The HCPL-193x devices are dual-channel, hermetically sealed,
high CMR, line receiver optocouplers. The products are capable
of operation and storage over the full military temperature
range and can be purchased as either a commercial product or
with full MIL-PRF-38534 Class Level H or K testing, or from the
DLA Standard Microcircuit Drawing (SMD) 5962-89572. This
16-pin DIP may be purchased with a variety of lead bend and
plating options. See
Selection Guide — Lead Configuration
Options
for details. Standard Microcircuit Drawing (SMD) parts
are available for each lead style.
Features
CAUTION
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation which may be induced by ESD.
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
Manufactured and tested on a MIL-PRF-38534 certified line
QML-38534, Class H and Class K
Hermetically sealed 16-pin dual in-line package
Performance guaranteed over full military temperature
range: –55° C to +125° C
High speed: 10 Mb/s
Accepts a broad range of drive conditions
Adaptive line termination included
Internal shield provides excellent common mode rejection
External base lead allows LED Peaking and LED current
adjustment
1500 Vdc withstand test voltage
High radiation immunity
HCPL-2602 function compatibility
Reliability data available
Applications
Military and space
High reliability systems
Isolated line receiver
Simplex/multiplex data transmission
Computer-peripheral interface
Microprocessor system interface
Harsh environmental environments
Digital isolation for A/D, D/A conversion
Current sensing
Instrument input/output isolation
Ground loop elimination
Pulse transformer replacement
1. See
Selection Guide — Lead Configuration Options
for available
extensions.
Broadcom
-1-
HCPL-1930, HCPL-1931, HCPL-193K, 5962-89572
Data Sheet
Functional Diagram
Selection Guide — Lead Configuration
Options
Part Number and Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class K
Standard Lead Finish
a
Solder Dipped
b
Butt Joint/Gold Plate
a
Gull Wing/Soldered
b
Crew Cut/Gold Plate
a
Class H SMD Part Number
Prescript for all below
5962-
8957201EC
8957201EA
8957201YC
8957201YA
8957201XA
Available
Available
Gold Plate
a
Solder Dipped
b
Output
L
H
H
H
Butt Joint/Gold Plate
a
Butt Joint/Soldered
b
Gull Wing/Soldered
b
Crew Cut/Gold Plate
a
Crew Cut/Soldered
b
Class K SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Joint/Gold Plate
a
Butt Joint/Soldered
b
Gull Wing/Soldered
b
a.
b.
HCPL-1930
HCPL-1931
HCPL-193K
Gold
Option #200
Option #100
Option #300
Option #600
Truth Table (Positive Logic)
Input
On
Off
On
Off
Enable
H
H
L
L
NOTE
The connection of a 0.1-μF bypass capacitor
between pins 15 and 10 is recommended.
All devices are manufactured and tested on a MIL-PRF-38534
certified line and Class H and K devices are included in the DLA
Qualified Manufacturers List QML-38534 for Hybrid
Microcircuits.
Each unit contains two independent channels, consisting of a
GaAsP light emitting diode, an input current regulator, and an
integrated high gain photon detector. The input regulator
serves as a line termination for line receiver applications. It
clamps the line voltage and regulates the LED current so line
reflections do not interfere with circuit performance. The
regulator allows a typical LED current of 12.5 mA before it starts
to shunt excess current. The output of the detector IC is an
open collector Schottky clamped transistor. An enable input
gates the detector. The internal detector shield provides a
guaranteed common mode transient immunity specification of
+1000 V/μs.
DC specifications are compatible with TTL logic and are
guaranteed from –55°C to +125°C allowing trouble-free
interfacing with digital logic circuits. An input current of 10 mA
will sink a six gate fan-out (TTL) at the output with a typical
propagation delay from input to output of only 45 ns.
5962-
8957202KEC
8957202KEA
8957202KYC
8957202KYA
8957202KXA
Gold Plate lead finish: Maximum gold thickness of leads is <100 micro
inches. Typical is 60 to 90 micro inches.
Solder lead finish: Sn63/Pb37.
Broadcom
-2-
HCPL-1930, HCPL-1931, HCPL-193K, 5962-89572
Data Sheet
Outline Drawings
16-Pin DIP Through Hole, 2 Channels
0.89 (0.035)
1.65 (0.065)
20.06 (0.790)
20.83 (0.820)
8.13 (0.320)
MAX.
4.45 (0.175)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
Note: Dimensions in millimeters (inches).
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
Device Marking
Avago DESIGNATOR
Avago P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
[1] QML PARTS ONLY
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE
[1]
Broadcom
-3-
HCPL-1930, HCPL-1931, HCPL-193K, 5962-89572
Data Sheet
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on Commercial,
Class H, and Class K product.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
1.14 (0.045)
1.40 (0.055)
7.36 (0.290)
7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on Commercial, Class H, and Class K product. DLA
Drawing (SMD) part numbers contain provisions for lead finish.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on
Commercial, Class H, and Class K product. This option has solder-dipped leads.
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
1.40 (0.055)
1.65 (0.065)
5° MAX.
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
1.07 (0.042)
1.32 (0.052)
600
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on Commercial,
Class H, and Class K product. Contact factory for the availability of this option on DLA part types.
3.81 (0.150)
MIN.
0.51 (0.020)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.25 (0.049)
7.36 (0.290)
7.87 (0.310)
Note: Dimensions in millimeters (inches).
Broadcom
-4-
HCPL-1930, HCPL-1931, HCPL-193K, 5962-89572
Data Sheet
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Lead Solder Temperature
Forward Input Current (each channel)
Reverse Input Current
Supply Voltage (1 minute max)
Enable Input Voltage (each channel)
Output Collector Current (each channel)
Output Collector Power Dissipation (each channel)
Output Collector Voltage (each channel)
Total Package Power Dissipation
Input Power Dissipation (each channel)
a.
b.
Derate linearly at 1.2 mA/°C above T
A
= 100°C.
Not to exceed V
CC
by more than 500 mV.
Symbol
T
S
T
A
I
I
I
R
V
CC
V
E
I
O
P
O
V
O
Min
–65
–55
—
—
—
—
—
—
—
—
—
—
Max
+150
+125
260 for 10 sec
60
60
7.0
5.5
b
25
40
7
564
168
Unit
°C
°C
°C
mA
mA
V
V
mA
mW
V
mW
mW
Note
a
Schematic
Notes: The connection of a 0.1-μF bypass capacitor between pins 15 and 10 is recommended. Bypassing of the power supply line is required, with a 0.1-μF ceramic
disc capacitor adjacent to each isolator. The power supply bus for the isolators should be separate from the bus for any active loads, otherwise additional
bypass capacitance may be needed to suppress regenerative feedback via the power supply.
据外媒报道，萨里大学（University of Surrey）的研究人员开发出一种无需依赖GPS即可在人口密集的城市地区精确定位设备位置的人工智能系统。该系统可将定位误差从734米缩小到22米以内，这对于自动驾驶汽车和救援车辆等技术的发展意义重大。 图片来源： 萨里大学 在发表于《IEEE Robotics and Automation Letters》的论文中，研究人员介绍了PEn...[详细]
DIY/开源硬件专区
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
