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5962F-0422902QZC

产品描述FPGA, 1536 CLBS, 320640 GATES, CLGA484, CERAMIC, LGA-484
产品类别可编程逻辑器件    可编程逻辑   
文件大小644KB,共41页
制造商Cobham Semiconductor Solutions
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5962F-0422902QZC概述

FPGA, 1536 CLBS, 320640 GATES, CLGA484, CERAMIC, LGA-484

5962F-0422902QZC规格参数

参数名称属性值
厂商名称Cobham Semiconductor Solutions
零件包装代码LGA
包装说明CERAMIC, LGA-484
针数484
Reach Compliance Codeunknown
CLB-Max的组合延迟1.01 ns
JESD-30 代码S-CBGA-BU484
JESD-609代码e4
长度29 mm
可配置逻辑块数量1536
等效关口数量320640
端子数量484
最高工作温度125 °C
最低工作温度-55 °C
组织1536 CLBS, 320640 GATES
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码LGA
封装形状SQUARE
封装形式GRID ARRAY
可编程逻辑类型FIELD PROGRAMMABLE GATE ARRAY
认证状态Not Qualified
筛选级别MIL-PRF-38535 Class Q
座面最大高度2.95 mm
最大供电电压2.7 V
最小供电电压2.3 V
标称供电电压2.5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层GOLD
端子形式BUTT
端子节距1.27 mm
端子位置BOTTOM
总剂量300k Rad(Si) V
宽度29 mm
Base Number Matches1

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Standard Products
UT6325 RadTol Eclipse FPGA
Data Sheeet
November 2013
www.aeroflex.com/FPGA
FEATURES
0.25m, five-layer metal, ViaLink
TM
epitaxial CMOS
process for smallest die sizes
One-time programmable, ViaLink technology for
personalization
Typical performance characteristics -- 120 MHz 16-bit
counters, 120 MHz datapaths, 60+ MHz FIFOs
2.5V core supply voltage, 3.3V I/O supply voltage
Up to 320,000 system gates (non-volatile)
I/Os
- Interfaces with 3.3 volt
- PCI compliant with 3.3 volt
- Full JTAG 1149.1 compliant
- Registered I/O cells with individually controlled enables
Operational environment; total dose irradiation testing to
MIL-STD-883 Test Method 1019
- Total-dose: 300 krad(Si)
- SEL Immune: <120MeV-cm
2
/mg
- LET
TH
(0.25) MeV-cm
2
/mg:
>42 logic cell flip flops
>64 for embedded SRAM
- Saturated Cross Section (cm2) per bit
5.0E-7 logic cell flip flops
2.0E-7 embedded SRAM
Up to 24 dual-port RadTol SRAM modules, organized in
user-configurable 2,304 bit blocks
- 5ns access times, each port independently accessible
- Fast and efficient for FIFO, RAM, and initialized RAM
functions
100% routable with full logic cell utilization and 100% user
fixed I/O
Variable-grain logic cells provide high performance and
100% utilization
Typical logic utilization = 65-80% (design dependent)
Comprehensive design tools include high quality Verilog/
VHDL synthesis and simulation
QuickLogic IP available for microcontrollers, DRAM
controllers, USART and PCI
Packaged in a 208-pin CQFP, 288 CQFP, 484 CCGA, 484
CLGA, 208 PQFP, 280 PBGA, and 484 PBGA
Standard Microcircuit Drawing 5962-04229
- QML Q & V
INTRODUCTION
The UT6325 RadTol Eclipse Field Programmable Gate Array
Family (FPGA) offers up to 320,000 system gates including
Dual-Port RadTol SRAM modules. It is fabricated on 0.25m
five-layer metal ViaLink CMOS process and contains 1,536
logic cells and 24 dual-port SRAM modules (see Figure 1 Block
Diagram). Each SRAM module has 2,304 RAM bits, for a
maximum total of 55,300 bits. Please reference product family
features chart on page 2.
SRAM modules are Dual Port (one asynchronous/synchronous
read port, one write port) and can be configured into one of four
modes (see Figure 2). Designers can cascade multiple RAM
modules to increase the depth or width allowed in single
modules by connecting corresponding address lines together and
dividing the words between modules (see Figure 3). This
approach allows a variety of address depths and word widths to
be tailored to a specific application.
The UT6325 RadTol Eclipse FPGA is available in a 208-pin
Cerquad Flatpack, allowing access to 99 bidirectional signal I/
O, 1 dedicated clock, 8 programmable clocks and 16 high drive
inputs. Other package options include a 288 CQFP, 484 CCGA
and a 484 CLGA.
Aeroflex uses QuickLogic Corporation’s licensed ESP
(Embedded Standard Products) technology. QuickLogic is a
pioneer in the FPGA semiconductor and software tools field.
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