Datasheet> 器件分类 > 无源元件> 电容器> GRM219B10J475KE01D

GRM219B10J475KE01D: 产品描述Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, B, 10% TC, 4.7uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT; 产品类别无源元件电容器; 文件大小18KB，共1页; 制造商Murata(村田); 官网地址https://www.murata.com; 标准

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GRM219B10J475KE01D概述

Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, B, 10% TC, 4.7uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT

GRM219B10J475KE01D规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Murata(村田)
包装说明	, 0805
Reach Compliance Code	compliant
ECCN代码	EAR99
电容	4.7 µF
电容器类型	CERAMIC CAPACITOR
介电材料	CERAMIC
高度	0.85 mm
JESD-609代码	e3
长度	2 mm
安装特点	SURFACE MOUNT
多层	Yes
负容差	10%
端子数量	2
最高工作温度	85 °C
最低工作温度	-25 °C
封装形状	RECTANGULAR PACKAGE
封装形式	SMT
包装方法	TR, PAPER, 7 INCH
正容差	10%
额定（直流）电压（URdc）	6.3 V
尺寸代码	0805
表面贴装	YES
温度特性代码	B
温度系数	10% ppm/°C
端子面层	Tin (Sn)
端子形状	WRAPAROUND
宽度	1.25 mm
Base Number Matches	1

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Capacitors > Monolithic Ceramic Capacitors

Data Sheet

Monolithic Ceramic Capacitors

GRM219B10J475KE01p

(0805, B, 4.7µF, 6.3Vdc)

packaging code

RoHS regulation conformity parts

(in mm)

Dimensions

Length L

Width W

Thickness T

Electrode e

Electrode Gap g (min.)

2.0mm±0.1mm

1.25mm±0.1mm

0.85mm±0.1mm

0.2 to 0.7mm

0.7mm

Packaging

Code

Packaging

180mm Paper Tape

330mm Paper Tape

Bulk(Bag)

Minimum Quantity

4000

10000

1000

Specifications

Rated Value

Murata PN Code

Tenperature Char.

Capacitance

Capacitance Change

Rated Voltage

475

Spec

B (JIS),

±10%

4.7µF

±10%

6.3Vdc

Please refer to 'Specification' PDF file.

This

data sheet is applied for CHIP MONOLITHIC CERAMIC CAPACITOR used for General Electronics equipment for your design.

Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin

melting point is used. Please confirm the solderability of Tin plating termination chip before use.

Use of Sn-Zn based solder will deteriorate reliability of MLCC. Please check with our sales represetatives for the use of Sn-Zn based solder in advance.

• The RoHS compliance means that we judge from EU Directive 2002/95/EC the products do not contain lead, cadmium, mercury, hexavalent

chromium, PBB and PBDE, except exemptions stated in EU Directive 2002/95/EC annex and impurities existing in natural world.

• This statement does not insure the compliance of any of the listed parts with any laws or legal imperatives developed by any EU members

individually with regards to the RoHS Directive.

Note:

1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our

products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.

2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product

specifications or transact the approval sheet for product specifications before ordering.

2006.7.7

http://www.murata.com/

GRM219B10J475KE01D相似产品对比

	GRM219B10J475KE01D	GRM219B10J475KE01J	GRM219B10J475KE01B
描述	Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, B, 10% TC, 4.7uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT	Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, B, 10% TC, 4.7uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT	Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, B, 10% TC, 4.7uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT
是否无铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合
厂商名称	Murata(村田)	Murata(村田)	Murata(村田)
包装说明	, 0805	, 0805	, 0805
Reach Compliance Code	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99
电容	4.7 µF	4.7 µF	4.7 µF
电容器类型	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR
介电材料	CERAMIC	CERAMIC	CERAMIC
高度	0.85 mm	0.85 mm	0.85 mm
JESD-609代码	e3	e3	e3
长度	2 mm	2 mm	2 mm
安装特点	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT
多层	Yes	Yes	Yes
负容差	10%	10%	10%
端子数量	2	2	2
最高工作温度	85 °C	85 °C	85 °C
最低工作温度	-25 °C	-25 °C	-25 °C
封装形状	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE
封装形式	SMT	SMT	SMT
包装方法	TR, PAPER, 7 INCH	TR, PAPER, 13 INCH	BULK
正容差	10%	10%	10%
额定（直流）电压（URdc）	6.3 V	6.3 V	6.3 V
尺寸代码	0805	0805	0805
表面贴装	YES	YES	YES
温度特性代码	B	B	B
温度系数	10% ppm/°C	10% ppm/°C	10% ppm/°C
端子面层	Tin (Sn)	Tin (Sn)	Tin (Sn)
端子形状	WRAPAROUND	WRAPAROUND	WRAPAROUND
宽度	1.25 mm	1.25 mm	1.25 mm
Base Number Matches	1	1	1

GRM219B10J475KE01D

GRM219B10J475KE01D概述

GRM219B10J475KE01D规格参数

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