IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, SOIC-16, Multiplexer or Switch
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 其他特性 | CAN ALSO OPERATE WITH SINGLE SUPPLY |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 9.9 mm |
| 湿度敏感等级 | 1 |
| 负电源电压最大值（Vsup） | -5.5 V |
| 负电源电压最小值（Vsup） | -4.5 V |
| 标称负供电电压 (Vsup) | -5 V |
| 正常位置 | NO/NC |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 标称断态隔离度 | 68 dB |
| 最大通态电阻 (Ron) | 50 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3.3/5/+-5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 最长断开时间 | 150 ns |
| 最长接通时间 | 375 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| ADG513ABR-REEL | ADG513BR-REEL7 | ADG512ABR-REEL7 | ADG512ABR-REEL | ADG512BR-REEL | ADG512BR-REEL7 | |
|---|---|---|---|---|---|---|
| 描述 | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, SOIC-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, SOIC-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, SOIC-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, SOIC-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, SOIC-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, SOIC-16, Multiplexer or Switch |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 负电源电压最大值（Vsup） | -5.5 V | -5.5 V | -5.5 V | -5.5 V | -5.5 V | -5.5 V |
| 负电源电压最小值（Vsup） | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
| 标称负供电电压 (Vsup) | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 正常位置 | NO/NC | NO/NC | NO | NO | NO | NO |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB |
| 最大通态电阻 (Ron) | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装等效代码 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 |
| 电源 | 3.3/5/+-5 V | 3.3/5/+-5 V | 3.3/+-5 V | 3.3/+-5 V | 3.3/+-5 V | 3.3/+-5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 最长断开时间 | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns |
| 最长接通时间 | 375 ns | 375 ns | 375 ns | 375 ns | 375 ns | 375 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
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