电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SST34WA3283-70-5E-MVNE

产品描述SPECIALTY MEMORY CIRCUIT, PBGA56, 6 X 8 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-225, VFBGA-56
产品类别存储    存储   
文件大小2MB,共76页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
下载文档 详细参数 选型对比 全文预览

SST34WA3283-70-5E-MVNE概述

SPECIALTY MEMORY CIRCUIT, PBGA56, 6 X 8 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-225, VFBGA-56

SST34WA3283-70-5E-MVNE规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码BGA
包装说明VFBGA,
针数56
Reach Compliance Codecompliant
JESD-30 代码R-PBGA-B56
长度8 mm
内存密度33554432 bit
内存集成电路类型MEMORY CIRCUIT
内存宽度16
功能数量1
端子数量56
字数2097152 words
字数代码2000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-20 °C
组织2MX16
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1 mm
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级OTHER
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间40
宽度6 mm
Base Number Matches1

文档预览

下载PDF文档
32 Mbit Burst Mode Concurrent SuperFlash ComboMemory
SST34WA32A3 / SST34WA32A4 / SST34WA3283 / SST34WA3284
Advance Information
FEATURES:
• Flash Organization:
– 2M x 16
• PSRAM Organization:
– 8 Mbit: 512k X 16
– 16 Mbit: 1M x 16
• Single Voltage Read and Write Operations
V
DD
= 1.7V - 1.95V for Program, Erase and Read
• Top or Bottom Boot Block Protection
– Bottom Boot Protection - SST34WA32x3
– Top Boot Protection - SST34WA32x4
• Multiplexed Data/Address for reduced I/O count
– A
15
–A
0
multiplexed as DQ
15
–DQ
0
– Addresses are latched by AVD# control input when
BEF# is low
• Low Power Consumption (Typical)
– Standby Current: 50 µA
• Flexible Flash Memory Organization
– 4 Banks (512 KW)
– 63 Uniform 32 KWord blocks
– Uniform Sectors (2KWord) for entire memory array
• Concurrent Flash Memory Operation
– Read While Program (RWP)
– Read While Erase (RWE)
• Erase-Suspend/Erase-Resume Capability
– Read while Erase-Suspend
– Program while Erase-Suspend
– Read while Program during Erase-Suspend
• Industry Standard CFI interface compatible
Flash Synchronous Burst Mode Read (54 MHz/66 MHz)
– Continuous, Sequential Linear Burst
– 8/16/32-words with Wrap-Around Burst
– 8/16/32-words without Wrap-Around Burst
– Burst Access Time: 13.5 ns/11.5 ns
– Asynchronous Random Address Access: 70 ns
PSRAM Burst Mode Read/Write Access (54 MHz/66 MHz)
– Continuous, Sequential Linear Burst
– 4/8/16-words with Wrap-Around Burst
– 4/8/16-words without Wrap-Around Burst
– Burst Access Time: 13.5 ns/11.5 ns
– Asynchronous Random Address Access: 70 ns
Fast Program and Erase (Typical)
– Word Program Time: 10 µs
– Sector/Block Erase Time: 15 ms
– Chip Erase Time: 30 ms
Expanded Block Locking
– All blocks locked at Power-up
– Any block can be locked/unlocked by software
Flash Security ID
– 128-bit unique ID – factory preset
– 128-word non-erasable, lockable User-programmed
ID bits (“OTP-like”)
End-of-Write Detection
– Data# Polling
– Toggle bit
Packages Available
– 56-ball VFBGA (6 x 8mm)
Superior Reliability
– Endurance per sector: 1,000,000 cycles (typical)
– Greater than 100 years Data Retention
All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
The SST34WA32A3 / SST34WA32A4 / SST34WA3283 /
SST34WA3284 are 32 Mbit (2 Mbit x16) ComboMemory
devices which integrate a 32 Mbit flash with either a 16 Mbit
PSRAM or 8 Mbit PSRAM in a multi-chip package (MCP).
These devices utilize a single 1.8V supply and support
burst mode access and address / data multiplex
architecture.
The Combo Memory devices feature a 512 KWord uniform
multi-bank flash memory architecture that consists of four
banks that contain individually-erasable blocks and sectors
for increased flexibility. Either the top or bottom bank,
consists of 15 standard 32 KWord blocks and four
parameter 8 KWord blocks for added granularity. The
remaining three banks each contain uniform 32 KWord
blocks. Each 32 KWord block is further divided into sixteen
uniform 2 KWord sectors. Any bank can be read while
another bank is being erased or programmed, with zero
latency. In addition, these devices provide Erase-Suspend
mode during which data can be programmed to, or read
from, any sector or block that is not being erased.
©2007 Silicon Storage Technology, Inc.
S71358-01-000
11/07
1
SST34WA32A3/32A4/3283/3284 support synchronous
Burst mode Read from any address location of the flash
memory array; and Burst mode Read and Write from any
address location of the PSRAM. The Burst modes allow
the devices to Read or Write sequential data with
significantly shorter latency delays than during a random
read or write.
To protect against inadvertent write, the flash memory bank
offers an expanded Block Locking scheme. Each block can
be individually locked, and the top or bottom 8 KWord
parameter blocks of each boot block can be individually
locked for finer granularity. In addition, a 136-words Security
ID, included on the flash memory, increases system design
security.
Designed, manufactured, and tested for applications
requiring low power and small form factor the
SST34WA32A3/32A4/3283/3284 are offered in an
extended temperature with a small footprint package to
meet board space constraints requirement. See Figure 8
for pin assignments.
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
CSF and ComboMemory are trademarks of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.

SST34WA3283-70-5E-MVNE相似产品对比

SST34WA3283-70-5E-MVNE SST34WA3284-70-5E-MVNE SST34WA32A3-70-5E-MVNE SST34WA32A4-70-5E-MVNE
描述 SPECIALTY MEMORY CIRCUIT, PBGA56, 6 X 8 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-225, VFBGA-56 SPECIALTY MEMORY CIRCUIT, PBGA56, 6 X 8 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-225, VFBGA-56 SPECIALTY MEMORY CIRCUIT, PBGA56, 6 X 8 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-225, VFBGA-56 SPECIALTY MEMORY CIRCUIT, PBGA56, 6 X 8 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-225, VFBGA-56
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
零件包装代码 BGA BGA BGA BGA
包装说明 VFBGA, VFBGA, VFBGA, 6 X 8 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-225, VFBGA-56
针数 56 56 56 56
Reach Compliance Code compliant compliant compliant compliant
JESD-30 代码 R-PBGA-B56 R-PBGA-B56 R-PBGA-B56 R-PBGA-B56
长度 8 mm 8 mm 8 mm 8 mm
内存密度 33554432 bit 33554432 bit 33554432 bit 33554432 bit
内存集成电路类型 MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
内存宽度 16 16 16 16
功能数量 1 1 1 1
端子数量 56 56 56 56
字数 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -20 °C -20 °C -20 °C -20 °C
组织 2MX16 2MX16 2MX16 2MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA VFBGA VFBGA VFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm 1 mm 1 mm 1 mm
最大供电电压 (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 OTHER OTHER OTHER OTHER
端子形式 BALL BALL BALL BALL
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 40 40 40 40
宽度 6 mm 6 mm 6 mm 6 mm

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2491  2231  1784  2023  2880  29  57  27  8  28 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved