SD/ SDIO/ MMC MEMORY CARD BRIDGE
| W86L488 | W86L488AY | W86L488Y | |
|---|---|---|---|
| 描述 | SD/ SDIO/ MMC MEMORY CARD BRIDGE | SD/ SDIO/ MMC MEMORY CARD BRIDGE | SD/ SDIO/ MMC MEMORY CARD BRIDGE |
| 是否无铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | - | 符合 | 符合 |
| 厂商名称 | - | Winbond(华邦电子) | Winbond(华邦电子) |
| 零件包装代码 | - | QFN | QFN |
| 包装说明 | - | VQCCN, LCC64,.35SQ,20 | VQCCN, LCC48,.27SQ,20 |
| 针数 | - | 64 | 48 |
| Reach Compliance Code | - | compli | compli |
| 其他特性 | - | ALSO OPERATES AT 2.7V MINIMUM SUPPLY | ALSO OPERATES AT 2.7V MINIMUM SUPPLY |
| JESD-30 代码 | - | S-XQCC-N64 | S-XQCC-N48 |
| JESD-609代码 | - | e3 | e3 |
| 长度 | - | 9 mm | 7 mm |
| 端子数量 | - | 64 | 48 |
| 最高工作温度 | - | 70 °C | 70 °C |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | - | VQCCN | VQCCN |
| 封装等效代码 | - | LCC64,.35SQ,20 | LCC48,.27SQ,20 |
| 封装形状 | - | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | - | 260 | 260 |
| 电源 | - | 2.5/3.3,3/3.3 V | 2.5/3.3,3/3.3 V |
| 认证状态 | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1 mm | 1 mm |
| 最大供电电压 | - | 3.6 V | 3.6 V |
| 最小供电电压 | - | 3 V | 3 V |
| 标称供电电压 | - | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | YES |
| 技术 | - | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | - | NO LEAD | NO LEAD |
| 端子节距 | - | 0.5 mm | 0.5 mm |
| 端子位置 | - | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 |
| 宽度 | - | 9 mm | 7 mm |
| uPs/uCs/外围集成电路类型 | - | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| Base Number Matches | - | 1 | 1 |
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