Datasheet> 器件分类 > 模拟混合信号IC> 驱动程序和接口> 5962F9666301QXX

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5962F9666301QXX: 产品描述QUAD LINE DRIVER, CDFP16, CERAMIC, DFP-16; 产品类别模拟混合信号IC 驱动程序和接口; 文件大小31KB，共2页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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5962F9666301QXX概述

QUAD LINE DRIVER, CDFP16, CERAMIC, DFP-16

5962F9666301QXX规格参数

参数名称	属性值
厂商名称	Renesas(瑞萨电子)
零件包装代码	DFP
包装说明	DFP,
针数	16
Reach Compliance Code	compliant
ECCN代码	EAR99
差分输出	YES
驱动器位数	4
输入特性	STANDARD
接口集成电路类型	LINE DRIVER
接口标准	EIA-422
JESD-30 代码	R-CDFP-F16
功能数量	4
端子数量	16
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP
封装形状	RECTANGULAR
封装形式	FLATPACK
认证状态	Not Qualified
筛选级别	MIL-PRF-38535 Class Q
座面最大高度	2.92 mm
标称供电电压	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL
总剂量	300k Rad(Si) V
宽度	6.73 mm
Base Number Matches	1

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HS-26C31RH

Data Sheet

August 1999

File Number

3401.3

Radiation Hardened Quad Differential Line

Driver

The Intersil HS-26C31RH is a quad differential line driver

designed for digital data transmission over balanced lines

and meets the requirements of EIA standard RS-422.

Radiation hardened CMOS processing assures low power

consumption, high speed, and reliable operation in the most

severe radiation environments.

The HS-26C31RH accepts CMOS signal levels and converts

them to RS-422 compatible outputs. This circuit uses special

outputs that enable the drivers to power down without loading

down the bus. Enable and disable pins allow several devices to

be connected to the same data source and addressed

independently.

Speciﬁcations for Rad Hard QML devices are controlled

by the Defense Supply Center in Columbus (DSCC). The

SMD numbers listed here must be used when ordering.

Detailed Electrical Speciﬁcations for these devices are

contained in SMD 5962-96663. A “hot-link” is provided

on our homepage for downloading.

http://www.intersil.com/spacedefense/space.htm

Features

• Electrically Screened to SMD # 5962-96663

• QML Qualiﬁed per MIL-PRF-38535 Requirements

• 1.2 Micron Radiation Hardened CMOS

- Total Dose Up to . . . . . . . . . . . . . . . . . . . . 300kRAD(Si)

- Dose Rate Upset . . . . . . . > 1x10

RAD/s (20ns Pulse)

• Latchup Free

• EIA RS-422 Compatible Outputs (Except for IOS)

• CMOS Inputs

• High Impedance Outputs when Disabled or Powered

Down

• Low Power Dissipation . . . . . . . . . 2.75mW Standby (Max)

• Single 5V Supply

• Low Output Impedance . . . . . . . . . . . . . . . . . 10Ω or Less

• Full -55

C to 125

C Military Temperature Range

Pinouts

HS1-26C31RH (SBDIP)

CDIP2-T16

TOP VIEW

AIN 1

16 VDD

15 DIN

14 DO

13 DO

12 ENABLE

11 CO

10 CO

9 CIN

Ordering Information

ORDERING NUMBER

5962F9666301QEC

5962F9666301QXC

5962F9666301V9A

5962F9666301VEC

5962F9666301VXC

INTERNAL

MKT. NUMBER

HS1-26C31RH-8

HS9-26C31RH-8

HS0-26C31RH-Q

HS1-26C31RH-Q

HS9-26C31RH-Q

TEMP. RANGE

(

-55 to 125

ENABLE 4

BO 5

BO 6

BIN 7

GND 8

HS1-26C31RH/PROTO HS1-26C31RH/PROTO

HS9-26C31RH/PROTO HS9-26C31RH/PROTO

Logic Diagram

ENABLE

DIN

CIN

BIN

AIN

ENABLE

DO DO

CO CO

BO BO

AO AO

BIN

GND

HS9-26C31RH (FLATPACK)

CDFP4-F16

TOP VIEW

VDD

DIN

ENABLE

CIN

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

http://www.intersil.com or 407-727-9207

Intersil Corporation 1999

5962F9666301QXX相似产品对比

	5962F9666301QXX	5962F9666301QEX	5962F9666301VXX	5962F9666301VEX
描述	QUAD LINE DRIVER, CDFP16, CERAMIC, DFP-16	QUAD LINE DRIVER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16	QUAD LINE DRIVER, CDFP16, CERAMIC, DFP-16	QUAD LINE DRIVER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16
厂商名称	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)
零件包装代码	DFP	DIP	DFP	DIP
包装说明	DFP,	DIP,	DFP,	DIP,
针数	16	16	16	16
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99
差分输出	YES	YES	YES	YES
驱动器位数	4	4	4	4
输入特性	STANDARD	STANDARD	STANDARD	STANDARD
接口集成电路类型	LINE DRIVER	LINE DRIVER	LINE DRIVER	LINE DRIVER
接口标准	EIA-422	EIA-422	EIA-422	EIA-422
JESD-30 代码	R-CDFP-F16	R-CDIP-T16	R-CDFP-F16	R-CDIP-T16
功能数量	4	4	4	4
端子数量	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP	DIP	DFP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK	IN-LINE	FLATPACK	IN-LINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
筛选级别	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V
座面最大高度	2.92 mm	5.08 mm	2.92 mm	5.08 mm
标称供电电压	5 V	5 V	5 V	5 V
表面贴装	YES	NO	YES	NO
技术	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	FLAT	THROUGH-HOLE	FLAT	THROUGH-HOLE
端子节距	1.27 mm	2.54 mm	1.27 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL
总剂量	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V
宽度	6.73 mm	7.62 mm	6.73 mm	7.62 mm
Base Number Matches	1	1	1	1

5962F9666301QXX

5962F9666301QXX概述

5962F9666301QXX规格参数

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