PD-2.442
HFA100MD60C
HEXFRED
Features
• Reduced RFI and EMI
• Reduced Snubbing
• Extensive Characterization of Recovery Parameters
TM
Ultrafast, Soft Recovery Diode
LUG
LUG
LUG
TERMINAL TERMINAL TERMINAL
ANODE 1 CATHODE ANODE 2
V
R
= 600V
V
F
= 1.4V
Q
rr
* = 780nC
BASE (ISOLATED)
di
(rec)M
/dt * = 240A/µs
*
125°C
Description
HEXFRED diodes are optimized to reduce losses and EMI/RFI in high frequency
power conditioning systems. An extensive characterization of the recovery
behavior for different values of current, temperature and di/dt simplifies the
calculations of losses in the operating conditions. The softness of the recovery
eliminates the need for a snubber in most applications. These devices are
ideally suited for power converters, motors drives and other applications where
switching losses are significant portion of the total losses.
TM
TO-244AB
(ISOLATED)
Absolute Maximum Ratings (per Leg)
Parameter
V
R
I
F
@ T
C
= 25°C
I
F
@ T
C
= 100°C
I
FSM
I
AS
E
AS
P
D
@ T
C
= 25°C
P
D
@ T
C
= 100°C
T
J
T
STG
Cathode-to-Anode Voltage
Continuous Forward Current
Continuous Forward Current
Single Pulse Forward Current
Maximum Single Pulse Avalanche Current
Non-Repetitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Max.
600
83
40
400
2.0
220
180
71
-55 to +150
Units
V
A
µJ
W
C
Thermal - Mechanical Characteristics
Parameter
R
θ
JC
R
θ
CS
Wt
Junction-to-Case, Single Leg Conducting
Junction-to-Case, Both Legs Conducting
Case-to-Sink, Flat , Greased Surface
Weight
Mounting Torque
See Fig. 12
Terminal Torque
Limited by junction temperature
L = 100µH, duty cycle limited by max T
J
Min.
––––
––––
––––
––––
35 (4.0)
50 (5.7)
Typ.
––––
––––
0.10
79 (2.8)
––––
––––
Max.
0.70
0.35
––––
––––
50 (5.7)
75 (8.5)
Units
°C/W
K/W
g (oz)
lbf•in
(N•m)
Note:
Revision 0
HFA100MD60C
Electrical Characteristics (per Leg) @ T = 25°C (unless otherwise specified)
J
Parameter
V
BR
V
FM
Cathode Anode Breakdown Voltage
Max Forward Voltage
Min. Typ. Max. Units
600
–––
–––
1.2
1.4
1.1
4.0
1.0
140
7.0
–––
1.4
1.6
1.3
20
4.0
250
–––
V
V
µA
mA
pF
nH
Test Conditions
I
R
= 100µA
I
F
= 50A
I
F
= 100A
I
F
= 50A, T
J
= 125°C
V
R
= V
R
Rated
T
J
= 125°C, V
R
= 480V
V
R
= 200V
From top of terminal hole to mounting
plane
I
RM
C
T
L
S
Max Reverse Leakage Current
Junction Capacitance
Series Inductance
–––
–––
Dynamic Recovery Characteristics (per Leg) @ T = 25°C (unless otherwise specified)
J
Parameter
t
rr
t
rr1
t
rr2
I
RRM1
I
RRM2
Q
rr1
Q
rr2
di
(rec)M
/dt1
di
(rec)M
/dt2
Reverse Recovery Time
Min. Typ. Max. Units
–––
–––
–––
–––
–––
–––
–––
–––
–––
33 –––
76 115
ns
130 200
8.0
15
A
12
22
300 900
nC
780 2200
340 –––
A/µs
240 –––
Test Conditions
I
F
= 1.0A, di
f
/dt = 200A/µs, V
R
= 30V
T
J
= 25°C
T
J
= 125°C
I
F
= 50A
T
J
= 25°C
T
J
= 125°C
V
R
= 200V
T
J
= 25°C
T
J
= 125°C
di
f
/dt = 200A/µs
T
J
= 25°C
T
J
= 125°C
Peak Recovery Current
Reverse Recovery Charge
Peak Rate of Fall of Recovery Current
During t
b
80.01 (3.150)
40.26 (1.585)
39.75 (1.565)
20.32 (0.800)
17.78 (0.700)
7.49 (0.295)
6.99 (0.275)
(2 PLCS.)
DIA.
34.925 (1.375)
REF.
63.50 (2.500)
60.96 (2.400)
LEAD ASSIGNMENTS
1 - ANODE
2 - CATHODE
3 - ANODE
1/4-20 SLOTTED HEX
1
23.55 (0.927)
20.42 (0.804)
2
3
OUTLINE TO-244AB (ISOLATED)
Dimensions in Millimeters and (Inches)
15.75 (0.620)
14.99 (0.590)
92.71 (3.650)
90.17 (3.550)
3.35 (0.132)
3.02 (0.119)
HFA100MD60C
1000
10000
Reverse Current - I
R
(µA)
T = 150°C
J
1000
100
T = 125°C
J
Instantaneous Forward Current - I
F
(A)
10
100
T
J
= 150°C
T
J
= 125°C
T
J
= 25°C
1
TJ = 25°C
0.1
0
200
400
600
Reverse Voltage - V
R
(V)
Junction Capacitance - C
T
(pF)
10
Fig. 2
- Typical Reverse Current vs. Reverse
Voltage, (per Leg)
10000
A
1000
T = 25°C
J
1
0.0
100
1.0
2.0
3.0
Forward Voltage Drop - V
FM
(V)
Fig. 1
- Maximum Forward Voltage Drop
vs. Instantaneous Forward Current,
(per Leg)
10
1
10
100
1000
Reverse Voltage - V
R
(V)
Fig. 3
- Typical Junction Capacitance vs.
Reverse Voltage, (per Leg)
1
Thermal Impedance - Z
thJC
(K/W)
0.1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
P
D M
t
1
t2
0.01
Single Pulse
(Thermal Resistance)
N otes:
1. D uty factor D = t / t
1 2
2. Peak TJ = PD M x Z thJC + T C
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
t
1
, Rectangular Pulse Duration (Seconds)
Fig. 4
- Maximum Thermal Impedance Z Characteristics, (per Leg)
thjc
HFA100MD60C
200
100
V
R
= 200V
T
J
= 125°C
T
J
= 25°C
160
V
R
= 200V
T
J
= 125°C
T
J
= 25°C
I
F
= 100A
I
IRRM
- (A)
I
F
= 50A
I
F
= 30A
10
t
rr
- (ns)
120
I
F
= 100A
I
F
= 50A
I
F
= 30A
80
40
100
di f /dt - (A/µs)
1000
1
100
di
f
/dt - (A/µs)
1000
Fig. 5
- Typical Reverse Recovery vs. di
f
/dt,
(per Leg)
3000
Fig. 6
- Typical Recovery Current vs. di
f
/dt,
(per Leg)
10000
V
R
= 200V
T
J
= 125°C
T
J
= 25°C
V
R
= 200V
T
J
= 125°C
T
J
= 25°C
2000
I
F
= 100A
I
F
= 50A
I
F
= 30A
di(rec)M/dt - (A/µs)
Q
RR
- (nC)
I
F
= 140A
1000
I
F
= 70A
I
F
= 30A
1000
0
100
di
f
/dt - (A/µs)
1000
100
100
di
f
/dt - (A/µs)
1000
Fig. 7
- Typical Stored Charge vs. di/dt,
f
(per Leg)
Fig. 8
- Typical di
(rec)M
/dt vs. di
f
/dt,
(per Leg)
HFA100MD60C
3
I
F
t
rr
t
a
t
b
4
REVERSE RECOVERY CIRCUIT
V
R
= 200V
0
Q
rr
2
I
RRM
0.5 I
RRM
di(rec)M/dt
5
0.01
Ω
L = 70µH
D.U.T.
D
G
IRFP250
S
1
0.75 I
RRM
di
f
/dt
dif/dt
ADJUST
4. Q
rr
- Area under curve defined by
r
t
r
and I
RRM
t
rr
X I
RRM
Q
rr
=
2. I
RRM
- Peak reverse recovery current
2
3. trr - Reverse recovery time measured
from zero crossing point of negative 5. di
(rec)M
/dt - Peak rate of change of
current during t portion of t
rr
going I
F
to point where a line passing
b
through 0.75 I
RRM
and 0.50 I
RRM
extrapolated to zero current
1. di
f
/dt - Rate of change of current
through zero crossing
Fig. 9
- Reverse Recovery Parameter Test
Circuit
L = 100µH
HIGH-SPEED
SWITCH
Rg = 25 ohm
CURRENT
MONITOR
FREE-WHEEL
DIODE
+
Vd = 50V
Fig. 10
- Reverse Recovery Waveform and
Definitions
I
L(PK)
DUT
DECAY
TIME
V
(AVAL)
V
R(RATED)
Fig. 11
- Avalanche Test Circuit and Waveforms
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