Bus Driver
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Nexperia |
| 包装说明 | SSOP, |
| Reach Compliance Code | compliant |
| 系列 | CBT/FST/QS/5C/B |
| JESD-30 代码 | R-PDSO-G24 |
| 长度 | 8.7 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 0.25 ns |
| 座面最大高度 | 1.73 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| CBTD3861DK,118 | CBTD3861PW | 935291685118 | 935291686118 | 935291684118 | CBTD3861DK | CBTD3861BQ | |
|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver | Bus Driver | Bus Driver | CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24 | Bus Driver | Bus Driver | Bus Driver |
| 包装说明 | SSOP, | TSSOP, | , | TSSOP, | HVQCCN, | SSOP, | HVQCCN, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Nexperia | Nexperia | Nexperia | - | - | Nexperia | Nexperia |
| 系列 | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | - | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | - | R-PDSO-G24 | R-PQCC-N24 | R-PDSO-G24 | R-PQCC-N24 |
| 长度 | 8.7 mm | 7.8 mm | - | 7.8 mm | 5.5 mm | 8.7 mm | 5.5 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | - | 1 |
| 位数 | 10 | 10 | - | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | - | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | - | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | TSSOP | - | TSSOP | HVQCCN | SSOP | HVQCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 传播延迟（tpd） | 0.25 ns | 0.25 ns | - | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
| 座面最大高度 | 1.73 mm | 1.1 mm | - | 1.1 mm | 1 mm | 1.73 mm | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | - | GULL WING | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | 0.635 mm | 0.65 mm | - | 0.65 mm | 0.5 mm | 0.635 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 4.4 mm | - | 4.4 mm | 3.5 mm | 3.9 mm | 3.5 mm |
| JESD-609代码 | - | e4 | - | e4 | e4 | - | e4 |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
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