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IS61C1024H-25K: 产品描述Standard SRAM, 128KX8, 25ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32; 产品类别存储存储; 文件大小123KB，共10页; 制造商Integrated Silicon Solution ( ISSI )

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IS61C1024H-25K概述

Standard SRAM, 128KX8, 25ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32

IS61C1024H-25K规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	Integrated Silicon Solution ( ISSI )
零件包装代码	SOJ
包装说明	0.400 INCH, PLASTIC, SOJ-32
针数	32
Reach Compliance Code	compliant
ECCN代码	EAR99
最长访问时间	25 ns
其他特性	LOW POWER STANDBY MODE
I/O 类型	COMMON
JESD-30 代码	R-PDSO-J32
JESD-609代码	e0
长度	20.955 mm
内存密度	1048576 bit
内存集成电路类型	STANDARD SRAM
内存宽度	8
湿度敏感等级	3
功能数量	1
端子数量	32
字数	131072 words
字数代码	128000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128KX8
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	SOJ
封装等效代码	SOJ32,.44
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5 V
认证状态	Not Qualified
座面最大高度	3.683 mm
最大待机电流	0.05 A
最小待机电流	4.5 V
最大压摆率	0.18 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	J BEND
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	10.16 mm
Base Number Matches	1

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IS61C1024H

128K x 8 HIGH-SPEED CMOS STATIC RAM

FEATURES

• High-speed access time: 15, 20, 25 ns

•

Low active power: 750 mW (typical)

•

Low standby power: 2 mW (typical) CMOS

standby

• Output Enable (

) and two Chip Enable

(

CE1

and CE2) inputs for ease in applications

• Fully static operation: no clock or refresh

required

• TTL compatible inputs and outputs

• Single 5V (±10%) power supply

IS61C1024H

ISSI

JANUARY 1996

DESCRIPTION

The

ISSI

IS61C1024H is a very high-speed, low power,

131,072-word by 8-bit CMOS static RAM. They are fabricated

using

ISSI

's high-performance CMOS technology. This highly

reliable process coupled with innovative circuit design tech-

niques, yields higher performance and low power consump-

tion devices.

When

CE1

is HIGH or CE2 is LOW (deselected), the device

assumes a standby mode at which the power dissipation can

be reduced by using CMOS input levels.

Easy memory expansion is provided by using two Chip Enable

inputs,

CE1

and CE2. The active LOW Write Enable (

)

controls both writing and reading of the memory.

The IS61C1024H is available in 32-pin 300-mil and 400-mil

plastic SOJ packages.

FUNCTIONAL BLOCK DIAGRAM

A0-A16

DECODER

512 X 2048

MEMORY ARRAY

VCC

GND

I/O

DATA

CIRCUIT

I/O0-I/O7

COLUMN I/O

CE1

CE2

CONTROL

CIRCUIT

ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which

Integrated Silicon Solution, Inc.

Rev. A 1/96

SR81995C024

IS61C1024H-25K相似产品对比

	IS61C1024H-25K	IS61C1024H-20K	IS61C1024H-20J	IS61C1024H-15J	IS61C1024H-15K	IS61C1024H-25J
描述	Standard SRAM, 128KX8, 25ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32	Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32	Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32	Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32	Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32	Standard SRAM, 128KX8, 25ns, CMOS, PDSO32, 0.300 INCH, PLASTIC, SOJ-32
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
零件包装代码	SOJ	SOJ	SOJ	SOJ	SOJ	SOJ
包装说明	0.400 INCH, PLASTIC, SOJ-32	0.400 INCH, PLASTIC, SOJ-32	0.300 INCH, PLASTIC, SOJ-32	0.300 INCH, PLASTIC, SOJ-32	0.400 INCH, PLASTIC, SOJ-32	0.300 INCH, PLASTIC, SOJ-32
针数	32	32	32	32	32	32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	EAR99	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	EAR99
最长访问时间	25 ns	20 ns	20 ns	15 ns	15 ns	25 ns
其他特性	LOW POWER STANDBY MODE	LOW POWER STANDBY MODE	LOW POWER STANDBY MODE	LOW POWER STANDBY MODE	LOW POWER STANDBY MODE	LOW POWER STANDBY MODE
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PDSO-J32	R-PDSO-J32	R-PDSO-J32	R-PDSO-J32	R-PDSO-J32	R-PDSO-J32
JESD-609代码	e0	e0	e0	e0	e0	e0
长度	20.955 mm	20.955 mm	20.955 mm	20.955 mm	20.955 mm	20.955 mm
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	8	8	8	8	8	8
湿度敏感等级	3	3	3	3	3	3
功能数量	1	1	1	1	1	1
端子数量	32	32	32	32	32	32
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOJ	SOJ	SOJ	SOJ	SOJ	SOJ
封装等效代码	SOJ32,.44	SOJ32,.44	SOJ32,.34	SOJ32,.34	SOJ32,.44	SOJ32,.34
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3.683 mm	3.683 mm	3.556 mm	3.556 mm	3.683 mm	3.556 mm
最大待机电流	0.05 A	0.05 A	0.05 A	0.05 A	0.05 A	0.05 A
最小待机电流	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
最大压摆率	0.18 mA	0.19 mA	0.19 mA	0.22 mA	0.22 mA	0.18 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	10.16 mm	10.16 mm	7.62 mm	7.62 mm	10.16 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1

IS61C1024H-25K

IS61C1024H-25K概述

IS61C1024H-25K规格参数

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