F-213 SUPPLEMENT
MEC8–140–02–L–D–EM2
MEC8–160–02–L–D–EM2
(0,80 mm) .0315"
MEC8-RA, MEC8-EM SERIES
MEC8–110–02–L–D–RA1
MEC8–140–02–L–D–RA1
RIGHT ANGLE/EDGE MOUNT SOCKETS
Mates with:
(1,60 mm) .062" thick cards
MEC8
1
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC8-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(3,94 mm) .155" to
POSITIONS
(6,25 mm) .246"
A
B
PER ROW
Current Rating:
(18,90) (36,60)
1.8A per contact
40
.744 1.441
@ 30°C
(22,90) (44,60)
Temperature Rise
50
.902 1.756
Voltage Rating:
265 VAC
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
POSITIONS
PER ROW
02
PLATING
OPTION
D
RA1
OTHER
OPTION
–TR
10, 13, 20, 25, 30, 37, 40, 49, 50
No. of Positions x (0,80) .0315 + (3,00) .118
02
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
= Tape & Reel
Packaging
(7,40)
.291
01
(0,80) .0315
No. of Positions x (0,80) .0315 + (6,20) .244
MEC8-RA
Rated @ 3dB Insertion Loss*
5,78 mm Stack Height
Single-Ended Signaling
6.5 GHz / 13 Gbps
Differential Pair Signaling
8.0 GHz / 16 Gbps
*Performance data includes effects of a non-optimized PCB.
Complete test data available at www.samtec.com?MEC8-RA
or contact sig@samtec.com
A
B
(1,80)
.071
(5,77)
.227 (2,65)
.104
(3,53)
.139
(0,95)
.037
(9,10)
.358
APPLICATION
SPECIFIC
• 1 mm mating card
thickness option
• Latching option
Call Samtec.
(2,00) .0787
(0,90) .035 x
(1,40) .055 DIA
(4,00)
.157
(1,40)
.055
DIA
(1,05)
.041
Mates with:
(1,60 mm) .062" thick cards
MEC8
1
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC8-EM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(4,32 mm) .170" to
(5,66 mm) .223"
Current Rating:
1.8A per contact @ 30°C
Temperature Rise
Voltage Rating:
265 VAC
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes
POSITIONS
PER ROW
02
PLATING
OPTION
D
–EM2
–EM2
10, 20, 30, 40, 50, 60, 70
No. of Positions x (0,80) .0315 + (7,80) .307
02
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
= (1,60 mm) .062"
thick PCB
A
B
APPLICATION
SPECIFIC OPTION
(7,00)
.276
(1,80)
.071
01
1 mm mating card thickness option.
Call Samtec.
POSITIONS
PER ROW
40
(2,00) .0787
(4,00) .157
No. of Positions x (0,80) .0315 + (4,60) .181
A
B
(8,50)
.335
(18,90) (36,60)
.744
1.441
(22,90) (44,60)
.902
1.756
(26,90) (52,60)
1.059 2.071
(30,90) (60,60)
1.217 2.386
50
60
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(5,00)
.197
(0,80)
.0315
(1,48)
.058
70
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