PLL Based Clock Driver, 8 True Output(s), 0 Inverted Output(s), PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LEAD FREE, LQFP-32
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFP |
包装说明 | 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LEAD FREE, LQFP-32 |
针数 | 32 |
Reach Compliance Code | compliant |
其他特性 | ALSO OPERATES AT 3.3V SUPPLY |
输入调节 | DIFFERENTIAL MUX |
JESD-30 代码 | S-PQFP-G32 |
JESD-609代码 | e3 |
长度 | 7 mm |
逻辑集成电路类型 | PLL BASED CLOCK DRIVER |
湿度敏感等级 | 3 |
功能数量 | 1 |
反相输出次数 | |
端子数量 | 32 |
实输出次数 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 7.3 ns |
认证状态 | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.065 ns |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 2.625 V |
最小供电电压 (Vsup) | 2.375 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7 mm |
最小 fmax | 15.625 MHz |
Base Number Matches | 1 |
ICS8705BYILF | ICS8705BYILFT | |
---|---|---|
描述 | PLL Based Clock Driver, 8 True Output(s), 0 Inverted Output(s), PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LEAD FREE, LQFP-32 | PLL Based Clock Driver, 8 True Output(s), 0 Inverted Output(s), PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LEAD FREE, LQFP-32 |
是否无铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFP | QFP |
包装说明 | 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LEAD FREE, LQFP-32 | 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LEAD FREE, LQFP-32 |
针数 | 32 | 32 |
Reach Compliance Code | compliant | compliant |
其他特性 | ALSO OPERATES AT 3.3V SUPPLY | ALSO OPERATES AT 3.3V SUPPLY |
输入调节 | DIFFERENTIAL MUX | DIFFERENTIAL MUX |
JESD-30 代码 | S-PQFP-G32 | S-PQFP-G32 |
JESD-609代码 | e3 | e3 |
长度 | 7 mm | 7 mm |
逻辑集成电路类型 | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER |
湿度敏感等级 | 3 | 3 |
功能数量 | 1 | 1 |
端子数量 | 32 | 32 |
实输出次数 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | LQFP |
封装形状 | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
峰值回流温度(摄氏度) | 260 | 260 |
传播延迟(tpd) | 7.3 ns | 7.3 ns |
认证状态 | Not Qualified | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.065 ns | 0.065 ns |
座面最大高度 | 1.6 mm | 1.6 mm |
最大供电电压 (Vsup) | 2.625 V | 2.625 V |
最小供电电压 (Vsup) | 2.375 V | 2.375 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V |
表面贴装 | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | GULL WING | GULL WING |
端子节距 | 0.8 mm | 0.8 mm |
端子位置 | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 |
宽度 | 7 mm | 7 mm |
最小 fmax | 15.625 MHz | 15.625 MHz |
Base Number Matches | 1 | 1 |
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