Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D
2
PAK, TO-220, SOT-223, SOL-20
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with tin-lead plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Package
Format
Bulk
Tube
Tape & Reel
Package
Quantity
1
20
250
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
55°C @ 1W
55°C @ 1W
55°C @ 1W
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
217-36CT6
.390 (9.9)
217-36CTT6
.390 (9.9)
217-36CTR6
.390 (9.9)
Material: Copper, Tin, Lead Plated
MECHANICAL DIMENSIONS
217 HEAT SINK WITH
DDPAK DEVICE
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
125°C LEAD, 40°C AMBIENT
217-36CT6
Device Power Dissipation. W
KEY:
í
Device only, NC
v
Device + HS, NC
Device + HS, 100 lfm
Device + HS, 200 lfm
Device + HS, 300 lfm
SECTION A-A
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
TAPE DETAILS
REEL DETAILS
Dimensions: in.
All other products, please contact factory for price, delivery, and minimums.
30
Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D
2
PAK, TO-220, SOL-20
MECHANICAL DIMENSIONS
217 SERIES
BOARD LAYOUT RECOMMENDATIONS
TUBE DETAILS
TUBE: 16.25 Inches Long,
Min. ESDMaterial with Nail
Stops
20 Pieces per Tube
217-36CTT6
SOL 20
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
217-36CT6
Dimensions: in.
230 AND 234 SERIES
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
Footprint
Dimensions
in. (mm)
Mounting
Configuation
Vert./Horiz.
Vertical
Horizontal
Vertical
Vert./Horiz
Vertical
Horizontal
Solderable
Tab
Option
No Tab
01
05
10
No Tab
01
05
230-75AB-05
TO-220
Standard
P/N
Height Above
PC Board
in. (mm)
Mounting
Style
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
PATENT PENDING
230-75AB
.750 (19.1)
.570 (14.5) x .500 (12.7)
230-75AB-01
.750 (19.1)
.570 (14.5) x .500 (12.7)
230-75AB-05
.500 (12.7)
.750 (19.1) x .570 (14.5)
230-75AB-10
.875 (22.2)
.570 (14.5) x .500 (12.7)
234-75AB
.790 (20.0)
.570 (14.5) x .500 (12.7)
234-75AB-01
.790 (20.0)
.570 (14.5) x .500 (12.7)
234-75AB-05
.500 (12.7)
.790 (20.0) x .570 (14.5)
Material: Aluminum, Black Anodized
230-75AB-01
230-75AB-10
MECHANICAL DIMENSIONS
230 AND 234 SERIES
230 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
234 SERIES
234-75AB
234-75AB-01
234 SERIES
234-75AB-05
Dimensions: in. (mm)
Normally stocked
31
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
233 AND 236 SERIES
Self-Locking Wavesolderable Heat Sinks
Footprint
Dimensions
in. (mm)
Mounting
Solderable
Configuration Tab Options
Vert./Horiz.
Vertical
Horizontal
Vertical
Vert./Horiz
Vertical
Horizontal
Vetrical
No Tab
01
05
10
No Tab
01
05
10
Mounting
Style
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
TO-220
Standard
P/N
Height Above
PC Board
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
PATENT PENDING
233-60AB
.600 (15.2) .570 (14.5) x .500 (12.7)
233-60AB-01
.600 (15.2) .570 (14.5) x .500 (12.7)
233-60AB-05
.500 (12.7) .600 (15.2) x .570 (14.5)
233-60AB-10
.725 (18.4) .570 (14.5) x .500 (12.7)
236-150AB
1.500 (38.1) .570 (14.5) x .500 (12.7)
236-150AB-01
1.500 (38.1) .570 (14.5) x .500 (12.7)
236-150AB-05
.500 (12.7) 1.500 (38.1) x .570 (14.5)
236-150AB-10
1.625 (41.3) .570 (14.5) x .570 (12.7)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
233 AND 236 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
233-60AB-01
236-150AB-01
233-60AB-10
236-150AB-10
233-60AB-05
236-150AB-05
236-150AB
233-60AB
Dimensions: in. (mm)
275 AND 231 SERIES
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Footprint
Dimensions
in. (mm)
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (14.5)
.835 (21.2) x .400 (12.7)
.690 (17.5) x .835 (12.7)
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (14.5)
.750 (19.1) x .835 (12.7)
.835 (21.2) x .400 (12.7)
.835 (21.2 x .400 (12.7)
1.375 (34.9) x .835 (12.7)
.835 (21.2) x .400 (12.7)
TO-220
Standard
P/N
Height Above
PC Board
in. (mm)
.750 (19.1)
.750 (19.1)
.875 (12.7)
.690 (18.4)
.400 (38.1)
.690 (38.1)
.750 (12.7)
.400 (41.3)
.750 (34.9)
1.375 (10.2)
.400 (10.2)
1.375 (10.2)
Mounting
Solderable
Configuration Tab Options
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Horizontal
Vertical
Vert./Horiz.
Horizontal
Vertical
Vert./Horiz.
Horizontal
Vertical
No Tab
01
10
No Tab
13H
13V, 14V, 15V
No Tab
13H
13V, 14V, 15V
No Tab
13H
13V, 14V, 15V
Mounting
Style
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
44 C @ 2W
44°C @ 2W
44°C @ 2W
45°C @ 2W
45°C @ 2W
45°C @ 2W
43°C @ 2W
43°C @ 2W
43°C @ 2W
32°C @ 2W
32°C @ 2W
32°C @ 2W
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
8°C/W @ 400 LFM
8°C/W @ 400 LFM
8°C/W @ 400 LFM
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
5.9°C/W @ 400 LFM
5.9°C/W @ 400 LFM
5.9°C/W @ 400 LFM
PATENT 5381041
275-75AB
275-75AB-01
275-75AB-10
231-69PAB
231-69PAB-13H
231-69PAB-XXX
231-75PAB
231-75PAB-13H
(14V ) 231-75PAB-XXX
231-137PAB
231-137PAB-13H
(15V ) 231-137PAB-XXX
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB)
MECHANICAL
DIMENSIONS
275 AND 231 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
TAB 13H
All versions No Tab
TAB
14V
TAB
13V
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
TAB 01
TAB 10
TAB 15V
TAB 13H
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
32
Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
235 SERIES
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Vert./Horiz.
Vertical
Horizontal
Vertical
Solderable
Tab Options
No Tab
01
05
10
235 SERIES
TO-220
Standard
P/N
Mounting
Style
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
40°C @ 2W
40°C @ 2W
40°C @ 2W
40°C @ 2W
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
PATENT 5381041
235-85AB
.850 (21.6) 1.000 (25.4) x .500 (12.7)
235-85AB-01
.850 (21.6) 1.000 (25.4) x .500 (12.7)
235-85AB-05
.500 (12.7)
.850 (21.6) x1.000 (25.4)
235-85AB-10
.975 (24.8) 1.000 (25.4) x .500 (12.7)
Material: Aluminum, Black Anodized
235-85AB
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
235-85AB-05
235-85AB-01
235-85AB-10
Dimensions: in. (mm)
243 SERIES
Labor-Saving Clip-On Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Vert./Horiz.
Verl./Horiz.
Solderable
Tab Options
No Tab
No Tab
Mounting
Style
Clip
Clip
TO-220
Standard
P/N
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
50°C@ 2W
78°C@ 2W
4.5°C/W @ 400 LFM
8.2°C/W @ 400 LFM
243-1PAB
1.000 (25.4)
.800 (20.3) x .270 (6.9)
243-3PAB
.800 (20.3)
.800 (20.3) x .270 (6.9)
Material: Aluminum, Pre-anodized Black
MECHANICAL DIMENSIONS
243 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SECTION A-A
VIEW B-B
Dimensions: in. (mm)
239 SERIES
Snap-Down Self-Locking Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Vert./Horiz
Vertical
Vertical
Solderable
Tab Options
No Tab
03
04
Mounting
Style
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
TO-220
Standard
P/N
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
38°C @ 2W
38°C @ 2W
38°C @ 2W
6°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
PATENT PENDING
239-75AB
.750 (19.1)
1.120 (28.4) x .435 (11.0)
239-75AB-03
.750 (19.1)
1.120 (28.4) x .435 (11.0)
239-75AB-04
.750 (19.1)
1.120 (28.4) x .435 (11.0)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
239-75AB
239 SERIES
SECTION A-A
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
239-75AB-03
239-75AB-04
Dimensions: in. (mm)
Normally stocked
33
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
273 SERIES
Standard
P/N
Low-Cost, Low-Height Wavesolderable Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Vert./Horiz.
Vertical
Vertical
Solderable
Tab Options
No Tab
01
02
Mounting
Style
Mtg Hole
Mtg Hole
Mtg Hole
TO-218, TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
49°C @ 2W
49°C @ 2W
49°C @ 2W
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
273-AB
.375 (9.5)
.750 (19.1) x .750 (19.1)
273-AB-01
.375 (9.5)
.750 (19.1) x .750 (19.1)
273-AB-02
.375 (9.5)
.750 (19.1) x .750 (19.1)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
273 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
273-AB
273-AB-01
273-AB-02
Dimensions: in. (mm)
274 SERIES
Standard
P/N
274-1AB
274-1AB-01
274-1AB-02
274-2AB
274-2AB-01
274-2AB-02
274-3AB
274-3AB-01
274-3AB-02
281-1AB
281-2AB
Low-Cost, Low-Height Wavesolderable Heat Sinks
Height Above
PC Board
in. (mm)
.375 (9.5)
.375 (9.5)
.375 (9.5)
.500 (12.7)
.500 (12.7)
.500 (12.7)
.250 (6.4)
.250 (6.4)
.250 (6.4)
.375 (9.5)
.500 (12.7)
Footprint
Dimensions
in. (mm)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
274 SERIES
274-XAB-01
274-XAB-02
TO-220
Material: Aluminum,
Black Anodized
Mounting
Configuration
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vertical
Vertical
Solderable
Tab Options
No Tab
01
02
No Tab
01
02
No Tab
01
02
No Tab
No Tab
Mounting
Style
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
56°C @ 2W
8.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
274 SERIES
281 SERIES
Dimensions: in. (mm)
240 SERIES
Standard
P/N
Labor-Saving Twisted Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Vertical
Vertical
Solderable
Tab Options
22
22
Mounting
Style
Clip/Mtg Hole
Clip/Mtg Slot
TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
55°C @ 4W
55°C @ 4W
5.3°C/W @ 400 LFM
5.3°C/W @ 400 LFM
240-118ABH-22 1.180 (30.0)
1.000 (25.4) x .500 (12.7)
240-118ABS-22
1.180 (30.0)
1.000 (25.4) x .500 (12.7)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
240 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
240-118ABS-22
240-118ABH-22
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
34
Normally stocked
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