IC,LOGIC GATE,DUAL 4-INPUT NOR,HC-CMOS,DIP,14PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | NOR GATE |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 2/6 V |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | 38535Q/M;38534H;883B |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 54HC4002/BCAJC | MC74HC4002JDS | MC74HC4002ND | MC54HC4002JD | MC74HC4002DR2 | MC74HC4002DD | |
|---|---|---|---|---|---|---|
| 描述 | IC,LOGIC GATE,DUAL 4-INPUT NOR,HC-CMOS,DIP,14PIN,CERAMIC | IC,LOGIC GATE,DUAL 4-INPUT NOR,HC-CMOS,DIP,14PIN,CERAMIC | IC,LOGIC GATE,DUAL 4-INPUT NOR,HC-CMOS,DIP,14PIN,PLASTIC | IC,LOGIC GATE,DUAL 4-INPUT NOR,HC-CMOS,DIP,14PIN,CERAMIC | IC,LOGIC GATE,DUAL 4-INPUT NOR,HC-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,DUAL 4-INPUT NOR,HC-CMOS,SOP,14PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | SOP | SOP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| 施密特触发器 | NO | NO | NO | NO | NO | NO |
| 表面贴装 | NO | NO | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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