OT PLD, 20ns, CMOS, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
零件包装代码 | QLCC |
包装说明 | QCCN, |
针数 | 20 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
其他特性 | 1 EXTERNAL CLOCK |
最大时钟频率 | 28.5 MHz |
JESD-30 代码 | S-CQCC-N20 |
JESD-609代码 | e0 |
长度 | 8.89 mm |
专用输入次数 | 8 |
I/O 线路数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 8 DEDICATED INPUTS, 2 I/O |
输出函数 | MIXED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
可编程逻辑类型 | OT PLD |
传播延迟 | 20 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.905 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 8.89 mm |
Base Number Matches | 1 |
5962-8871311XA | 5962-8871309RA | 5962-8867808RA | 5962-8867809RA | 5962-8871304RA | PALC16R6-25WI | |
---|---|---|---|---|---|---|
描述 | OT PLD, 20ns, CMOS, CQCC20, CERAMIC, LCC-20 | OT PLD, 20ns, CMOS, CDIP20, 0.300 INCH, CERDIP-20 | UV PLD, 30 ns, CDIP20, 0.300 INCH, WINDOWED, CERDIP-20 | UV PLD, 20ns, CMOS, CDIP20, 0.300 INCH, WINDOWED, CERDIP-20 | OT PLD, 40 ns, CDIP20, 0.300 INCH, CERDIP-20 | UV PLD, 25ns, CDIP20, 0.300 INCH, WINDOWED, CERDIP-20 |
零件包装代码 | QLCC | DIP | DIP | DIP | DIP | DIP |
包装说明 | QCCN, | DIP, | WDIP, | WDIP, | DIP, | WDIP, |
针数 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 8.89 mm | 24.13 mm | 24.13 mm | 24.13 mm | 24.13 mm | 24.13 mm |
专用输入次数 | 8 | 10 | 8 | 10 | 8 | 8 |
I/O 线路数量 | 2 | 6 | 4 | 6 | 4 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C |
组织 | 8 DEDICATED INPUTS, 2 I/O | 10 DEDICATED INPUTS, 6 I/O | 8 DEDICATED INPUTS, 4 I/O | 10 DEDICATED INPUTS, 6 I/O | 8 DEDICATED INPUTS, 4 I/O | 8 DEDICATED INPUTS, 2 I/O |
输出函数 | MIXED | COMBINATORIAL | MIXED | COMBINATORIAL | MIXED | MIXED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DIP | WDIP | WDIP | DIP | WDIP |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE | IN-LINE, WINDOW |
可编程逻辑类型 | OT PLD | OT PLD | UV PLD | UV PLD | OT PLD | UV PLD |
传播延迟 | 20 ns | 20 ns | 30 ns | 20 ns | 40 ns | 25 ns |
认证状态 | Not Qualified | Not Qualified | MILITARY | Not Qualified | MILITARY | COMMERCIAL |
座面最大高度 | 1.905 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 8.89 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
其他特性 | 1 EXTERNAL CLOCK | - | 1 EXTERNAL CLOCK | - | 1 EXTERNAL CLOCK | 1 EXTERNAL CLOCK |
最大时钟频率 | 28.5 MHz | - | 22 MHz | - | 16.5 MHz | 28.5 MHz |
厂商名称 | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
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