电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HYM53216000AMG-60

产品描述Fast Page DRAM Module, 16MX32, 60ns, CMOS, PSMA72,
产品类别存储    存储   
文件大小186KB,共10页
制造商SK Hynix(海力士)
官网地址http://www.hynix.com/eng/
下载文档 详细参数 选型对比 全文预览

HYM53216000AMG-60概述

Fast Page DRAM Module, 16MX32, 60ns, CMOS, PSMA72,

HYM53216000AMG-60规格参数

参数名称属性值
厂商名称SK Hynix(海力士)
包装说明SIMM, SSIM72
Reach Compliance Codecompliant
最长访问时间60 ns
I/O 类型COMMON
JESD-30 代码R-PSMA-N72
内存密度536870912 bit
内存集成电路类型FAST PAGE DRAM MODULE
内存宽度32
端子数量72
字数16777216 words
字数代码16000000
最高工作温度70 °C
最低工作温度
组织16MX32
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码SIMM
封装等效代码SSIM72
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
电源5 V
认证状态Not Qualified
刷新周期4096
最大待机电流0.032 A
最大压摆率2.88 mA
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式NO LEAD
端子节距1.27 mm
端子位置SINGLE
Base Number Matches1

文档预览

下载PDF文档
HYM5321600A M-Series
16Mx32 bit FP DRAM MODULE
based on 16Mx1 DRAM, 5V, 4K-Refresh
GENERAL DESCRIPTION
The HYM5321600A M-Series is a 16Mx32-bit Fast Page mode CMOS DRAM module consisting of thirty-
two HY5116100B in 24/26 pin SOJ or TSOP-II on a 72 pin glass-epoxy printed circuit board. 0.1µF and
0.01µF decoupling capacitors are mounted for each DRAM.
The HYM5321600AM/ATM is Tin plated and HYM5321600AMG/ATMG is Gold plated socket type Single In-
line Memory Module suitable for easy interchange and addition of 64M byte memory.
FEATURES
72-Pin SIMM
Fast Page Mode Operation
/CAS-before-/RAS, /RAS-only,
Hidden and Self refresh capability
4096 refresh cycles / 256ms (SL-part)
4096 refresh cycles / 64ms
Fast access time and cycle time
Speed
50
60
70
tRAC
50ns
60ns
70ns
tCAC
13ns
15ns
18ns
tPC
35ns
40ns
45ns
Single power supply of 5.0V
±
10%
Low power dissipation
Max. self-refresh
: 52.8mW (SL-part)
Max. battery back-up : 106mW (SL-part)
Max. CMOS standby : 52.8mW (SL-part)
176mW
Max. TTL standby : 352mW
Max. operating
Speed
50
60
70
Power
19.4W
15.8W
14.1W
TTL compatible inputs and outputs
JEDEC standard pinout
ORDERING INFORMATION
PART NUMBER
HYM5321600AM
HYM5321600AMG
HYM5321600ATM
HYM5321600ATMG
SPEED
50/60/70
50/60/70
50/60/70
50/60/70
FEATURES
FP, 4K, 5V, SOJ
FP, 4K, 5V, SOJ
FP, 4K, 5V, TSOP
FP, 4K, 5V, TSOP
PACKAGE
SIMM
SIMM
SIMM
SIMM
PLATING
Tin
Gold
Tin
Gold
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume
any responsibility for use of circuits described. No patent licenses are implied.
Rev.02 / Sep.97
©
1997 Hyundai Semiconductor

HYM53216000AMG-60相似产品对比

HYM53216000AMG-60 HYM53216000AM-50 HYM53216000AM-70 HYM53216000ATM-70 HYM53216000AMG-70 HYM53216000ATM-60
描述 Fast Page DRAM Module, 16MX32, 60ns, CMOS, PSMA72, Fast Page DRAM Module, 16MX32, 50ns, CMOS, PSMA72, Fast Page DRAM Module, 16MX32, 70ns, CMOS, PSMA72, Fast Page DRAM Module, 16MX32, 70ns, CMOS, PSMA72, Fast Page DRAM Module, 16MX32, 70ns, CMOS, PSMA72, Fast Page DRAM Module, 16MX32, 60ns, CMOS, PSMA72,
厂商名称 SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士)
包装说明 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72
Reach Compliance Code compliant compliant compliant compliant compliant compliant
最长访问时间 60 ns 50 ns 70 ns 70 ns 70 ns 60 ns
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72
内存密度 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bit
内存集成电路类型 FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
内存宽度 32 32 32 32 32 32
端子数量 72 72 72 72 72 72
字数 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words
字数代码 16000000 16000000 16000000 16000000 16000000 16000000
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 16MX32 16MX32 16MX32 16MX32 16MX32 16MX32
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SIMM SIMM SIMM SIMM SIMM SIMM
封装等效代码 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
电源 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 4096 4096 4096 4096 4096 4096
最大待机电流 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A
最大压摆率 2.88 mA 3.62 mA 2.56 mA 2.56 mA 2.56 mA 2.88 mA
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Base Number Matches 1 1 1 1 - -

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 237  1209  2794  1330  1202  16  21  10  53  50 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved