without notice.
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Microchip MCU
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