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5536254-6

产品描述140,VT,RC,BD,BD,30AU,125ST
产品类别连接器    连接器   
文件大小500KB,共8页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
标准
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5536254-6概述

140,VT,RC,BD,BD,30AU,125ST

5536254-6规格参数

参数名称属性值
Brand NameAMP
是否无铅不含铅
是否Rohs认证符合
Reach Compliance Codecompliant
主体宽度0.285 inch
主体深度0.28 inch
主体长度3.64 inch
主体/外壳类型RECEPTACLE
连接器类型BOARD CONNECTOR
联系完成配合GOLD (30) OVER NICKEL
联系完成终止Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别FEMALE
触点材料NOT SPECIFIED
触点模式RECTANGULAR
触点样式SQ PIN-SKT
DIN 符合性NO
介电耐压500VAC V
耐用性50 Cycles
滤波功能NO
IEC 符合性NO
绝缘电阻5000000000 Ω
绝缘体颜色NATURAL
绝缘体材料THERMOPLASTIC
JESD-609代码e3
MIL 符合性NO
插接触点节距0.05 inch
匹配触点行间距0.1 inch
混合触点NO
安装选项1LOCKING
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度125 °C
最低工作温度-65 °C
选件GENERAL PURPOSE
PCB接触模式STAGGERED
PCB触点行间距1.27 mm
电镀厚度30u inch
极化密钥POLARIZED HOUSING
可靠性COMMERCIAL
端子长度0.125 inch
端子节距1.27 mm
端接类型SOLDER
触点总数140
Base Number Matches1

文档预览

下载PDF文档
108-1272
Product
Specification
Micro-Strip Board to Board Connector
1.
1.1.
SCOPE
Content
This specification covers perform ance, tests and quality requirem ents for TE Connectivity (TE) Micro-
Strip board to board right angle and vertical connector fam ily. These assem blies accom m odate a variety
of printed circuit board thicknesses. Plug assem blies are loaded with .015 inch square m ale Micro-Strip
contacts which m ate with receptacle assem blies loaded with fem ale Micro-Strip contacts.
1.2.
Qualification
W hen tests are perform ed on subject product line, procedures specified in 109 Series Test
Specifications shall be used. All inspections shall be perform ed using applicable inspection plan and
product drawing.
2.
APPLICABLE DOCUM ENTS
The following docum ents form a part of this specification to the extent specified herein. Unless
otherwise specified, latest edition of the docum ent applies. In the event of conflict between
requirem ents of this specification and product drawing, product drawing shall take precedence. In the
event of conflict between requirem ents of this specification and referenced docum ents, this specification
shall take precedence.
2.1.
TE Docum ents
!
!
!
!
3.
3.1.
109-1: General Requirem ents for Test Specifications
109 Series: Test Specifications as indicated in Figure 1
114-11005: Application Specification
501-235: Test Report
11Mar11 Rev A
REQUIREM ENTS
Design and Construction
Product shall be of design, construction and physical dim ensions specified on applicable product
drawing.
3.2.
Materials
!
!
Contact: Phosphor bronze or beryllium copper, selective gold over nickel plating
Housing: High tem perature therm oplastic, liquid crystal polym er
3.3.
Ratings
!
!
!
Voltage: 30 volts alternating current
Current: See Figure 2 for applicable current carrying capability
Tem perature: -65 to 125EC
©2011 Tyco Electronics Corporation, | Indicates change
a TE Connectivity Ltd. Company
*Trademark
All Rights Reserved
TE logo is a trademark.
For latest revision, visit our website at
www.te.com/documents.
For Regional Customer Service, visit our website at www.te.com
Other products, logos, and company names might be trademarks of their respective owners.
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