MA4FCP305
Flip Chip PIN Diode
RoHS Compliant
Features
•
•
•
•
•
•
•
Low Series Resistance : 1.7Ω
Low Capacitance : 50fF
Fast Switching Speed : 20nS
Silicon Nitride Passivation
Polyimide Scratch Protection
Designed for Automated Pick and Place Insertion
Rugged by Design
M/A-COM Products
Rev. V4
1269 Outline
Description
M/A-COM’s MA4FCP Series consists of Silicon Flip
Chip PIN diodes fabricated with M/A-COM’s
patented HMIC process. This diode is fabricated on
epitaxial wafers using a process designed for
repeatable electrical characteristics and extremely
low parasitics. This diode is fully passivated with
Silicon Nitride and has an additional layer of
Polyimide for scratch protection. These protective
coatings prevent damage to the junction during
automated or manual handling. This flip chip
configuration is suitable for pick and place insertion.
Applications
The small 0315 outline and low 0.085 pS RC
product, make the device useful for multi-throw
switch and switched phase shifter circuits requiring
<20nS switching speeds up to 18GHz operating
frequency.
Absolute Maximum Ratings
@ TA = +25°C (unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Dissipated Power
Mounting Temperature
Absolute Maximum
100 mA
- 40 V
- 55°C to + 150°C
- 55°C to + 150°C
230 mW
+300°C for 10 seconds
Inches
Dim.
A
B
C
D
E
F
Min.
0.0269
0.0135
0.0040
0.0041
0.0124
0.0069
Max.
0.0289
0.0155
0.0080
0.0061
0.0144
0.0089
Millimeters
Min.
Max.
0.683 0.733
0.343 0.393
0.102 0.203
0.105 0.155
0.315 0.365
0.175 0.225
1. Exceeding these limits may cause permanent damage.
1
1. Backside metal: 0.1
µM
thick.
2. Yellow hatched areas indicate backside ohmic gold
contacts.
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MA4FCP305
Flip Chip PIN Diode
RoHS Compliant
Electrical Specifications @ + 25 °C
Parameters @ Conditions
Total Capacitance @ -10V, 1MHz
1
Total Capacitance @ -10V, 1GHz
1,3
Series Resistance @ +50mA
2,3
, 100MHz
Series Resistance @ +50mA
2,3
, 1GHz
Forward Voltage @ +100mA
Reverse Voltage @ -10mA
Reverse Current @ -40V
50 – 90 % Lifetime @ + 10mA / - 6mA
Steady State Thermal Resistance
4
1.
2.
3.
4.
M/A-COM Products
Rev. V4
Symbol
C
T
C
T
R
S
R
S
V
F
V
R
I
R
TL
θ
Units
pF
pF
Ω
Ω
V
V
mA
ns
° C/W
Min.
Typ.
0.060
0.050
1.7
2.1
1.05
Max.
1.25
-40
-50
10
25
640
Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance, Cp.
Series resistance R
S
is equivalent to the total diode series resistance including the junction resistance Rj.
Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package.
Steady-state Thermal Resistance measured with die mounted in an ODS-186 package.
ESD
These devices very susceptible to ESD and are rated Class 0 (0-199V) per HBM MIL-STD-883, method 3015.7
[C = 100pF ±10%, R = 1.5kW ±1%]. Even though tested die pass 100V ESD, they must be handled in a
static-free environment.
2
Specifications Subject to Change Without Notice
.
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MA4FCP305
Flip Chip PIN Diode
RoHS Compliant
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
M/A-COM Products
Rev. V4
Bonding Techniques
These devices were designed for insertion onto hard or soft substrates with the junction side down. They can be
mounted with electrically conductive epoxy or with a low temperature solder preform. However,
Sn rich solders
are not recommended due to the tungsten metallization scheme beneath the gold contacts. Indalloy or
80/20, Au/Sn, solders are acceptable. Maximum soldering temperature must be < 300°C for < 10 sec. These
chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be
mounted onto silkscreened circuits using electrically conductive Ag epoxy, approximately 1-2 mils in
thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times,
> 30 minutes, temperatures must be below 200 °C.
The die can also be assembled with the junction side up,
and wire or ribbon bonds made to the pads.
Circuit Mounting Dimensions ( Inches )
0.013”
0.012” (2) PL
0.008”
(2) PL
Ordering Information
The MA4FCP305 flip chip diode may be ordered in either waffle packs, tape and reel or 6” rings mounted on
tape per the table below. Tape and reel dimensions are provided in
Application Note M513
located on the
M/A-COM website @
www.macom.com.
Part Number
MA4FCP305
MADP-007161-01269T
MADP-000305-12690R
3
Packaging
Die in Waffle Pack
Tape & Reel
Wafer on Tape Frame
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
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