IC F/FAST SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CQCC20, Decoder/Driver
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | QCCN, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 系列 | F/FAST |
| JESD-30 代码 | S-CQCC-N20 |
| 负载电容(CL) | 50 pF |
| 功能数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 最大电源电流(ICC) | 20 mA |
| 传播延迟(tpd) | 9.5 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 54F139/B2A | 54F139/BFA | 54F139/BEA | N54F139/BFA | N54F139/B2A | |
|---|---|---|---|---|---|
| 描述 | IC F/FAST SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CQCC20, Decoder/Driver | IC F/FAST SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, Decoder/Driver | IC F/FAST SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDIP16, Decoder/Driver | IC F/FAST SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERAMIC, DFP-16, Decoder/Driver | IC F/FAST SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LLCC-20, Decoder/Driver |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | QCCN, | DFP, | DIP, | DFP, | QCCN, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | S-CQCC-N20 | R-CDFP-F16 | R-GDIP-T16 | R-CDFP-F16 | S-CQCC-N20 |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 16 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DFP | DIP | DFP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK | CHIP CARRIER |
| 最大电源电流(ICC) | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
| 传播延迟(tpd) | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | FLAT | THROUGH-HOLE | FLAT | NO LEAD |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 座面最大高度 | - | - | 5.08 mm | 2.159 mm | 1.905 mm |
| 端子节距 | - | - | 2.54 mm | 1.27 mm | 1.27 mm |
| 宽度 | - | - | 7.62 mm | 6.731 mm | 8.89 mm |
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