PRELIMINARY
CM1470
4-, 6- and 8-Channel Series Inductor Network
Features
•
•
•
•
•
•
•
•
OptiGuard™
Coating for improved reliability at
assembly
4, 6 and 8 channels of inductive filtering
±2kV HBM – MIL-STD883 (Method 3015)
Chip Scale Package (CSP) features extremely low
parasitic inductance for optimum filter and ESD
performance
10 bump, 2.030mm x 0.836mm footprint CSP for
CM1470-04
14 bump, 2.830mm x 0.836mm footprint CSP for
CM1470-06
18 bump, 3.630mm x 0.836mm footprint CSP for
CM1470-08
Lead-free version available
Product Description
CMD’s CM1470 is a family of series inductor networks
providing inductive filtering for applications where an L-
C filter will potential degrade signal integrity due to the
capacitive element in the device. The CM1470 is
configured in 4, 6 and 8 channel formats. Each EMI
filter channel of the CM1470 is implemented as a
single inductor element where the component value is
17nH. The CM1470 will help suppress EMI radiation to
the external environment. The parts integrate ESD
protection diodes on every pin to provide ESD
protection during the manufacturing process when the
device is placed on the PCB from a pick and place
machine. The ESD protection diodes connected to
each pin safely dissipate ESD strikes of
±2kV,
per the
MIL-STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD.
This device is particularly well suited for portable
electronics (e.g. wireless handsets, PDAs) because of
its small package format and easy-to-use pin
assignments. In particular, the CM1470 is ideal for EMI
filtering data and control lines in camera modules
where it is placed near the transmission source on a
flexible PCB. With little to no capacitance on each line,
the CM1470 prevents noise from being de-coupled
between the PCB and device as the capacitor will
absorb this energy and radiate it to the surrounding
environment.
The CM1470 incorporates
OptiGuard™
which results in
improved reliability at assembly. The CM1470 is avail-
able in a space saving, low profile Chip Scale Package
with optional lead-free finishing.
Applications
•
•
Camera data and control lines for high resolution
camera modules in camera handsets
LCD modules
Electrical Schematic
17nH
A1 - (An-1)
B2 - Bn
An
GND
B1
1 of n Channels
© 2006 California Micro Devices Corp. All rights reserved.
01/06/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
PRELIMINARY
CM1470
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
DC current per Inductor
RATING
-65 to +150
30
UNITS
°C
mA
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
-40 to +85
UNITS
°C
ELECTRICAL OPERATING CHARACTERISTICS
(NOTE 1
)
SYMBOL
L
TOT
R
I
LEAK
V
SIG
PARAMETER
Total Channel Inductance
DC Channel Resistance
Input Capacitance / Channel
Signal Voltage
Positive Clamp
Negative Clamp
Stand-off Voltage
Diode Leakage Current
Signal Clamp Voltage
Positive Clamp
Negative Clamp
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Cut-off frequency
Z
SOURCE
= 50Ω, Z
LOAD
= 50Ω
2.5V dc; 1MHz, 30mV ac
I
LOAD
= 10mA
5
-15
CONDITIONS
MIN
TYP
17
10
2.8
7
-10
6.0
0.1
5.6
-1.5
±4
±2
900
6.8
-0.8
1.0
9.0
-0.4
15
-5
MAX
UNITS
nH
Ω
pF
V
V
V
μA
V
V
kV
kV
MHz
V
ST
I
LEAK
V
SIG
I = 10μA
V
IN
=
+
3.3V
I
LOAD
= 10mA
I
LOAD
= -10mA
Notes 2, 3, 4 and 5
V
ESD
f
C
Note 1: T
A
=25
°
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin B2.
Note 4: Unused pins are left open.
Note 5: These parameters are guaranteed by design and characterization.
© 2006 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
01/06/06
51单片机
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