Decimal Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CQCC20, LCC-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 系列 | TTL/H/L |
| 输入调节 | STANDARD |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | DECIMAL DECODER/DRIVER |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | CONFIGURABLE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 最大电源电流（ICC） | 40 mA |
| 传播延迟（tpd） | 32 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| AM25LS2537LC | AM25LS2537LM | AM25LS2537DC | AM25LS2537XC | AM25LS2537DM | AM25LS2537FM | AM25LS2537PC | AM25LS2537XM | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Decimal Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CQCC20, LCC-20 | Decimal Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CQCC20, LCC-20 | Decimal Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CDIP20, CERDIP-20 | Decimal Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, 0.081 X 0.096 INCH, DIE | Decimal Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CDIP20, CERDIP-20 | Decimal Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, FP-20 | Decimal Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, PDIP20, PLASTIC, DIP-20 | Decimal Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, 0.081 X 0.096 INCH, DIE |
| 零件包装代码 | QLCC | QLCC | DIP | DIE | DIP | DFP | DIP | DIE |
| 包装说明 | QCCN, LCC20,.35SQ | QCCN, | DIP, DIP20,.3 | DIE, DIE OR CHIP | DIP, DIP20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | DIE, DIE OR CHIP |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | R-CDIP-T20 | R-XUUC-N20 | R-CDIP-T20 | R-XDFP-F20 | R-PDIP-T20 | R-XUUC-N20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | QCCN | QCCN | DIP | DIE | DIP | DFP | DIP | DIE |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | UNCASED CHIP | IN-LINE | FLATPACK | IN-LINE | UNCASED CHIP |
| 最大电源电流（ICC） | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA |
| 传播延迟（tpd） | 32 ns | 39 ns | 32 ns | 32 ns | 39 ns | 39 ns | 32 ns | 39 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | YES | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY |
| 端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD |
| 端子位置 | QUAD | QUAD | DUAL | UPPER | DUAL | DUAL | DUAL | UPPER |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
| JESD-609代码 | e0 | - | e0 | - | e0 | e0 | e0 | - |
| 长度 | 8.89 mm | 8.89 mm | 24.4602 mm | - | 24.4602 mm | 12.827 mm | 26.289 mm | - |
| 封装等效代码 | LCC20,.35SQ | - | DIP20,.3 | DIE OR CHIP | DIP20,.3 | FL20,.3 | DIP20,.3 | DIE OR CHIP |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 座面最大高度 | 2.54 mm | 2.54 mm | 5.08 mm | - | 5.08 mm | 2.159 mm | 5.08 mm | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 8.89 mm | 8.89 mm | 7.62 mm | - | 7.62 mm | 6.731 mm | 7.62 mm | - |
| 厂商名称 | - | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
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