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7134LA70L48BG

产品描述Dual-Port SRAM, 4KX8, 70ns, CQCC48, LCC-48
产品类别存储    存储   
文件大小149KB,共11页
制造商IDT (Integrated Device Technology)
标准
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7134LA70L48BG概述

Dual-Port SRAM, 4KX8, 70ns, CQCC48, LCC-48

7134LA70L48BG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码LCC
包装说明QCCN,
针数48
Reach Compliance Codecompliant
ECCN代码3A001.A.2.C
最长访问时间70 ns
其他特性AUTOMATIC POWER-DOWN; BATTERY BACKUP
JESD-30 代码S-CQCC-N48
JESD-609代码e3
长度14.224 mm
内存密度32768 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度8
功能数量1
端子数量48
字数4096 words
字数代码4000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织4KX8
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装形状SQUARE
封装形式CHIP CARRIER
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度3.048 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层MATTE TIN
端子形式NO LEAD
端子节距1 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14.224 mm
Base Number Matches1

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HIGH-SPEED
4K x 8 DUAL-PORT
STATIC SRAM
Features
High-speed access
– Military: 25/35/45/55/70ns (max.)
– Industrial: 55ns (max.)
– Commercial: 20/25/35/45/55/70ns (max.)
Low-power operation
– IDT7134SA
Active: 700mW (typ.)
Standby: 5mW (typ.)
– IDT7134LA
Active: 700mW (typ.)
Standby: 1mW (typ.)
Fully asynchronous operation from either port
Battery backup operation—2V data retention
TTL-compatible; single 5V (±10%) power supply
Available in 48-pin DIP, LCC, Flatpack and 52-pin PLCC
Military product compliant to MIL-PRF-38535 QML
Industrial temperature range (–40°C to +85°C) is available for
selected speeds
IDT7134SA/LA
Description
x
x
x
x
x
x
x
x
The IDT7134 is a high-speed 4K x 8 Dual-Port Static RAM
designed to be used in systems where on-chip hardware port arbitration
is not needed. This part lends itself to those systems which cannot
tolerate wait states or are designed to be able to externally arbitrate or
withstand contention when both sides simultaneously access the
same Dual-Port RAM location.
The IDT7134 provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access
for reads or writes to any location in memory. It is the user’s responsibility
to ensure data integrity when simultaneously accessing the same
memory location from both ports. An automatic power down feature,
controlled by
CE,
permits the on-chip circuitry of each port to enter a
very low standby power mode.
Fabricated using IDT’s CMOS high-performance technology, these
Dual-Port typically operate on only 700mW of power. Low-power (LA)
versions offer battery backup data retention capability, with each port
typically consuming 200µW from a 2V battery.
The IDT7134 is packaged on either a sidebraze or plastic 48-pin
DIP, 48-pin LCC, 52-pin PLCC and 48-pin Flatpack. Military grade
product is manufactured in compliance with the latest revision of MIL-
PRF-38535 QML, making it ideally suited to military temperature
applications demanding the highest level of performance and reliability.
Functional Block Diagram
R/W
L
CE
L
R/W
R
CE
R
OE
L
I/O
0L
- I/O
7L
COLUMN
I/O
COLUMN
I/O
OE
R
I/O
0R
- I/O
7R
A
0L
- A
11L
LEFT SIDE
ADDRESS
DECODE
LOGIC
MEMORY
ARRAY
RIGHT SIDE
ADDRESS
DECODE
LOGIC
A
0R
- A
11R
2720 drw 01
JUNE 1999
1
DSC-2720/9

7134LA70L48BG相似产品对比

7134LA70L48BG 7134SA55JGI8 7134SA35L48BG 7134SA55L48BG 7134LA35L48BG 7134SA70L48BG
描述 Dual-Port SRAM, 4KX8, 70ns, CQCC48, LCC-48 Dual-Port SRAM, 4KX8, 55ns, CMOS, PQCC52, PLASTIC, LCC-52 Dual-Port SRAM, 4KX8, 35ns, CQCC48, LCC-48 Dual-Port SRAM, 4KX8, 55ns, CQCC48, LCC-48 Dual-Port SRAM, 4KX8, 35ns, CQCC48, LCC-48 Dual-Port SRAM, 4KX8, 70ns, CQCC48, LCC-48
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合
零件包装代码 LCC LCC LCC LCC LCC LCC
包装说明 QCCN, QCCJ, LDCC52,.8SQ QCCN, LCC-48 QCCN, QCCN,
针数 48 52 48 48 48 48
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 3A001.A.2.C EAR99 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
最长访问时间 70 ns 55 ns 35 ns 55 ns 35 ns 70 ns
其他特性 AUTOMATIC POWER-DOWN; BATTERY BACKUP BATTERY BACK-UP OPERATION AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN; BATTERY BACKUP AUTOMATIC POWER-DOWN
JESD-30 代码 S-CQCC-N48 S-PQCC-J52 S-CQCC-N48 S-CQCC-N48 S-CQCC-N48 S-CQCC-N48
JESD-609代码 e3 e3 e3 e3 e3 e3
长度 14.224 mm 19.1262 mm 14.224 mm 14.224 mm 14.224 mm 14.224 mm
内存密度 32768 bit 32768 bit 32768 bit 32768 bit 32768 bit 32768 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 8 8 8 8 8 8
功能数量 1 1 1 1 1 1
端子数量 48 52 48 48 48 48
字数 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words
字数代码 4000 4000 4000 4000 4000 4000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 85 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -40 °C -55 °C -55 °C -55 °C -55 °C
组织 4KX8 4KX8 4KX8 4KX8 4KX8 4KX8
封装主体材料 CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 QCCN QCCJ QCCN QCCN QCCN QCCN
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.048 mm 4.57 mm 3.048 mm 3.048 mm 3.048 mm 3.048 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY INDUSTRIAL MILITARY MILITARY MILITARY MILITARY
端子面层 MATTE TIN Matte Tin (Sn) - annealed MATTE TIN MATTE TIN MATTE TIN MATTE TIN
端子形式 NO LEAD J BEND NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 1 mm 1.27 mm 1 mm 1 mm 1 mm 1 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 14.224 mm 19.1262 mm 14.224 mm 14.224 mm 14.224 mm 14.224 mm
Base Number Matches 1 1 1 1 1 1
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) -

 
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