8k, 16k bit EEPROMs for direct connection to serial ports
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ROHM(罗姆半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | LSOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 2 MHz |
| 数据保留时间-最小值 | 10 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e2 |
| 长度 | 5 mm |
| 内存密度 | 8192 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512X16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 就绪/忙碌 | YES |
| 座面最大高度 | 1.6 mm |
| 最大待机电流 | 0.000002 A |
| 最大压摆率 | 0.005 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN COPPER |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 10 |
| 宽度 | 4.4 mm |
| 写保护 | HARDWARE/SOFTWARE |
| BR9080F | BR9016 | BR9016F | BR9016RFV | BR9080 | BR9080RFV | |
|---|---|---|---|---|---|---|
| 描述 | 8k, 16k bit EEPROMs for direct connection to serial ports | 8k, 16k bit EEPROMs for direct connection to serial ports | 8k, 16k bit EEPROMs for direct connection to serial ports | 8k, 16k bit EEPROMs for direct connection to serial ports | 8k, 16k bit EEPROMs for direct connection to serial ports | 8k, 16k bit EEPROMs for direct connection to serial ports |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | DIP | SOIC | SOIC | DIP | SOIC |
| 包装说明 | LSOP, SOP8,.25 | DIP, DIP8,.3 | LSOP, SOP8,.25 | LSSOP, TSSOP8,.25 | DIP, DIP8,.3 | LSSOP, TSSOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknow | unknow | unknow | compliant | unknow | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
| 数据保留时间-最小值 | 10 | 10 | 10 | 10 | 10 | 10 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
| JESD-609代码 | e2 | e2 | e2 | e2 | e2 | e2 |
| 长度 | 5 mm | 9.3 mm | 5 mm | 4.4 mm | 9.3 mm | 4.4 mm |
| 内存密度 | 8192 bi | 16384 bi | 16384 bi | 16384 bit | 8192 bi | 8192 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 512 words | 1024 words | 1024 words | 1024 words | 512 words | 512 words |
| 字数代码 | 512 | 1000 | 1000 | 1000 | 512 | 512 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 512X16 | 1KX16 | 1KX16 | 1KX16 | 512X16 | 512X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSOP | DIP | LSOP | LSSOP | DIP | LSSOP |
| 封装等效代码 | SOP8,.25 | DIP8,.3 | SOP8,.25 | TSSOP8,.25 | DIP8,.3 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE | IN-LINE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 就绪/忙碌 | YES | YES | YES | YES | YES | YES |
| 座面最大高度 | 1.6 mm | 3.7 mm | 1.6 mm | 1.25 mm | 3.7 mm | 1.25 mm |
| 最大待机电流 | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A |
| 最大压摆率 | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN COPPER | TIN COPPER | TIN COPPER | Tin/Copper (Sn/Cu) | TIN COPPER | Tin/Copper (Sn/Cu) |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 0.65 mm | 2.54 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 10 | 10 | 10 | 10 | 10 | NOT SPECIFIED |
| 宽度 | 4.4 mm | 7.62 mm | 4.4 mm | 3 mm | 7.62 mm | 3 mm |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| 厂商名称 | ROHM(罗姆半导体) | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
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