High Performance Surface
Mount Flip Chip LEDs
Technical Data
HP SunPower Series
HSMA-H670/H690/H770/
H790/R661/R761
HSMC-H670/H690/H770/
H790/R661/R761
HSML-H670/H690/H770/
H790/R661/R761
Features
• High Brightness AlInGaP
Material
• Improved Reliability
through Elimination of
Internal Wire Bond
• -40 to 85
°
C Operating
Temperature Range
• Three Small Package Sizes
• Industry Standard
2.0 x 1.25 mm and
1.6 x 0.8 mm Footprints
• Right Angle Package
• Three Colors Available
• Diffused Optics
• Compatible with IR and
Through-the-wave Solder
Processes
• Available in 8 mm Tape on
178 mm (7") and 330 mm
(13") Diameter Reels
Applications
•
•
•
•
Keypad Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
Description
The HSMx-H670/H770, -H690/
H790, and -R661/R761 combine
high reliability surface mount flip
chip LED construction with HP’s
bright AlInGaP material. These
very small, bright LEDs have a
high luminous efficiency capable
of producing high light output over
a wide range of drive currents. The
590 nm amber, 605 nm orange,
and 626 nm red colors are
available in three compact, low
profile packages.
The HSMx-H670/H770 has the
industry standard 2.0 x 1.25 mm
footprint that is excellent for all
around use. The HSMx-H690/
H790 has the industry standard
1.6 x 0.8 mm footprint, and its low
0.6 mm profile and wide viewing
angle make this LED excellent for
backlighting applications.
The HSMx-R661/R761 has a small
2.1 x 1.3 mm footprint and a low
profile 0.7 mm height that makes
this part ideal for LCD backlighting
and sidelighting applications
where space is at a premium. All
packages are compatible with IR
and convective reflow soldering
processes. In addition, these parts
are also compatible with through-
the-wave soldering processes.
3
Absolute Maximum Ratings at T
A
= 25
°
C
Parameter
DC Forward Current
[1]
Power Dissipation
Reverse Voltage
(I
R
= 100
µA)
Operating Temperature Range
Storage Temperature Range
[2]
Max. Rating
20
50
5
-40 to 85
-40 to 85
Units
mA
mW
V
°C
°C
Notes:
1. Derate linearly as shown in Figure 4 for temperatures above 25°C.
2. Maximum temperature for tape and reel packaging is 60°C.
Optical Characteristics at T
A
= 25
°
C
Peak
Wavelength
λ
peak
(nm)
Typ.
592
607
638
Color, Dominant
Wavelength
λ
d[2]
(nm)
Typ.
590
605
626
Viewing
Angle 2θ
1
/
2
Degrees
[3]
Typ.
165
165
165
Luminous
Efficacy
η
v
(lm/W)
480
370
197
Part No.
HSMA-H6X0
HSMA-R661
HSML-H6X0
HSML-R661
HSMC-H6X0
HSMC-R661
Color
Amber
Orange
Red
Optical Characteristics at T
A
= 25
°
C (Cont’d)
Luminous
Intensity
Iv (mcd)
@ I
F
= 5 mA
Part No.
HSMA-H6X0
HSMA-R661
HSML-H6X0
HSML-R661
HSMC-H6X0
HSMC-R661
Color
Amber
Orange
Red
Min.
2.5
2.5
2.5
Typ.
7.5
7.5
6.5
Luminous
Intensity
Iv (mcd)
@ I
F
= 20 mA
Typ.
35
35
30
Luminous
Intensity
Iv (mcd)
@ I
F
= 2 mA
Typ.
2.5
2.5
2.5
Notes:
1. The dominant wavelength
λ
d
is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
2.
θ
1
/
2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Operation below I
F
= 1 mA is not recommended.
5
5
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 5 mA)
I
F
– FORWARD CURRENT – mA
25
I
F
– FORWARD CURRENT – mA
100
50
20
10
5
2
1
0.5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4
20
Rθ
J-A
= 300°C/W
15
Rθ
J-A
= 400°C/W
3
2
10
1
5
0
0
0
5
10
15
20
25
0
20
40
60
80
100
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
Figure 2. Forward Current vs.
Forward Voltage.
Figure 3. Relative Iv vs. DC Forward
Current (operation below 1 mA not
recommended).
Figure 4. Maximum DC Current vs.
Ambient Temperature.
20°
30°
40°
50°
10°
0°
1.0
.8
.6
60°
70°
80°
90°
.4
.2
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
ANGLE
Figure 5. Intensity vs. Angle for HSMx-H670/H770 and HSMx-H690/H790.
20°
30°
40°
50°
10°
0°
1.0
.8
.6
60°
70°
80°
90°
.4
.2
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
ANGLE
Figure 6. Intensity vs. Angle (Horizontal) for HSMx-R661/R761.
NORMALIZED INTENSITY
NORMALIZED INTENSITY
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