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5962-01A1701Q9A

产品描述Serial I/O Controller, 3 Channel(s), 25MBps, CMOS, DIE
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小531KB,共31页
制造商e2v technologies
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5962-01A1701Q9A概述

Serial I/O Controller, 3 Channel(s), 25MBps, CMOS, DIE

5962-01A1701Q9A规格参数

参数名称属性值
零件包装代码DIE
包装说明DIE,
Reach Compliance Codecompliant
地址总线宽度8
边界扫描YES
最大时钟频率25 MHz
最大数据传输速率25 MBps
外部数据总线宽度32
JESD-30 代码X-XUUC-N
JESD-609代码e0
低功率模式NO
串行 I/O 数3
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料UNSPECIFIED
封装代码DIE
封装形状UNSPECIFIED
封装形式UNCASED CHIP
认证状态Not Qualified
筛选级别MIL-PRF-38535 Class Q
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式NO LEAD
端子位置UPPER
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches1

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Features
3 identical bidirectional link channels allowing full duplex communication under
selectable transmit rate from 1.25 up to 200 Mbit/s in each direction
A COmmunication Memory Interface (COMI) provides autonomous accesses to a
communication memory which are controlled by an arbitration unit, allowing two
TSS901E to share one Dual Port Ram without external arbitration
The scalable databus width (8/16/32 bit) allows flexible integration with any CPU type
Little or big endian mode is configurable
AHOst Control Interface (HOCI) gives read/write accesses to the TSS901E
configuration registers and to the DS-link channels for the controlling CPU
Device control via one of the three links allows its use in systems without a local
controller
Link disconnect detection and parity check at token (data and control) level; possible
checksum generation for packet level check
Power saving mode relying on automatic transmit rate reduction
A user’s manual of the TSS901E (also called SMCS332) is available at:
http://www.spacewire.esa.int/tech/spacewire/products/index.htm
Designed on Atmel MG1140E matrix and packaged into MQFPL196
Triple Point to
Point IEEE 1355
High Speed
Controller
TSS901E
Description and Applications
The TSS901E provides an interface between a Data-Strobe link - according to the
IEEE Std 1355-1995 specification carrying a simple interprocessor communication
protocol - and a data processing node consisting of a CPU and a communication and
data memory.
The TSS901E offers hardware supported execution of the major parts of the interpro-
cessor communication protocol: data transfer between two nodes of a multi-processor
system is performed with minimal host CPU intervention. The TSS901E can execute
simple commands to provide basic features for system control functions; a provision
of fault tolerant features exists as well.
Although the TSS901E initial exploitation is for use in multi-processor systems where
the high speed links standardisation is an important issue and where reliability is a
requirement, it could be used in applications such as heterogeneous systems or mod-
ules without any communication feature like special image compression chips, some
signal processors, application specific programmable logic or mass memory.
The TSS901E may also be used in single board systems where standardised high
speed interfaces are needed and systems containing "non-intelligent" modules such
as A/D-converter or sensor interfaces which can be assembled with the TSS901E
thanks to the "control by link" feature.
4167E–AERO–09/06

5962-01A1701Q9A相似产品对比

5962-01A1701Q9A 1210A5000332MDR
描述 Serial I/O Controller, 3 Channel(s), 25MBps, CMOS, DIE Ceramic Capacitor, Multilayer, Ceramic, 500V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.0033uF, Surface Mount, 1210, CHIP
包装说明 DIE, , 1210
Reach Compliance Code compliant compliant
JESD-609代码 e0 e0
最高工作温度 125 °C 125 °C
最低工作温度 -55 °C -55 °C
封装形状 UNSPECIFIED RECTANGULAR PACKAGE
表面贴装 YES YES
端子面层 TIN LEAD Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

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