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345723-9

产品描述SOCKET, DIP24, IC SOCKET
产品类别连接器    插座   
文件大小114KB,共1页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
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345723-9概述

SOCKET, DIP24, IC SOCKET

345723-9规格参数

参数名称属性值
Reach Compliance Codeunknown
ECCN代码EAR99
联系完成配合GOLD (30)
联系完成终止GOLD (10) OVER NICKEL
设备插槽类型IC SOCKET
使用的设备类型DIP24
外壳材料PLASTIC
JESD-609代码e4
制造商序列号345723
触点数24
Base Number Matches1

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345723-9 Product Details
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345723-9
T E I nternal N umber: 3 4 5 7 2 3 - 9
Product Highlights:
l
DIP Socket
l
Number of Positions = 24
l
Row-to-Row Spacing = 7.62 mm
l
Through Hole C ontact Termination Type
l
Mount Style = Vertical
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
l
Product Line Information
Related Products:
l
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
l
Product Type
= DIP Socket
l
Number of Positions
= 24
l
Profile = Standard
l
Frame Style
= Open
l
Leg Style
= Straight
Electrical Characteristics:
l
Insulation Resistance (M?) = 10,000
l
C ontact Resistance (m?) = 30
Termination Related Features:
l
Termination Post Length (mm [in])
= 2.84 [0.112]
l
Solder Tail C ontact Plating = Gold (10) over Nickel
Body Related Features:
l
Row-to-Row Spacing (mm [in])
= 7.62 [0.300]
l
Mount Style
= Vertical
l
C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
l
C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
l
C ontact Mating Area Plating Material
= Gold (30)
l
C ontact Style
= Screw Machine
l
Mating C ontact Type
= Inner Spring
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 2.80 [0.110]
Industry Standards:
l
RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
l
Temperature Range (?C ) = 105
Packaging Related Features:
l
Packaging Method
= Tube
Other:
l
Brand = AMP
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2009 Tyco Electronics C orporation All Rights Reserved
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