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GS864472GC-133T

产品描述Cache SRAM, 1MX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
产品类别存储    存储   
文件大小2MB,共47页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
标准
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GS864472GC-133T概述

Cache SRAM, 1MX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

GS864472GC-133T规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称GSI Technology
零件包装代码BGA
包装说明LBGA,
针数209
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间8.5 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 3.3V SUPPLY
JESD-30 代码R-PBGA-B209
JESD-609代码e1
长度22 mm
内存密度75497472 bit
内存集成电路类型CACHE SRAM
内存宽度72
湿度敏感等级3
功能数量1
端子数量209
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织1MX72
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.7 mm
最大供电电压 (Vsup)2.7 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm
Base Number Matches1

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GS864418(B/E)/GS864436(B/E)/GS864472(C)
119-, 165-, & 209-Pin BGA
Commercial Temp
Industrial Temp
Features
4M x 18, 2M x 36, 1M x 72
72Mb S/DCD Sync Burst SRAMs
Flow Through/Pipeline Reads
250 MHz–133MHz
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
• FT pin for user-configurable flow through or pipeline operation
• Single/Dual Cycle Deselect selectable
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to SCD x18/x36 Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 119-, 165-, and 209-bump BGA packages
• RoHS-compliant 165-bump BGA package available
The function of the Data Output register can be controlled by the user
via the FT mode . Holding the FT mode pin low places the RAM in
Flow Through mode, causing output data to bypass the Data Output
Register. Holding FT high places the RAM in Pipeline mode,
activating the rising-edge-triggered Data Output Register.
The GS864418/36/72 is a SCD (Single Cycle Deselect) and DCD
(Dual Cycle Deselect) pipelined synchronous SRAM. DCD SRAMs
pipeline disable commands to the same degree as read commands.
SCD SRAMs pipeline deselect commands one stage less than read
commands. SCD RAMs begin turning off their outputs immediately
after the deselect command has been captured in the input registers.
DCD RAMs hold the deselect command for one full cycle and then
begin turning off their outputs just after the second rising edge of
clock. The user may configure this SRAM for either mode of
operation using the SCD mode input.
Byte write operation is performed by using Byte Write enable (BW)
input combined with one or more individual byte write signals (Bx).
In addition, Global Write (GW) is available for writing all bytes at one
time, regardless of the Byte Write control inputs.
SCD and DCD Pipelined Reads
Functional Description
Applications
The GS864418/36/72 is a
75,497,472
-bit high performance
synchronous SRAM with a 2-bit burst address counter. Although of a
type originally developed for Level 2 Cache applications supporting
high performance CPUs, the device now finds application in
synchronous SRAM applications, ranging from DSP main store to
networking chip set support.
Addresses, data I/Os, chip enable (E1), address burst control inputs
(ADSP, ADSC, ADV), and write control inputs (Bx, BW, GW) are
synchronous and are controlled by a positive-edge-triggered clock
input (CK). Output enable (G) and power down control (ZZ) are
asynchronous inputs. Burst cycles can be initiated with either ADSP
or ADSC inputs. In Burst mode, subsequent burst addresses are
generated internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or interleave order
with the Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Byte Write and Global Write
FLXDrive™
Controls
The ZQ pin allows selection between high drive strength (ZQ low) for
multi-drop bus applications and normal drive strength (ZQ floating or
high) point-to-point applications. See the Output Driver
Characteristics chart for details.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High) of
the ZZ signal, or by stopping the clock (CK). Memory data is retained
during Sleep mode.
Core and Interface Voltages
The GS864418/36/72 operates on a 2.5 V or 3.3 V power supply. All
input are 3.3 V and 2.5 V compatible. Separate output power (V
DDQ
)
pins are used to decouple output noise from the internal circuits and
are 3.3 V and 2.5 V compatible.
Parameter Synopsis
-250
t
KQ
(x18/x36)
t
KQ
(x72)
tCycle
Curr (x18)
Curr (x36)
Curr (x72)
t
KQ
tCycle
Curr (x18)
Curr (x36)
Curr (x72)
2.5
3.0
4.0
385
450
540
6.5
6.5
265
290
345
-225 -200 -166 -150 -133 Unit
2.7
3.0
4.4
360
415
505
6.5
6.5
265
290
345
3.0
3.0
5.0
335
385
460
6.5
6.5
265
290
345
3.5
3.5
6.0
305
345
405
7.0
7.0
255
280
335
3.8
3.8
6.7
295
325
385
7.5
7.5
240
265
315
4.0
4.0
7.5
265
295
345
8.5
8.5
225
245
300
ns
ns
ns
mA
mA
mA
ns
ns
mA
mA
mA
Pipeline
3-1-1-1
Flow
Through
2-1-1-1
Rev: 1.06 3/2008
1/47
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

 
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