F/FAST SERIES, OCTAL 1-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDIP24, 0.300 INCH, SLIM, CERDIP-24
| 参数名称 | 属性值 |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | R-GDIP-T24 |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
| 位数 | 1 |
| 功能数量 | 8 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 9.5 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.715 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8975402LX | 5962-89754023X | 5962-8975401KX | 5962-89754023A | 5962-89754013X | |
|---|---|---|---|---|---|
| 描述 | F/FAST SERIES, OCTAL 1-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CDIP24, 0.300 INCH, SLIM, CERDIP-24 | F/FAST SERIES, 8-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CQCC28, CERAMIC, QCC-28 | F/FAST SERIES, OCTAL 1-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, CDFP24, CERPACK-24 | F/FAST SERIES, 8-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, CQCC28, CERAMIC, QCC-28 | F/FAST SERIES, OCTAL 1-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, CQCC28, CERAMIC, LCC-28 |
| 包装说明 | DIP, | QCCN, | DFP, | QCCN, LCC28,.45SQ | QCCN, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | R-GDIP-T24 | S-CQCC-N28 | R-GDFP-F24 | S-CQCC-N28 | S-CQCC-N28 |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
| 位数 | 1 | 8 | 1 | 8 | 1 |
| 功能数量 | 8 | 1 | 8 | 1 | 8 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 28 | 24 | 28 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | TRUE | INVERTED | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | DFP | QCCN | QCCN |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | FLATPACK | CHIP CARRIER | CHIP CARRIER |
| 传播延迟（tpd） | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD | NO LEAD |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 座面最大高度 | 5.715 mm | - | 2.286 mm | - | 1.905 mm |
| 端子节距 | 2.54 mm | - | 1.27 mm | 1.27 mm | 1.27 mm |
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