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conga-TC87-CSP-T

产品描述Heat Sinks Standard passive cooling solution for COM Express module conga-TC87 with 20mm high cooling fins. All stand-offs are M2.5mm threaded.
产品类别热管理产品   
文件大小935KB,共2页
制造商congatec
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conga-TC87-CSP-T概述

Heat Sinks Standard passive cooling solution for COM Express module conga-TC87 with 20mm high cooling fins. All stand-offs are M2.5mm threaded.

conga-TC87-CSP-T规格参数

参数名称属性值
产品种类
Product Category
Heat Sinks
制造商
Manufacturer
congatec
RoHSDetails
产品
Product
Heat Sinks
Designed forconga-TC87
工厂包装数量
Factory Pack Quantity
1

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FAST AND COMPACT
conga-TC87
-
4
th
Gen. Intel
®
Core
i7 dual core processor
-
3x DisplayPort 1.2, up to 4k resolution
-
Intel
®
AVX 2.0 Vector extension for improved floating
point computing
-
COM Express Compact Type 6 module
Formfactor
CPU
COM Express
®
Compact, (95 x 95 mm), Type 6 Connector Layout
Intel
®
Core
i7-4650U
Intel
®
Core
i5-4300U
Intel
®
Core
i3-4010U
Intel
®
Celeron
®
2980U
1.7 GHz Dual Core
1.9 GHz Dual Core
1.7 GHz Single Core
1.6 GHz Single Core
Turbo Boost 3.3 GHz cache 4MB
Turbo Boost 2.9 GHz cache 3MB
cache 3MB
cache 3MB
15W TDP configurable to 11.5W, AES-NI, AVX2, AMT 9.5, TXT
15W TDP configurable to 11.5W, AES-NI, AVX2, AMT 9.5, TXT
15W TDP AES-NI, AVX2
15W TDP
Intel
®
Turbo Boost Technology, Intel
®
Hyper-Threading Technology (Intel
®
HT Technology), Intel
®
Advanced Vector Extensions 2.0 (Intel
®
AVX2),
Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI), Integrated dual channel memory controller, up to 25.6 GByte/sec. memory
bandwidth, Integrated Intel
®
HD Graphics 5000 series with dynamic frequency up to xxGHz, Intel
®
Clear Video HD Technology
Intel
®
Virtualization Technology (Intel
®
VT), Intel
®
Trusted Execution Technology (Intel
®
TXT), Intel
®
Streaming SIMD Extensions 4.2 (Intel
®
SSE4.2),
PCLMULQDQ Instruction, Intel
®
Secure Key, Intel
®
Transactional Synchronization Extensions (Intel
®
TSX)
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
LVDS
(eDP optional)
Digital Display Interface (DDI)
congatec Board Controller
Embedded BIOS Features
Security
2 Sockets, SO-DIMM DDR3L@1.35V up to 1600MT/s and 16GByte
Integrated mobile Intel
®
8 Series Chipset: Intel
®
QM87 / HM86 @ planned Celeron variants
Intel
®
I218-LM GbE LAN Controller with AMT 9.5 support
4x PCI Express™ GEN. 2.0 lanes, 4x Serial ATA
®
RAID 0/1/5/10 support,
2x ExpressCard
®
, 2x USB 3.0 (XHCI), 8x USB 2.0 (EHCI), LPC bus, I²C bus (fast mode, 400 kHz, multi-master)
Digital High Definition Audio Interface with support for multiple audio codecs
Next Generation Intel
®
HD Graphics with OpenCL 1.2, OpenGL 4.0 and DirectX11.1 support; up to three independent displays: HDMI 1.4, DVI,
DisplayPort 1.2; High performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface, VESA mappings, resolutions up to 1920x1200, Automatic Panel Detection via
EDID/EPI
2x TMDS (HDMI) / DisplayPort 1.2a with daisy chaining, resolutions up to 4k
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast
mode, 400 kHz, multi-master), Power Loss Control
AMI Aptio
®
UEFI 2.x firmware, 8 MByte serial SPI firmware flash
The conga-TC87 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algo-
rithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce
will benefit also with improved authentication, integrity and confidence levels.
ACPI 4.0 with battery support
Microsoft
®
Windows 8, Microsoft
®
Windows 7, Linux, Microsoft
®
Windows embedded Standard
Typ. application: tbd., see User’s Guide for full details, CMOS Battery Backup
Ultra low standby power, support for CPU power states up to C10
Operating: 0 .. +60°C
Storage: -20 .. +80°C
Storage: 5 - 95% r. H. non cond.
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
Operating: 10 - 90% r. H. non cond.
95 x 95 mm (3.74” x 3.74”)
www.congatec.com

conga-TC87-CSP-T相似产品对比

conga-TC87-CSP-T conga-TC87-i3-4010U conga-TC87-i7-4650U conga-TC87-CSP-B
描述 Heat Sinks Standard passive cooling solution for COM Express module conga-TC87 with 20mm high cooling fins. All stand-offs are M2.5mm threaded. Computer-On-Modules - COM COM EXPRESS TYPE 6 INTEL CORE i5-4010U Computer-On-Modules - COM COM EXPRESS TYPE 6 INTEL CORE i7-4650U Development Boards u0026 Kits - x86 EVAL CARRIER BOARD COM EXPRESS TYPE 6
产品种类
Product Category
Heat Sinks Computer-On-Modules - COM Computer-On-Modules - COM Heat Sinks
制造商
Manufacturer
congatec congatec congatec congatec
RoHS Details Details Details Details
工厂包装数量
Factory Pack Quantity
1 1 1 1
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