REVISIONS
LTR
A
DESCRIPTION
Changes to conditions in Table I, addition of Test condition 2 in Figure
4. Editorial changes throughout.
DATE
(YR-MO-DA)
96-11-13
APPROVED
Thomas M. Hess
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PREPARED BY
Thomas M. Hess
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PMIC N/A
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Thomas M. Hess
APPROVED BY
Monica L. Poelking
MICROCIRCUIT, DIGITAL, RADIATION HARDENED,
CMOS, PROGRAMMABLE PERIPHERAL INTERFACE,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
95-12-28
SIZE
REVISION LEVEL
A
CAGE CODE
AMSC N/A
A
SHEET
67268
1
OF
21
5962-95819
DESC FORM 193
JUL 94
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E033-97
1. SCOPE
1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance
classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines
and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN
class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant
non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
R
95819
01
V
Q
C
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be
marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
Generic number
82C55ARH
Circuit function
Radiation hardened,CMOS programmable
peripheral interface
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for non-JAN class B microcircuits in
accordance with 1.2.1 of MIL-STD-883
Certification and qualification to MIL-I-38535
Q or V
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
Q
Descriptive designator
CDIP2-T40
Terminals
40
Package style
Dual-in-line package
1.2.5 Lead finish. The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V.
Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes
A, B, and C are considered acceptable and interchangeable without preference.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 94
A
REVISION LEVEL
A
5962-95819
SHEET
2
1.3 Absolute maximum ratings. 1/
Supply voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input or output voltage range . . . . . . . . . . . . . . . . . . . . .
Storage temperature range (TSTG) . . . . . . . . . . . . . . . .
Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering 10 seconds) (T
S
) . . . . . . . . .
Thermal resistance junction-to-case (
JC
):
Case outline X
............................
Thermal resistance junction-to-ambient (
JA
):
Case outline X
............................
Maximum power dissipation (P
D
): 2/
Case outline X
............................
+7.0 V dc
V
SS
-0.3 V dc to V
DD
+0.3 V dc
-65
C to +150
C
+175
C
+300
C
6
C/W
40
C/W
1.25 W
1.4 Recommended operating conditions.
Operating supply voltage range (VDD) . . . . . . . . . . . . . . .
Operating temperature range (TA) . . . . . . . . . . . . . . . . . .
Input low voltage range (VIL) . . . . . . . . . . . . . . . . . . . . .
Input high voltage range (VIH) . . . . . . . . . . . . . . . . . . . . .
Radiation features
Total dose
............................
Transient upset . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single event upset . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single event latchup . . . . . . . . . . . . . . . . . . . . . . . . . . .
2. APPLICABLE DOCUMENTS
4.5 V dc to +5.5 V dc
-55
C to +125
C
0 V dc to +0.8 V dc
VDD -1.5 V dc to VDD
> 100 k Rads(SI)
> 10
8
RAD(SI)/sec 3/
> 50 MEV/(mg/cm
2
) 3/
> 50 MEV/(mg/cm
2
) 3/
2.1 Government specification, standards, bulletin, and handbook. Unless otherwise specified, the following specification, standards,
bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the
solicitation, form a part of this drawing to the extent specified herein.
SPECIFICATION
MILITARY
MIL-I-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
MILITARY
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Microcircuit Case Outlines.
BULLETIN
MILITARY
MIL-BUL-103 - List of Standardized Military Drawings (SMD's).
HANDBOOK
MILITARY
MIL-HDBK-780 - Standardized Military Drawings.
(Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions
should be obtained from the contracting activity or as directed by the contracting activity.)
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels
may degrade performance and affect reliability.
2/ If device power exceeds package power dissipation capability provide heat sinking or derate linearly (the derating is based on
JA
) at a
rate of 25 mW/
C.
3/ Guaranteed by process or design, but not tested.
1/
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 94
A
REVISION LEVEL
A
5962-95819
SHEET
3
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing
shall take precedence.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-883,
"Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein. The individual item
requirements for device classes Q and V shall be in accordance with MIL-I-38535 and as specified herein or as modified in the device
manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as described
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-STD-
883 (see 3.1 herein) for device class M and MIL-I-38535 for device classes Q and V and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Block diagram. The block diagram shall be as specified on figure 2.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 3.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating
temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for
each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with
MIL-STD-883 (see 3.1 herein). In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-103. Marking for device
classes Q and V shall be in accordance with MIL-I-38535.
3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-STD-883 (see 3.1 herein).
The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-I-38535.
3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as
an approved source of supply in MIL-BUL-103 (see 6.7.2 herein). For device classes Q and V, a certificate of compliance shall be required
from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.1 herein). The certificate of
compliance submitted to DESC-EC prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's
product meets, for device class M, the requirements of MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of
MIL-I-38535 and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or for device
classes Q and V in MIL-I-38535 shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving
devices acquired to this drawing is required for any change as defined in MIL-STD-973.
3.9 Verification and review for device class M. For device class M, DESC, DESC's agent, and the acquiring activity retain the option to
review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the
option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group
number 105 (see MIL-I-38535, appendix A).
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 94
A
REVISION LEVEL
A
5962-95819
SHEET
4
TABLE IA. Electrical performance characteristics.
Symbol
V
OH1
V
OH2
V
OL
I
IL
or
I
IH
I
OZL
or
I
OZH
I
BHH
I
BHL
I
DDSB
V
DAR
C
IN
C
I/O
Conditions 1/
-55
C
T
A
+125
C
unless otherwise specified
V
DD
= 4.5 V, I
O
= -2.5 mA,
V
IN
= 0 V, 4.5 V
V
DD
= 4.5 V, I
O
= -100 µA
V
IN
= 0 V, 4.5 V
V
DD
= 4.5 V, I
O
= 2.5 mA,
V
IN
= 0 V, 4.5 V
V
DD
= 5.5 V,
V
IN
= 0 V, 4.5 V
V
DD
= 5.5 V,
V
IN
= 0 V, 4.5 V
V
DD
= 4.5 V or 5.5 V,
V
IN
= 3.0 V 2/
Ports A,B,C
V
DD
= 4.5 V or 5.5 V,
V
IN
= 1.0 V 3/
Port A
V
IN
= GND or V
DD
V
DD
= 5.5 V, I
O
= 0 mA,
V
DD
= 4.5 V, I
O
= -2.0 mA,
V
IN
= GND or V
DD
See 4.4.1c
V
DD
= Open, f = 1 Mhz,
All measurements referenced
to device ground
See 4.4.1c
V
DD
= Open, f = 1 Mhz,
All measurements referenced
to device ground
See 4.4.1b
V
DD
= 4.5 V and 5.5 V,
V
IN
= GND or V
DD
,
f = 1 MHz
See 4.4.1b
V
DD
= 5.5 V, V
IN
= GND or
V
DD
- 1.5 V and
V
DD
= 4.5 V, V
IN
= 0.8 V or
V
DD
Group A
subgroups
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
4
4
7,8
7,8
Device
type
All
All
All
All
All
All
All
All
All
All
All
All
All
Limits
Min
3.0
V
DD
-0.4
-1.0
-10
-800
60
3.9
Test
Unit
TTL output high voltage
CMOS output high voltage
Output low voltage
Input leakage current
Output leakage current
Input current bus hold high
Input current bus hold low
Standby power supply current
Darlington drive voltage
Input capacitance
I/O capancitance
Functional tests
Noise immunity functional
test 4/
Max
V
V
0.4
V
1.0
µA
10
µA
-60
µA
800
µA
20
µA
V
10
pF
20
pF
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 94
A
REVISION LEVEL
A
5962-95819
SHEET
5
嵌入式系统
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