48SD3208
256 Mb SDRAM
8-Meg X 8-Bit X 4-Banks
Logic Diagram
(One Amplifier)
Memory
F
EATURES
:
• 256 Megabit ( 8-Meg X 8-Bit X 4-Banks)
• RAD-PAK® radiation-hardened against natural space
radiation
• Total Dose Hardness:
>100 krad (Si), depending upon space mission
• Excellent Single Event Effects:
SEL
TH
>85 MeV/mg/cm
2
@ 25
°
C
D
ESCRIPTION
:
Maxwell Technologies’ Synchronous Dynamic Random
Access Memory (SDRAM) is ideally suited for space
applications requiring high performance computing and
high density memory storage. As microprocessors
increase in speed and demand for higher density mem-
ory escalates, SDRAM has proven to be the ultimate
solution by providing bit-counts up to 256 Mega Bits and
speeds up to 100 Megahertz. SDRAMs represent a sig-
nificant advantage in memory technology over traditional
SRAMs including the ability to burst data synchronously
at high rates with automatic column-address generation,
the ability to interleave between banks masking pre-
charge time.
Maxwell Technologies’ patented R
AD
-P
AK
®
packaging
technology incorporates radiation shielding in the micro-
circuit package. It eliminates the need for box shielding
for a lifetime in orbit or space mission. In a typical GEO
orbit, R
AD
-P
AK
®
provides greater than 100 krads(Si)
radiation dose tolerance. This product is available with
screening up to Maxwell Technologies self-defined Class
K.
01.10.05 Rev 2
•
•
•
•
•
•
•
•
•
•
•
JEDEC Standard 3.3V Power Supply
Operating Current: 115 mA
Clock Frequency: 100 MHz Operation
Operating tremperature: -55 to +125
°
C
Auto Refresh
Single pulsed RAS
2 Burst Sequence variations
Sequential (BL =1/2/4/8)
Interleave (BL = 1/2/4/8)
Programmable CAS latency: 2/3
Power Down and Clock Suspend Modes
LVTTL Compatible Inputs and Outputs
Package: 72-Pin R
AD
-P
AK
®
Flat Package
All data sheets are subject to change without notice
1
(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com
©2005 Maxwell Technologies
All rights reserved.
256Mb (8-Meg X 8-Bit X 4-Banks) SDRAM
48SD3208
Pinout Description
Pin Descriptions
Pin Name
PKGGND
A0 to A12
BA0, BA1
Address Input
Row Address A0 to A12
Column Address A0 to A9
Bank Select Address BA0/BA1 (BS)
DQ0 to DQ7
CS\
RAS\
CAS\
WE\
DQM
CLK
CKE
Vcc
Vss
VccQ
VssQ
NC
Data-Input/Output
Chip Select
Row Address Strobe
Column Address Strobe
Write Enable
Input/Output Mask
Clock Input
Clock Enable
Power for internal circuits
Ground for internal circuits
Power for DQ circuits
Ground for DQ circuits
No Connection
Function
Package Ground
Memory
01.10.05 Rev 2
All data sheets are subject to change without notice
2
©2005 Maxwell Technologies
All rights reserved.
256Mb (8-Meg X 8-Bit X 4-Banks) SDRAM
‘
48SD3208
T
ABLE
1. A
BSOLUTE
M
AXIMUM
R
ATINGS
P
ARAMETER
Voltage on any pin relative to V
SS
Supply voltage relative to V
SS
Short circuit output current
Power Dissipation
Thermal Resistance
Operating Temperature
Storage Temperature
S
YMBOL
V
IN
V
OUT
V
CC
I
OUT
P
D
Tjc
T
OPR
T
STG
M
AX
-0.5 to VCC + 0.5
(< 4.6(max))
-0.5 to +4.6
50
1.0
1.5
-55 to +125
-65 to +150
U
NIT
V
V
mA
W
°C/W
°C
°C
T
ABLE
2. R
ECOMMENDED
O
PERATING
C
ONDITIONS
(V
CC
= 3.3V + 0.3V, V
CC
Q = 3.3V + 0.3V, T
A
= -55
TO
125°C,
UNLESS OTHERWISE SPECIFIED
)
Memory
S
YMBOL
M
IN
M
AX
1,2
V
CC
, V
CCQ
3.0
3.6
3
V
SS
, V
SSQ
0
0
1,4
Input High Voltage
V
IH
2.0
V
CC
+ 0.3
1,5
Input Low Voltage
V
IL
-0.3
0.8
1. All voltage referred to VSS
2. The supply voltage with all
V
CC
and V
CCQ
pins must be on the same level
3. The supply voltage with all V
SS
and V
SSQ
pins must be on the same level
4.
5.
V
IH
(max) =
V
DD
+2.0V for pulse width
<3ns
at
V
CC
V
IL
(min) =
V
SS
-2.0V for pulse width
<3ns
at
V
SS
P
ARAMETER
Supply Voltage
U
NIT
V
V
V
V
T
ABLE
3. D
ELTA
L
IMITS
P
ARAMETER
I
CC1
I
CC2P
I
CC2PS
I
CC2N
I
CC2NS
D
ESCRIPTION
Operational Current
Power Down Standby Current
V
ARIATION1
±10%
±10%
±10%
I
CC3P
I
CC3PS
I
CC3PN
I
CC3NS
Active Standby Current
1.
±10% of value specified in Table 4
T
ABLE
4. DC E
LECTRICAL
C
HARACTERISTICS
(V
CC
= 3.3V + 0.3V, V
CC
Q = 3.3V + 0.3V, T
A
= -55
TO
125°C,
UNLESS OTHERWISE SPECIFIED
)
P
ARAMETER
Operating Current
1,2,3
S
YMBOL
I
CC1
T
EST
C
ONDITIONS
Burst length CAS Latency = 2
=1
CAS Latency = 3
t
RC
= min
CKE = V
IL
t
CK
= 12 ns
S
UBGROUPS
1, 2, 3
M
IN
M
AX
115
115
1, 2, 3
3
mA
U
NITS
mA
Standby Current in Power Down
4
I
CC2P
01.10.05 Rev 2
All data sheets are subject to change without notice
3
©2005 Maxwell Technologies
All rights reserved.
256Mb (8-Meg X 8-Bit X 4-Banks) SDRAM
T
ABLE
4. DC E
LECTRICAL
C
HARACTERISTICS
48SD3208
S
UBGROUPS
1, 2, 3
M
IN
M
AX
2
U
NITS
mA
(V
CC
= 3.3V + 0.3V, V
CC
Q = 3.3V + 0.3V, T
A
= -55
TO
125°C,
UNLESS OTHERWISE SPECIFIED
)
P
ARAMETER
Standby Current in Power Down
( input signal stable)
5
Standby Current in non power down
6
Standby Current in non power down
( Input signal stable)
7
Active standby current in
power down
1, 2, 4
Active standby current in power down
(input signal stable)
2, 5
Active standby power in
non power down
1,2, 6
Active standby current in non power
down ( input signal stable)
2,7
Burst Operating Current1
1,2,8
CAS Latency = 2
CAS Latency = 3
Refresh Current
3
Self Refresh current
9
Input Leakage Current
Output Leakage Current
Output high voltage
S
YMBOL
I
CC2PS
T
EST
C
ONDITIONS
CKE = V
IL
t
CK
= 0
CKE, CS = V
IH
t
CK
= 12 ns
CKE = V
IH
t
CK
= 0
CKE = V
IL
t
CK
= 12 ns
CKE = V
IL
t
CK
= 0
CKE, CS = V
IH
t
CK
= 12 ns
CKE = V
IH
t
CK
= 0
t
CK
= min
BL = 4
t
RC
= min
V
IH
>V
CC
- 0.2V
V
IL
< 0.2 V
0<V
IN
<V
CC
0<VOUT<V
CC
I
OH
= -4mA
I
CC2N
I
CC2NS
I
CC3P
I
CC3PS
I
CC3N
I
CC3NS
I
CC4
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
20
9
4
3
30
15
mA
mA
mA
mA
mA
mA
mA
Memory
110
145
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
-1
-1.5
2.4
220
3
1
1.5
mA
mA
uA
uA
V
I
CC5
I
CC6
I
LI
I
LO
V
OH
I
OL
= 4 mA
1, 2, 3
0.4
V
Output low voltage
V
OL
1. I
CC1
depends on output load conditions when the device is selected. I
CC1
(max) is specified with the output open.
2. One bank operation.
3. Input Signals are changed once per one clock.
4. After power down mode, CLK operating current.
5. After power down mode, no CLK operating current.
6. Input signals are changed once per two clocks.
7. Input signals are V
IH
or V
IL
fixed.
8. Input signals are changed once per four clocks.
9. After self refresh mode set, self refresh current. Self refresh mode Should be used at temperatures below 70
°C
01.10.05 Rev 2
All data sheets are subject to change without notice
4
©2005 Maxwell Technologies
All rights reserved.
256Mb (8-Meg X 8-Bit X 4-Banks) SDRAM
T
ABLE
5. AC Electrical Characteristics
48SD3208
M
IN
10
7.5
T
YP
M
AX
U
NIT
ns
(V
CC
=3.3V + 0.3V, V
CC
Q = 3.3V + 0.3V, T
A
= -55
TO
125°C,
UNLESS OTHERWISE SPECIFIED
)
P
ARAMETER
System clock cycle time
1
(CAS latency = 2)
(CAS latency = 3)
CLK high pulse width
1,7
CLK low pulse width
1,7
Access time from CLK
1,2
(CAS latency = 2)
(CAS latency = 3)
Data-out hold time
1,2
CLK to Data-out low impedance
1,2,3,7
CLK to Data-out high impedance
1,4,7
(CAS latency = 2, 3)
Input setup time
1, 5,6
CKE setup time for power down exit
1
Input hold time
1,6
Ref/Active to Ref/Active command period
1
Active to Precharge command period
1
Active command to column command
(same bank)
1
Precharge to Active command period
1
Write recovery or data-in to precharge lead time
1
Active( a) to Active (b) command period
1
Transition time(rise and fall)
7
Refresh Period
S
YMBOL
t
CK
S
UBGROUPS
9, 10, 11
t
CKH
t
CKL
t
AC
9, 10, 11
9, 10, 11
9, 10, 11
2.5
2.5
6
6
ns
ns
ns
t
OH
t
LZ
t
HZ
t
AS
, t
CS,
t
DS
, t
CES
t
CESP
t
AH
, t
CH
, t
DH
t
CEH
t
RC
t
RAS
t
RCD
t
RP
t
DPL
t
RRD
t
T
t
REF
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
@ 105 °C
@ 85 °C
2.7
2
5.4
1.5
1.5
1.5
70
50
20
20
20
20
1
16
32
64
5
6.4
16
8
120000
ns
ns
ns
ns
Memory
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
@ 70 °C
128
1. AC measurement assumes t
T
=1ns. Reference level for timing of output signals is 1.5V.
2. Access time is measured at 1.5V.
3. t
LZ
(min) defines the time at which the outputs achieve the low impedance state.
4. t
HZ
defienes the time at which the outputs achieve the high impedance state.
5. t
CES
defines CKE setup time to CLK rising edge except for the power down exit command.
6. t
AS
/t
AH
: Address, t
CS
/t
CH
: /CS, /RAS, /CAS, /WE, DQM
7. Guarenteed by design. (Not tested)
8. Guarenteed by Device Characterization Testing. (Not 100% Tested)
01.10.05 Rev 2
All data sheets are subject to change without notice
5
©2005 Maxwell Technologies
All rights reserved.
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