COM EXPRESS® COMPACT TYPE 6 MODULE
conga-TCA
-
COM Express Type 6 Entry-Level-Module
-
Intel
®
Atom
™
Dual Core Generation on 32nm
-
Only 3.5 Watt TDP on Intel
®
Atom
™
Processor N2600
-
HD video performance 2D/3D
-
Up to 4 GB DDR3 memory
Formfactor
CPU
Formfactor COM Express™ Compact | (95 x 95 mm) | Type 6 Connector Layout
Intel
®
Atom
™
Processors
Intel
®
Atom
™
D2550
Intel
®
Atom™ N2800
Intel
®
Atom
™
N2600
1.86 GHz Dual Core
1.86 GHz Dual Core
1.6 GHz Single Core
4 threads
4 threads
4 threads
L2 Cache 1MB
L2 Cache 1MB
L2 Cache 1MB
10W TDP
6.5W TDP
3.5W TDP
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
1 Socket SO-DIMM DDR3 up to 1066MT/s and 4 GByte
Intel® NM10 Express Chipset CG82NM10 PCH | TDP 2.1W
GBE Realtek 8111E
up to 5x PCIe | 2x Serial ATA II with 3 Gb/s
8x USB 2.0 | 2x USB 3.0 (optional | uses 1x PCIe lane) | LPC bus | I²C bus (fast mode | 400 kHz | multi-master)
Digital High Definition Audio Interface with support for multiple audio codecs
Integrated Grapics | supporting DirectX 9 | Pixel Shader v3.0 and OGL 3.0
Two independent display pipes
Support full MPEG2 (VLD/iDCT/MC) | WMV | Fast video Composing | HW decode/acceleration for MPEG4 (AVC/H.264) & VC-1; 720p60 | 1080i60
1080p@24 up to 20 Mps
Video Image enhancements
1x24 Bit LVDS (D2550) max. Resolution 1440x900
1x18 Bit LVDS (N2000 Series) max. Resolution 1366x768
Automatic Panel Detection via EDID/EPI
2x DisplayPort 1.1 / TMDS (DVI | HDMI 1.3a)
350 MHz RAMDAC | resolutions up to 1920x1200
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode | 400 kHz | multi-master) | Power Loss Control
AMI Aptio® UEFI 2.x firmware | 4 MByte serial SPI firmware flash
Trusted Platform Module (TPM) optional.
Hash and RSA algorithms | key lengths up to 2,048 bits | real random number generator
ACPI 3.0 with battery support
Microsoft® Windows 8 | Microsoft® Windows 7 | Linux | Microsoft® Windows® embedded Standard
Typ. application: tbd. | see manual for full details | CMOS Battery Backup
Operating: 0 .. +60°C
Storage: -20 .. +80°C
Storage: 5 - 95% r. H. non cond.
LVDS
Digital Display Interface (DDI)
CRT Interface
congatec Board Controller
Embedded BIOS Features
Security
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
Operating: 10 - 90% r. H. non cond.
95 x 95 mm (3.74” x 3.74”)
www.congatec.com
conga-TCA
| Block diagram
A-B
Fan Control
GPIs/GPOs
8x USB 2.0
2x SATA II
PCIe x1
If No USB 3.0
Gbit Ethernet
PCIe x1
PCIe x1
PCIe x1
SM Bus
PCIe x1
LPC
I²C
SPI
LVDS
HDA
CRT
(Flash)
BIOS
PCIe
Switch
PCIe GBE
RTL8111E
TPM
PCIe x1
SM Bus
PCIe x1
PCIe x1
Hardware
Monitoring
Watchdog
congatec
Board Controller
STM32F100R8
Intel
®
NM10
Express Chipset
GPIs/GPOs
SM Bus
PCIe2USB3
CG82NM10 PCH
DMI
Intel
®
Atom™
Processor
N2800
N2600
D2550
x2 (N2000)
x4 (D2000)
DDR3-SODIMM
max. 4 GByte
2x DP or HDMI
C-D
conga-TCA
| Order Information
Article
TCA/N2600
TCA/N2800
TCA/D2550
TCA/D2550 xHCI
TCA/HSP-T
TCA/HSP-B
TCA/CSP-T-LF
TCA/CSP-B-LF
TCA/CSP-T-HF
TCA/CSP-B-HF
DDR3-SODIMM-1066 (1GB)
DDR3-SODIMM-1066 (2GB)
DDR3-SODIMM-1066 (4GB)
PN
47001
47002
47003
47004
47032
47033
47030
47031
47034
47035
68750
68760
68765
Description
COM Express Type 6 Compact module with Intel® Atom™ N2600 dual core processor with 1.6GHz, 1MB L2 cache and 800 MT/s DDR3
memory interface.
COM Express Type 6 Compact module with Intel® Atom™ N2800 dual core processor with 1.86GHz, 1MB L2 cache and 1066MT/s
DDR3 memory interface.
COM Express Type 6 Compact module with Intel® Atom™ D2550 dual core processor with 1.86GHz, 1MB L2 cache and 1066MT/s
DDR3 memory interface.
COM Express Type 6 Compact module with Intel® Atom™ D2550 dual core processor with 1.86GHz, 1MB L2 cache and 1066MT/s
DDR3 memory interface. PCI Express to dual port USB 3.0 onboard controller.
Standard heatspreader for COM Express modules conga-TCA and CCA. All standoffs are M2.5 thread.
Standard heatspreader for COM Express modules conga-TCA and CCA. All standoffs are 2.7mm bore hole.
Standard passive cooling solution for COM Express modules conga-TCA and CCA with 3mm fins. All standoffs are M2.5mm thread.
Standard passive cooling solution for COM Express modules conga-TCA and CCA with 3mm fins. All standoffs are with 2.7mm bore
hole.
Standard passive cooling solution for COM Express module conga-TCA and CCA with 10mm fins. All standoffs are M2.5mm thread.
Standard passive cooling solution for COM Express module conga-TCA and CCA with 10mm fins. All standoffs are 2.7mm bore hole.
DDR3 SODIMM memory module with 1066MT/s and 1GB RAM.
DDR3 SODIMM memory module with 1066MT/s and 2GB RAM.
DDR3 SODIMM memory module with 1066MT/s and 4GB RAM.
Accessories
conga-TEVAL
conga-LDVI/EPI
COM-Express-carrier-
board-Socket-5
COM-Express-carrier-
board-Socket-8
065800
011115
400007
400004
Evaluation carrier board for Type 6 COM-Express-modules
LVDS to DVI converter board for digital flat panels with onboard EEPROM
Connector for COM-Express carrier boards | height 5mm | packing unit 4 pieces
Connector for COM-Express carrier boards | height 8mm | packing unit 4 pieces
© 2014 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. Novbember 04, 2014 MR
2x USB 3.0
optional
Memory Types
(up to 1066MTs)
www.congatec.com
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