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IS61LPS51218A-200TQ

产品描述512KX18 CACHE SRAM, PQFP100, 20 X 14 MM, 1.40 MM HEIGHT, LQFP-100
产品类别存储    存储   
文件大小764KB,共35页
制造商ABLIC
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IS61LPS51218A-200TQ概述

512KX18 CACHE SRAM, PQFP100, 20 X 14 MM, 1.40 MM HEIGHT, LQFP-100

IS61LPS51218A-200TQ规格参数

参数名称属性值
厂商名称ABLIC
零件包装代码QFP
包装说明LQFP,
针数100
Reach Compliance Codeunknown
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PQFP-G100
长度20 mm
内存密度9437184 bit
内存集成电路类型CACHE SRAM
内存宽度18
功能数量1
端子数量100
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX18
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
宽度14 mm
Base Number Matches1

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IS61LPS51218A, IS61LPS25636A, IS61LPS25632A, IS64LPS25636A,
IS61VPS51218A, IS61VPS25636A
256K x 36, 256K x 32, 512K x 18
9 Mb SYNCHRONOUS PIPELINED,
SINGLE CYCLE DESELECT STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth ex-
pansion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• JTAG Boundary Scan for PBGA package
• Power Supply
LPS: V
dd
3.3V + 5%,
V
ddq
3.3V/2.5V + 5%
VPS: V
dd
2.5V + 5%,
V
ddq
2.5V + 5%
• JEDEC 100-Pin TQFP, 119-ball PBGA, and
165-ball PBGA packages
• Lead-free available
SEPTEMBER 2012
DESCRIPTION
The
ISSI
IS61LPS/VPS25636A, IS61LPS25632A,
IS64LPS25636A and IS61LPS/VPS51218A are high-
speed, low-power synchronous static RAMs designed
to provide burstable, high-performance memory for com-
munication and networking applications. The IS61LPS/
VPS25636A and IS64LPS25636A are organized as
262,144 words by 36 bits. The IS61LPS25632A is
organized as 262,144 words by 32 bits. The IS61LPS/
VPS51218A is organized as 524,288 words by 18 bits.
Fabricated with
ISSI
's advanced CMOS technology,
the device integrates a 2-bit burst counter, high-speed
SRAM core, and high-drive capability outputs into a single
monolithic circuit. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single
clock input.
Write cycles are internally self-timed and are initiated by
the rising edge of the clock input. Write cycles can be
one to four bytes wide as controlled by the write control
inputs.
Separate byte enables allow individual bytes to be written.
The byte write operation is performed by using the byte
write enable (BWE) input combined with one or more
individual byte write signals (BWx). In addition, Global
Write (GW) is available for writing all bytes at one time,
regardless of the byte write controls.
Bursts can be initiated with either ADSP (Address Status
Processor) or ADSC (Address Status Cache Controller)
input pins. Subsequent burst addresses can be gener-
ated internally and controlled by the
ADV
(burst address
advance) input pin.
The mode pin is used to select the burst sequence or-
der, Linear burst is achieved when this pin is tied LOW.
Interleave burst is achieved when this pin is tied HIGH
or left floating.
FAST ACCESS TIME
Symbol
t
kq
t
kc
Parameter
Clock Access Time
Cycle Time
Frequency
250
2.6
4
250
200
3.1
5
200
166
3.5
6
166
Units
ns
ns
MHz
Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc.
Rev. L
09/06/12
1
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