CTS
®
W±0.01
With pre-applied adhesive, just peel
off the release liner and press onto the
component
Reduces assembly costs; no more
messy adhesives or greases required
Excellent mechanical bond
Thermally optimized pin fin
Omnidirectional
Adhesive shear strength at 100°C is
36psi (a one inch square heat sink would
require a 36lb. force to remove heat sink)
Applicable for BGA, PGA, PLCC,
and QFP packages
L±0.01
G±0.01
P±0.01
H±0.015
T±0.01
SIZE
PART NUMBER***
PIN FIN CONFIGURATION
THERMAL RESISTANCE CASE
TO AMBIENT* °C/WATTS
NATURAL
CONVECTION**
26.9
24.5
26.4
20.8
20.9
18.5
19.6
16.5
16.1
14.9
16.2
13.1
15.1
11.9
13.5
10.6
11.5
10.8
8.1
9.9
8.5
FORCED
CONVECTION
@ 400 LFPM
9.6
7.7
8.0
6.3
7.2
5.7
6.8
5.2
6.0
4.7
5.6
4.2
4.5
3.8
4.5
3.5
3.8
3.5
2.8
2.9
2.6
(W)
BDN09-3CB/A01
BDN09-6CB/A01
BDN10-3CB/A01
BDN10-5CB/A01
BDN11-3CB/A01
BDN11-6CB/A01
BDN12-3CB/A01
BDN12-5CB/A01
BDN13-3CB/A01
BDN13-5CB/A01
BDN14-3CB/A01
1.41
1.31
1.21
1.11
1.01
0.91
(L)
0.91
(H)
.355
.605
T
.09
.10
.09
.10
.09
.10
.09
.10
.09
.10
.09
.10
.09
.10
.09
.10
.09
.09
.10
.09
.09
P
.069
.132
.083
.111
.076
.119
.060
.105
.074
.125
.067
.128
.062
.118
.072
.119
.065
.072
.128
.069
.064
G
.072
.128
.072
.114
.072
.128
.081
.114
.081
.114
.081
.128
.081
.114
.081
.128
.072
.072
.114
.072
.072
FIN
MATRIX
7x7
4x4
7x7
5x5
8x8
5x5
9x9
6x6
9x9
6x6
10x10
6x6
11x11
7x7
11x11
7x7
13x13
13x13
8x8
14x14
16x16
1.01
.355
.555
1.11
.355
.605
1.21
.355
.555
1.31
.355
.555
1.41
.355
.605
NOTES:
BDN14-6CB/A01
BDN15-3CB/A01
BDN15-5CB/A01
BDN16-3CB/A01
BDN16-6CB/A01
BDN17-3CB/A01
BDN18-3CB/A01
BDN18-6CB/A01
BDN19-3CB/A01
BDN21-3CB/A01
1.91
2.11
1.91
2.11
1.71
1.81
1.71
1.81
1.61
1.61
1.51
1.51
*
Thermal resistance
of adhesive tape is
included.
.355
.555
.355
.605
.355
.355
.605
.355
.355
**
Thermal resistance
values based on
power density of
3 watts/in
2
***
Part numbers
listed for standard
black anodized
heat sinks with
CTS adhesive
tapes.
6
All dimensions are in inches.