Boundary Scan Bus Driver, SCAN/JTAG/3J Series, 2-Func, 9-Bit, True Output, CMOS, CDFP56, CERAMIC, FP-56
| 参数名称 | 属性值 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 56 |
| Reach Compliance Code | unknown |
| 系列 | SCAN/JTAG/3J |
| JESD-30 代码 | R-GDFP-F56 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | BOUNDARY SCAN BUS DRIVER |
| 位数 | 9 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 56 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 16.5 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 宽度 | 9.65 mm |
| Base Number Matches | 1 |
| 5962-9311801MXA | 5962-9311801MXX | SCAN18373TFMQB | |
|---|---|---|---|
| 描述 | Boundary Scan Bus Driver, SCAN/JTAG/3J Series, 2-Func, 9-Bit, True Output, CMOS, CDFP56, CERAMIC, FP-56 | Boundary Scan Bus Driver, SCAN/JTAG/3J Series, 2-Func, 9-Bit, True Output, CMOS, CDFP56, CERAMIC, FP-56 | Boundary Scan Bus Driver, SCAN/JTAG/3J Series, 2-Func, 9-Bit, True Output, CMOS, CDFP56, 0.025 INCH PITCH, CERAMIC, FP-56 |
| 零件包装代码 | DFP | DFP | DFP |
| 包装说明 | DFP, | DFP, | DFP, FL56,.4,25 |
| 针数 | 56 | 56 | 56 |
| Reach Compliance Code | unknown | unknow | unknown |
| 系列 | SCAN/JTAG/3J | SCAN/JTAG/3J | SCAN/JTAG/3J |
| JESD-30 代码 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 |
| 逻辑集成电路类型 | BOUNDARY SCAN BUS DRIVER | BOUNDARY SCAN BUS DRIVER | BOUNDARY SCAN BUS DRIVER |
| 位数 | 9 | 9 | 9 |
| 功能数量 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 |
| 端子数量 | 56 | 56 | 56 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK |
| 传播延迟（tpd） | 16.5 ns | 16.5 ns | 16.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.54 mm | 2.54 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | FLAT |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 宽度 | 9.65 mm | 9.65 mm | 9.65 mm |
| JESD-609代码 | e0 | - | e0 |
| 端子面层 | TIN LEAD | - | Tin/Lead (Sn/Pb) |
| Base Number Matches | 1 | 1 | - |
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