IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DFP |
| 包装说明 | CERAMIC, FP-20 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | R-CDFP-F20 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 最大电源电流（ICC） | 55 mA |
| 传播延迟（tpd） | 8.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.9215 mm |
| Base Number Matches | 1 |
| 54F373/BSA | 54F373/B2A | 54F373/BRA | 54F374/B2A | 54F374/BRA | 54F374/BSA | |
|---|---|---|---|---|---|---|
| 描述 | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LLCC-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LLCC-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | DFP | QLCC | DIP | QLCC | DIP | DFP |
| 包装说明 | CERAMIC, FP-20 | QCCN, | DIP, | CERAMIC, LLCC-20 | DIP, | DFP, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | - |
| JESD-30 代码 | R-CDFP-F20 | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 位数 | 8 | 8 | 8 | 8 | 8 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | - |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | DFP | QCCN | DIP | QCCN | DIP | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | - |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | - |
| 最大电源电流（ICC） | 55 mA | 55 mA | 55 mA | 86 mA | 86 mA | - |
| 传播延迟（tpd） | 8.5 ns | 8.5 ns | 8.5 ns | 11.5 ns | 11.5 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 2.54 mm | 1.905 mm | 5.08 mm | 1.905 mm | 5.08 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | YES | YES | NO | YES | NO | - |
| 技术 | TTL | TTL | TTL | TTL | TTL | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | - |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | - |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | - |
| 宽度 | 6.9215 mm | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm | - |
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