REVISIONS
LTR
A
B
C
DESCRIPTION
Drawing updated to reflect current requirements. -sld
Update drawing. -gz
Table II, add note to Group C end-point test parameters. Update
boilerplate paragraphs. -gz
DATE (YR-MO-DA)
02-08-27
08-06-18
11-06-02
APPROVED
Raymond Monnin
Robert M. Heber
Charles F. Saffle
THE ORIGINAL FIRST SHEET OF THIS DOCUMENT HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael Jones
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
10
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
APPROVED BY
Kendall A. Cottongim
DRAWING APPROVAL DATE
94-03-25
REVISION LEVEL
C
MICROCIRCUIT, HYBRID, LINEAR, 12-VOLT,
SINGLE CHANNEL, DC/DC CONVERTER
AMSC N/A
SIZE
A
SHEET
CAGE CODE
67268
1 OF
10
5962-92110
DSCC FORM 2233
APR 97
5962-E327-11
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
½
½
½
Federal
stock class
designator
\
-
½
½
½
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
01
02
03
Generic number
ATW2812S/CH
ATW2812S/CH - SLAVE
ATW2812S/CH - MASTER
Circuit function
DC/DC converter, 30 W, 12 V output
DC/DC converter, 30 W, 12 V output
DC/DC converter, 30 W, 12 V output
92110
01
½
½
½
Device
type
(see 1.2.2)
/
H
½
½
½
Device
class
designator
(see 1.2.3)
Z
½
½
½
Case
outline
(see 1.2.4)
X
½
½
½
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
H
G
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C, and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
E
D
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
C
5962-92110
SHEET
2
DSCC FORM 2234
APR 97
1.2.4 Case outline. The case outline are as designated in MIL-STD-1835 and as follows:
Outline letter
Z
Descriptive designator
See figure 1
Terminals
10
Package style
Flange mount
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Input voltage range ....................................................................
Power dissipation (P
D
) ...............................................................
Lead temperature (soldering, 10 seconds) ................................
Storage temperature range........................................................
1.4 Recommended operating conditions.
Input voltage range ....................................................................
Output power 2/ ........................................................................
Case operating temperature range (T
C
) ....................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.daps.dla.mil/quicksearch/
from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
+18 V dc to +40 V dc
30 W
-55C to +125C
-0.5 V dc to +50 V dc
12 W
+300C
-65C to +150C
1/
2/
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Derate output power linearly above case temperature +125C to 0 at +135C.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
C
5962-92110
SHEET
3
DSCC FORM 2234
APR 97
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DLA Land and Maritime-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the
form, fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
C
5962-92110
SHEET
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55C
T
C
+125C
V
IN
= 28 V dc
5%,
C
L
= 0
unless otherwise specified
I
OUT
= 0
Group A
subgroups
Device
types
Limits
Min
Max
Unit
Output voltage
V
OUT
1
2,3
All
11.88
11.76
12.12
12.24
2500
50
30
60
V
Output current 1/
Output ripple voltage 2/
Line regulation
I
OUT
V
RIP
VR
LINE
V
IN
= 18, 28, and 40 V dc
V
IN
= 18, 28, and 40 V dc,
B.W. = 20 Hz to 2 MHz
V
IN
= 18, 28, and 40 V dc,
I
OUT
= 0, 1250, and 2500 mA
V
IN
= 18, 28, and 40 V dc,
I
OUT
= 0, 1250, and 2500 mA
I
OUT
= 0, inhibit (pin 2) tied to
input return (pin 10)
I
OUT
= 0, inhibit (pin 2) = open
1,2,3
1,2,3
1
2,3
1,2,3
1,2,3
All
All
All
mA
mV p-p
mV
Load regulation
Input current
VR
LOAD
I
IN
All
All
120
18
50
mV
mA
Input ripple current 2/
Efficiency
I
RIP
E
FF
I
OUT
= 2500 mA, B.W. = 20
Hz to 2 MHz
I
OUT
= 2500 mA
1,2,3
1
2,3
All
All
78
75
All
100
20
mA p-p
%
Isolation
ISO
Input to output or any pin to
case (except pin 7) at 500 V
dc, T
C
= +25C
No effect on dc performance,
T
C
= +25C
Overload, T
C
= +25C 5/
Short circuit
1
M
Capacitive load 3/ 4/
Power dissipation load fault
C
L
P
D
4
1
1,2,3
4,5,6
All
All
200
12
9
F
W
Switching frequency
F
S
I
OUT
= 2500 mA
01
02
03
250
250
275
-800
-1000
300
270
300
+800
+1000
kHz
Output response to step
transient load changes 6/
See footnotes at end of table.
VO
TLOAD
1250 mA to/from 2500 mA
0 mA to/from 1250 mA
4,5,6
All
mV pk
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
C
5962-92110
SHEET
5
DSCC FORM 2234
APR 97
NXP MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
