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175-6-220P

产品描述Circuit Board Hardware - PCB MINI SMT TEST POINT
产品类别热管理产品   
文件大小254KB,共5页
制造商Wakefield-Vette
官网地址http://www.wakefield-vette.com/
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175-6-220P概述

Circuit Board Hardware - PCB MINI SMT TEST POINT

175-6-220P规格参数

参数名称属性值
产品种类
Product Category
Thermal Interface Products
制造商
Manufacturer
Wakefield-Vette
RoHSDetails
类型
Type
Thermally Conductive Insulator
MaterialKapton
长度
Length
0.71 in
宽度
Width
0.5 in
Thickness0.006 in
Breakdown Voltage6 kV
ColorGray
工厂包装数量
Factory Pack Quantity
1000
单位重量
Unit Weight
0.002751 oz

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WTS001_p50-68
6/14/07
10:46 AM
Page 64
Accessory
Products
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
120 SERIES
The
120 Series
Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with
a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable increase in case tem-
perature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal
Resistivity graph below).
TYPICAL VALUES FOR THERMAL RESISTANCE,
CASE TO SINK (Øcs) WHEN THERMAL JOINT
COMPOUNDS ARE USED
Typical
Mounting Torque Thermal
in inch • pounds Resistance
(N•M)
(°C/W)
8 (0.9)
0.09
9 (0.9)
0.14
8 (0.9)
15 (1.7)
30 (3.39)
75 (8.47)
125 (14.12)
600 (67.79)
0.50
0.16
0.10
0.07
0.07
0.052
120 SERIES - THERMAL JOINT COMPOUND
Characteristic
Volume Resistivity
Dielectric Strength
Specific Gravity
Thermal Conductivity @ 36°C
Thermal Resistivity (P)
Bleed, % after 24 hrs @ 200°C
Evaporation, % after 24 hrs @ 200°C
Color
Shelf life
Operating Temperature Range (°C)
Description
5 X 10
14
ohm-cm
225 volts/mil
2.1 min.
0.735 W/(m)(K)
5.1(Btu) (in.)/(hr)(ft
2
)(°F)
56 (°C)(in.)/watt
0.5
0.5
opaque white
5 years
-40/+200
Case Style Characteristics
T0-3
TO-66
TO-220
0.19 (4.8) stud x 0.44 (11.2) hex
0.25 (6.4) stud x 0.69 (17.5) hex
0.38 (9.7) stud x 1.06 (26.9) hex
0.50 (12.7) stud x 1.06 (26.9) hex
0.75 (19.1) stud x 1.25 (31.8) hex
120 SERIES - ORDER GUIDE
Series -
Container Size
P/N
120-SA
4 gram plastic pak
120-2
2 oz (0.06 kg) jar
120-5
5 oz (0.14 kg) tube
120-8
8 oz (0.23 kg) jar
120-80
5 lb (2.27 kg) can
120-320
20 lb (9.08 kg) can
HIGH PERFORMANCE THERMAL COMPOUND
122 SERIES
122 Series Thermal Joint Compound
is a stable, silicone based, thixotropic paste developed to provide premium
performance at an affordable price. It is formulated to significantly reduce contact thermal resistance where
power densities are concentrated in devices such as flip chip, reduced die size, and ‘overclock’ microprocessors.
When applied as a thin film between a Wakefield heat sink and device it possesses superior thermal conductivity
compared to traditional ‘grease’. It is compatible with automated or manual dispensing methods and is fully RoHS
compliant.
122 SERIES THERMAL JOINT COMPOUND
Typical Characteristics
Appearance
Thermal Conductivity
Thermal Resistance
Bleed
Evaporation
Volume Resistivity
Dielectric Strength
Specific Gravity
Operating Range
Shelf Life
122 SERIES - ORDER GUIDE
Series -
Container Size
P/N
122-10CC
10cc syringe
122-2
2 oz (0.06 kg) jar
122-30CC
30cc syringe
Description
Smooth Gray paste
2.5 W / m °K,
17.3 (Btu) (in.)/(hr) (ft
2
) (
0
F)
0.02 °C in 2 / W
0.015 wt%, 24 hrs at 200°C
0.150 wt%, 24 hrs at 200°C
1.4 x 10
10
ohm-cm
225 volts/mil
2.23 (gm/cc) at 25°C
-40°C to 205°C
5 years
64
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