IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | QCCN, LCC20,.35SQ |
Reach Compliance Code | unknown |
系列 | ACT |
JESD-30 代码 | S-CQCC-N20 |
JESD-609代码 | e0 |
长度 | 8.89 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | MULTIPLEXER |
最大I(ol) | 0.024 A |
功能数量 | 4 |
输入次数 | 2 |
输出次数 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 7.5 ns |
传播延迟(tpd) | 9 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 |
座面最大高度 | 1.905 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
总剂量 | 100k Rad(Si) V |
宽度 | 8.89 mm |
Base Number Matches | 1 |
5962R89688012A | 5962R8968801FA | 5962R8968801EA | 5962R8968801VFA | 5962R8968801V2A | 5962-89688012A | 54ACT157FM-MLS | 54ACT157MDA | |
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描述 | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERAMIC, DFP-16, Multiplexer/Demultiplexer | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16, Multiplexer/Demultiplexer | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERAMIC, DFP-16, Multiplexer/Demultiplexer | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, UUC16, Multiplexer/Demultiplexer |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | ACT | ACT | ACT | ACT | ACT | ACT | ACT | ACT |
JESD-30 代码 | S-CQCC-N20 | R-GDFP-F16 | R-GDIP-T16 | R-GDFP-F16 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F16 | X-XUUC-N16 |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 16 | 16 | 16 | 20 | 20 | 16 | 16 |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | UNSPECIFIED |
封装代码 | QCCN | DFP | DIP | DFP | QCCN | QCCN | DFP | DIE |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | UNSPECIFIED |
封装形式 | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK | UNCASED CHIP |
传播延迟(tpd) | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns | 11.5 ns | 11.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | NO LEAD | FLAT | THROUGH-HOLE | FLAT | NO LEAD | NO LEAD | FLAT | NO LEAD |
端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | UPPER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
包装说明 | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DFP, | - |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | - |
长度 | 8.89 mm | 9.6645 mm | 19.43 mm | - | 8.89 mm | 8.89 mm | 9.6645 mm | - |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | - |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | - | - |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
封装等效代码 | LCC20,.35SQ | FL16,.3 | DIP16,.3 | FL16,.3 | LCC20,.35SQ | LCC20,.35SQ | - | - |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
Prop。Delay @ Nom-Sup | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 9 ns | - | - |
筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-STD-883 | - | - |
座面最大高度 | 1.905 mm | 2.032 mm | 5.08 mm | 2.032 mm | 1.905 mm | 1.905 mm | 2.032 mm | - |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped | - | - |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | - | - | - |
宽度 | 8.89 mm | 6.604 mm | 7.62 mm | 6.35 mm | 8.89 mm | 8.89 mm | 6.604 mm | - |
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